BARCELONA, Spain, Feb. 26, 2013 /PRNewswire/ -- The global leading supplier of wireless modules, Shanghai SIMCom Wireless Solutions Limited, launched its first compact LGA 2G module SIM900E at GSMA Mobile World Congress 2013 today. The module's super small size and LGA encapsulation suit M2M applications of all sizes, especially satisfying requirements for slim, compact design.
With operations from 2002 to 2013, SIMCom has just celebrated its 10th anniversary. The company has developed into a global leader of wireless solutions with the integration of R&D, production, sales and after-sales services, and with products covering technologies such as GSM/GPRS, WCDMA/HSPA, TD-SCDMA, CDMA EVDO, SRD, GPS, Glonass, WIFI, etc. The products have been well sold in over 100 countries and regions, involving almost all M2M industries. With the celebration of its 10th anniversary, SIMCom is pleased to announce the formal launch of its first company magazine, SIMCom Inside.
The compact module SIM900E released today has an LGA encapsulation of 19.8*19.8*2.7mm, satisfying customers' requirements for compact design, and its LGA encapsulation is suitable for automatic assembly with SMT equipment. The configuration of four frequencies of GSM/GPRS – 850/900/1800/1900MHz – and wide temperature range of -40C to +85C is ideal for global seamless coverage and various industrial application environments.
SIMCom also launched its module series of 2G/3G, with the same size of 30mm*30mm, including SIM928, SIM968, SIM5310 and more. Integrated with GSM/GPRS and GPS, the SIM928 module is a compact Quad-Band GSM/GPRS-enabled module base on the PNX4851 platform. SIM968 is a combo module featuring Quad-Band GSM/GPRS and combining GLONASS technology for satellite navigation. SIM5310 is a low-cost 3G module that supports WCDMA 384Kbps and single frequency band 2100 MHz. In addition, SIMCom will also introduce the first LTE intelligent module SIM7290. For more information or to subscribe to SIMCom Inside, please visit their booth at 6B100, Hall 6.
Attendees are also sincerely invited to visit SIMCom's booths at Embedded World 2013 in Nuremberg, Germany (Exhibition Centre Nuremberg, Booth No. 4-444K, M2M area, February 26-28), the New Electronics Show 2013 in Moscow, Russia, (March 26-28) and at CTIA Wireless 2013 in Las Vegas, Nevada, USA (Booth No.: 5339) from May 21-23.