Technological Giants Fast Forward to Success through New Product Introductions and Portfolio Expansions - Research Report on Broadcom, Maxim Integrated, Vishay Intertechnology, IR and ST

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Jul 17, 2013, 08:00 ET from Wall Street Reports

NEW YORK, July 17, 2013 /PRNewswire/ --

Today, Wall Street Reports announced new research reports highlighting Broadcom Corp. (NASDAQ: BRCM), Maxim Integrated Products Inc. (NASDAQ: MXIM), Vishay Intertechnology Inc. (NYSE: VSH), International Rectifier (NYSE: IRF) and STMicroelectronics NV (NYSE: STM). Today's readers may access these reports free of charge - including full price targets, industry analysis and analyst ratings - via the links below.

Broadcom Corp. Research Report

On July 10, 2013, Broadcom Corp. (Broadcom) announced that its Near Field Communication (NFC) and Wi-Fi technology is powering Brother's new NFC printers. According to Broadcom, the integration of NFC into Brother's multi-function printers shows how the power of NFC is being adopted by a broader range of consumer electronic devices. Shogo Suzuki, General Manager, Electronic System Development Dept., Brother Industries, LTD., "We are thrilled to introduce NFC-enabled printers to our customers. This represents a huge step in bringing this transformative technology to new consumer electronic devices with significant and positive changes to the overall user experience. Broadcom's demonstrated success in all corners of connectivity make it a prime partner to serve as the foundation of our next generation of printers, delivering the performance and quality required to drive new experiences." The Full Research Report on Broadcom Corp. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: []


Maxim Integrated Products Inc. Research Report

On July 10, 2013, Maxim Integrated Products Inc. (Maxim) announced that it is now sampling the MAX31850/MAX31851, cold-junction-compensated, 1-Wire thermocouple-to-digital converters. As per Maxim, the devices achieve ±2.0°C accuracy while integrating all of the functions required for a complete thermocouple-to-digital solution. Maxim's Senior Business Manager of Thermal Management Products, Amy Gebrian said, "The digitization of thermocouple signals poses a unique design challenge, especially when a large number of thermocouples are involved. The MAX31850/MAX31851 greatly ease design effort and minimize system wiring by integrating a complete thermocouple digitizer circuit and a single wire interface into one IC." The Full Research Report on Maxim Integrated Products Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: []


Vishay Intertechnology Inc. Research Report

On July 11, 2013, Vishay Intertechnology Inc. (Vishay) announced that it has extended its offering of TrenchFET Gen III p-channel power MOSFETs with new -40 V and -30 V devices offered in the PowerPAK 1212-8 and PowerPAK 1212-8s packages. The Company claimed that Vishay Siliconix is the first -40 V p-channel Gen III device, while the SiSS27DN is the first -30 V MOSFET in the PowerPAK 1212-8S package. Further, the Company stated that the SiS443DN and SiSS27DN are 100 % Rg- and UIS-tested and the MOSFETs are halogen-free according to the JEDEC JS709A definition and compliant to RoHS Directive 2011/65/EU. Vishay also claimed that the devices' industry-low on-resistance allows designers to achieve lower voltage drops in their circuits and promote more efficient use of power and longer battery run times. The Full Research Report on Vishay Intertechnology Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: []


International Rectifier Research Report

On July 10, 2013, International Rectifier (IR) introduced its radiation hardened ML Series dual output DC-DC power converter platform designed for RF communication equipment such as low noise amplifiers (LNA), receivers and frequency converters used onboard satellites. According to Tiva Bussarakons, Marketing Director, IR's HiRel Business Unit, "The ML series is a full-feature turn-key electronic power conditioner (EPC). Ready for system use without the need for additional engineering resources, this new platform significantly reduces overall program cost and design effort for satellite manufacturers." IR said that its ML Series features output sequencing usually required by RF-circuitries and isolated telemetry/telecommand for compliant satellite telemetry/telecommand systems without the need for additional components. The Full Research International Rectifier - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: []


STMicroelectronics NV Research Report

On July 11, 2013, STMicroelectronics NV (ST) announced the availability of its STA333IS, a powerful dense single-chip audio system, which measures only 2.57mmx3.24mm and delivers up to 2x20W of audio output power. ST stated that the STA333IS extends its SoundTerminalfamily, combining advanced process and chip-scale package technologies with digital audio IP such as ST's proprietary FFX full flexible amplification. ST also announced the availability of STA333SML, a variant for "micro-less" applications which operates without external microcontrollers, enabling designers to create digital amplifiers with the lowest cost of ownership. The Company informed that STA333IS and STA333SML are available now as 5x6-bump 0.5mm-pitch Chip-Scale Package (CSP) devices, priced from $1.00 for orders over 1,000 pieces. The Full Research Report on STMicroelectronics NV- including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: []



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