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Supermicro® stellt auf der SEG 2014 den neuen X10 6U 28x DP E5-2600 v3 MicroBlade und 1U 3x GPU SuperServer® für geophysische Exploration aus
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Super Micro Computer, Inc.

Oct 26, 2014, 10:00 ET

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-- Hochdichte Computerplattformen mit extremer Leistung, Effizienz und Skalierbarkeit

DENVER, 26. Oktober 2014 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), ein Weltmarktführer bei Hochleistungsservern mit hoher Effizienz, Speichertechnologie und Green Computing stellt seine neusten X10 High Performance Computing (HPC) Lösungen auf der Society of Exploration Geophysicists (SEG 2014) International Conference in dieser Woche in Denver, Colorado, aus. Der neue 6U 28x Dual-Prozessor-(DP)-Knoten MicroBlade von Supermicro unterstützt 56x 120 W Intel® Xeon® E5-2600 v3 Prozessoren und ist zum ersten Mal auf der Messe zu sehen. Es handelt sich um eine hochdichte Computerlösung (bis zu 196 DP Server und 28 10 Gb/s/40 Gb/s Switches in 42U), die das Management vereinfacht, die Ausrollungskosten insgesamt reduziert, ohne jedoch Abstriche bei der Leistung zu machen. Ebenso werden auf der Messe die NVIDIA® Tesla® GPU und Intel® Xeon Phi™, auf Coprozessoren basierenden Plattformen von Supermicro in 1U, 2U SuperServer®, 4U/Tower und 7U SuperBlade® Plattformen vorgestellt, einschließlich einer Live-Demonstration des alle Rekorde brechenden 2U Hyper-Speed Ultra SuperServer, der Dual Intel Xeon E5-2600 v3 Prozessoren (bis zu 160 W), 4x doppelt breite GPU oder Xeon Phi Coprozessoren und 8x 3,5" Hot-swap SAS3 12 Gb/s plus 4x 2,5" Hot-swap NVMe SSDs unterstützt.

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„Supermicros neuer MicroBlade, der 28 Dual-Prozessorknoten unterstützt, ist die jüngste Weiterentwicklung unserer Mikroserverarchitektur mit extremer Dichte", sagte Charles Liang, President und CEO von Supermicro. „Durch die Kombination der größten Vorteile unserer Erfahrung mit DP-Servern mit unserer Bladearchitektur sind wir jetzt in der Lage, eine hochleistungsfähige Computing-Lösung anzubieten, welche die Leistung pro Watt, pro Quadratfuß maximiert und Kosteneinsparungen bietet, und gleichzeitig in einem einzigen 6U-Chassis die Verkabelung bis zu 99 % reduziert. Der neue Server erweitert unsere wachsende Produktlinie von umweltfreundlichen Supercomputing-Plattformen für die wissenschaftliche Forschung und er bietet Lösungen, die auf den besten Technologien aufbauen und höchste Leistung bei bisher unerreichter Energieeffizienz liefern."

Foto - http://photos.prnewswire.com/prnh/20141024/154282-INFO

Höhepunkte der Ausstellungsstücke

  • 6U X10 MicroBlade
    • Neues DP-Modul (MBI-6128R-T2)
      Dual Intel Xeon E5-2600 v3 (bis zu 120 W), 8x VLP DDR4 RDIMMs (bis zu 2133 MT/s), 2x 2,5" 6 Gb/s SATA3 HDDs/SSDs, Onboard Quad-Port 1 GbE NIC, 1x SATA-DOM
    • Neues UP-Modul (MBI-6118D-T2/-T4)
      Intel Xeon E3-1200 V3 (bis zu 82 W), bis zu 32 GB ECC DDR3 1600/1333 MHz VLP UDIMM in 4x DIMMs, 2x 3,5 SATA3 HDD (-T2 SKU), 4 x 2,5 STAT3 HDD/SSD (-T4 SKU), Onboard 2x GbE Netzwerkkommunikation
    • (MBI-6418A-T7H/T5H)
      1x Intel® Atom™ C2750 (8-Kern, 2,4 GHz) (-T7H SKU) oder 1x Intel® Atom™ C2550 (4-Kern, 2,4 GHz) (-T5H SKU), 2x 2,5 Gb/s Netzwerkkonnektivität pro Knoten, bis zu 32 GB ECC DDR3 1600/1333 MHz SO-DIMM in 2x DIMM Steckplätzen pro Knoten, 1x 2,5" 6 Gb/s SATA3 HDD/SSD und 1x SATA3 DOM pro Knoten
  • 2U Ultra (Hyper-Speed) SuperServer® (SYS-6028UX-TR4)
    Dual Intel Xeon E5-2600 v3 (bis zu 160 W), bis zu 1,5 TB ECC, bis zu DDR4 2133 MHz in 24x DIMMs, 12x Hot-swap 3,5" Laufwerkschächte (standardmäßig 10x SATA3 Ports, optional 8x SAS3 12 Gb/s und 4x NVMe Ports), 3x NVIDIA Tesla K40 und 1x NVIDIA® Quadro® K5200 GPUs, 4x GbE LAN, redundante 1000 W Titanium Level High-Efficiency (96 % +) digitale Stromversorgung
  • Neue 1U X10 UP SuperServer® (SYS-5018GR-T)
    Single Intel Xeon E5-2600 v3, 8x DIMMs bis zu 512 GB ECC LRDIMM, 256 GB ECC RDIMM, DDR4, bis zu 2133 MHz, 3x Hot-swap 3,5" Laufwerkschächte, 2x Intel Xeon Phi 7120P Coprozessoren, 1400 W Platinum Level High-Efficiency (94 % +) Stromversorgung
  • 1U 3x GPU/Xeon Phi Coprozessor SuperServer® (1028GR-TR)
    Dual Intel® Xeon® E5-2600 v3 (bis zu 145 W), bis zu 1 TB ECC, bis zu DDR4 2133 MHz in 16x DIMMs, 4x Hot-swap 2,5" SATA3 Laufwerkschächte, 3x NVIDIA Tesla K40 GPUs, Dual-Port GbE LAN, redundante 1600 W Platinum Level High-Efficiency (94 %) digitale Stromversorgung
  • 4U/Tower 4x GPU/Xeon Phi Coprozessor SuperServer® (SYS-7048GR-TR)
    Dual Intel Xeon E5-2600 v3 (bis zu 160 W), bis zu 1 TB ECC DDR4 2133 MHz in 16x DIMMs, 8x 3,5" Hot-swap, 3x feste 5,25" Laufwerkschächte und 1x fester 3.5" Laufwerkschacht, 4x Intel Xeon Phi 7120P Coprozessoren, optional Thunderbolt 2.0 AOC, 1x PCI-E 2.0 x4 (in x8) Slot, 4x Hochleistungsventilatoren, 2x Abluftventilatoren, redundante 2000 W Platinum Level High-Efficiency (94 %) digitale Stromversorgung
  • 2U EX DP 32 DIMM (SYS-2028UT-BTNRT)
    Dual Intel® Xeon® Prozessor E7-8800 v2 / E7-4800 v2 / E7-2800 v2 Familie (15-Kern), 2x 2,5" NVMe HDD Schächte und 8x Hot-swap 2,5" SATA3 HDD Schächte, bis zu 2 TB ECC DDR3, bis zu 1600 MHz in 32x DIMMs, 2x PCI-E 3.0 x16 FH/HL Slots, 1x PCI-E 3.0 x8 MicroLP Karte, Dual 10 GBase-T Ports, redundante 1280 W Platinum Level High-Efficiency (95 % +) digitale Stromversorgung
  • 7U SuperBlade®
    • 3x NVIDIA Tesla GPU Blade (SBI-7127RG3)
      Dual Intel Xeon Prozessor E5-2600 v2, bis zu 512 GB RDIMM oder 64 GB UDIMM in 8x DIMMs, 3x NVIDIA Tesla Kepler K20X/K40x SXM GPUs, 1x SSD oder 1x SATA-DOM, Dual-Port GbE LAN, FDR/QDR InfiniBand, 10 GbE
    • 2x NVIDIA Tesla GPU/Intel Xeon Phi Coprocessor Blade (SBI-7127RG-E)
      Dual Intel Xeon Prozessor E5-2600 v2, bis zu 256 GB RDIMM oder 64 GB UDIMM in 8x DIMMs, 1x SSD oder 1x SATA-DOM, Dual-Port GbE LAN, FDR/QDR InfiniBand, 10 GbE/FCoE
    • TwinBlade® (SBI-7228R-T2F/T2X)
      Zwei Knoten in einem Prozessor-Blade. Jeder Knoten unterstützt Dual Intel Xeon E5-2600 v3 (bis zu 145 W), bis zu 512 GB reg. ECC LRDIMM, Dual-Port GbE LAN, 2x 2,5" Hot-swap SATA3 Laufwerkschächte, FDR InfiniBand Onboard (-T2F SKU) oder 10 GbE Onboard (-T2X SKU)
    • Prozessor-Blade (SBI-7147R-S4X/S4F)
      Quad Intel® Xeon® E5-4600 v2 Prozessoren, bis zu 1 TB LRDIMM, 512 GB RDIMM oder 128 GB UDIMM in 16x DIMMs, 4x 2,5" Hot-swap SAS HDD Schächte, SAS2 RAID 0, 1, 10, Dual-Port GbE LAN, Mellanox ConnectX-3 Pro EN Dual-Port IC 10 GbE (-S4X SKU) oder Mellanox ConnectX-3 Single-Port FDR 56 Gbps InfiniBand, 40/10 GbE Unterstützung (-S4F SKU)
    • Prozessor-Blade (SBI-7128R-C6)
      Dual Intel Xeon Prozessor E5-2600 v2, bis zu 1 TB LRDIMM, 512 GB RDIMM oder 128 GB UDIMM in 16x DIMMs, 6x 2,5" Hot-swap HDD/SSD Schächte, bis zu 3x NVMe (Option), HW RAID 0, 1, 5, 2 G Cache, Dual-Port GbE LAN, FDR/QDR InfiniBand oder 10 GbE Mezzanin HCA

Besuchen Sie Supermicro auf der Society of Exploration Geophysicists (SEG 2014) in Denver, Colorado, vom 26. bis 31. Oktober im Colorado Convention Center, Stand #1697. Weitere Informationen über die vollständige Palette an hochleistungsfähigen, hoch effizienten Server-, Speicher- und Netzwerklösungen von Supermicro finden Sie auf www.supermicro.com.

Folgen Sie Supermicro für die neuesten Nachrichten und Ankündigungen auf Facebook und Twitter.

Über Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), der führende Wegbereiter im Bereich hochleistungsfähiger und hocheffizienter Servertechnologie, zählt weltweit zu den führenden Anbietern von fortschrittlichen Server Building Block Solutions® für Rechenzentren, Cloud Computing, Unternehmens-IT, Hadoop/Big Data, HPC sowie eingebetteten Systemen. Im Rahmen der "We Keep IT Green®"-Initiative engagiert sich Supermicro für den Umweltschutz und bietet Kunden die energieeffizientesten und umweltfreundlichsten Lösungen am Markt.

Supermicro, Building Block Solutions und We Keep IT Green sind Warenzeichen und/oder eingetragene Warenzeichen von Super Micro Computer, Inc.

Alle anderen Marken, Namen und Warenzeichen sind Eigentum der jeweiligen Inhaber.

SMCI-F

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