Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die designs
Key Highlights
SUNNYVALE, Calif., July 27, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at the 2026 DAC Chips to Systems Conference, expanded collaborations with Intel Foundry with the certification of AI-powered EDA flows on Intel 14A process technology, advancing design enablement from design technology co-optimization (DTCO) to system-aware co-design, building on its certified and production-ready EDA flows and IP portfolio for Intel 18A and Intel 18A-P technologies. As AI and high-performance computing designs move beyond monolithic scaling, success requires connecting process technology with AI-powered EDA flows, multi-die design, integrated multiphysics analysis, and broad IP portfolio to accelerate system-level realization.
"Angstrom-scale design is no longer only about extracting more power, performance, and area from a process node. It is about turning process innovation into predictable system-level outcomes," said Michael Buehler-Garcia, Senior Vice President at Synopsys. "Together with Intel Foundry, Synopsys is helping customers accelerate convergence, reduce late-stage rework, and achieve first-pass silicon success. We applaud the Intel Foundry team for their progress on Intel 14A to expand the capabilities of advanced semiconductor manufacturing."
"In this increasingly AI-driven world, Intel Foundry is committed to supporting our customers by accelerating innovation and providing predictable execution from silicon to packaging on our most advanced technologies," said Shawn Han, SVP and GM, Foundry Services, Intel Corporation. "Our wide-ranging collaboration with Synopsys, including AI-driven, certified flows and IP, gives our customers greater ease of use and confidence to achieve their design goals."
System-Aware Co-Design: EDA Meets Multiphysics
At angstrom-scale geometries with backside power delivery and dense 3D integration, electrical, thermal, and mechanical effects can no longer be effectively analyzed in isolation. Synopsys is uniquely positioned to address this challenge with the integration of Synopsys certified, AI-powered implementation and signoff flows and multiphysics analysis — including power integrity, thermal, and electromagnetic solutions on Intel 14A.
Enabling the Multi-Die Era
With multi-die design now mainstream in AI and HPC, Synopsys and Intel Foundry are extending their proven collaboration to enable efficient system-level integration, analysis, and optimization of advanced chiplet-based architectures. The Synopsys reference design flow based on 3DIC Compiler supports Intel Embedded Multi-die Interconnect Bridge (EMIB) and Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology, with early bump and TSV planning, automated UCIe and HBM routing, and unified multiphysics analysis across dies. Designers can analyze and optimize power delivery networks, thermal gradients, and signal integrity concurrently across die, Intel EMIB and EMIB-T interconnect, and package, catching system-level issues at design time rather than after tapeout.
Advancing Ecosystem Readiness with Broad IP Portfolio Across Intel 18A, Intel 18A-P and Intel 14A
Synopsys and Intel Foundry continue to enable AI and HPC innovation with Synopsys' expanding portfolio of high-performance interface and foundation IP available today for Intel 18A and Intel 18A-P while expanding to support Intel 14A technologies, helping reduce integration risk and accelerate time-to-tapeout for complex SoCs and multi-die designs. New titles optimized for Intel 14A include:
Resources
Join Synopsys at the 2026 DAC Chips to Systems Conference
Attendees can visit the Synopsys' booth #631 for demonstrations of the latest solutions and collaborations. For a complete list of Synopsys sessions and activities at DAC 2026, visit the Synopsys DAC 2026 event page.
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.
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Forward-Looking Statements
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SOURCE Synopsys, Inc.
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