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TriLumina führt rückseitig emittierendes 3-W-Flip-Chip-VCSEL-Array zur Oberflächenmontage ohne Montagebasis ein
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TriLumina Logo (PRNewsfoto/TriLumina)

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TriLumina

Nov 21, 2019, 12:07 ET

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Gerät ermöglicht niedrigste Kosten, kleinste Baugröße und höchste Leistung für Mobilgeräte

ALBUQUERQUE, New Mexico, 21. November 2019 /PRNewswire/ -- TriLumina®, führender Entwickler von Flip-Chip-VCSEL-Lasertechnologie für 3D-Sensoren (VCSEL – abstimmbare Lichtleiter-Laser für alle drei faseroptischen Fenster), gibt die Einführung des weltweit ersten, rückseitig emittierenden Flip-Chip-3-W-VCSEL zur Oberflächenmontage und ohne Erfordernis von Baugruppen-Montagebasis oder Bonddraht für mobile 3D-Sensorkameras bekannt. Diese neue VCSEL-on-Board-Technologie (VoB) ermöglicht höhere Leistung, geringere Größe und niedrigere Kosten und vereinfacht die Lieferketten von ToF-Kameras (ToF – Time-of-Flight) im Vergleich zu herkömmlichen VCSELs für die 3D-Aufnahme.

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The TriLumina 3 W VoB SMT VCSEL array has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices. (PRNewsFoto/TriLumina)
The TriLumina 3 W VoB SMT VCSEL array has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices. (PRNewsFoto/TriLumina)

„Wir waren höchst zufrieden damit, im letzten Sommer die 4 W VoB für Anwendungen im Automobil einführen zu können", sagte Brian Wong, Präsident und CEO von TriLumina. „Mit der neuen 3 W Flip-Chip VoB stellt TriLumina eine noch kleinere Bauform zur Verfügung, was kleinere und dünnere Lösungen mit höherer Leistung ermöglicht – im Vergleich zu konventionellen, oben emittierenden VCSELs, die sich speziell an mobile ToF-Anwendungen wenden."

Konventionelle VCSEL-Arrays sind auf einer Montagebasis angebracht und nutzen Bonddraht als elektrische Verbindungen. Das neue Gerät mit integrierter 3 W VCSEL Oberflächenmontage (Surface Mount Technology – SMT) ist eine kompakte Konstruktion, die auf einer Oberfläche angebracht werden kann, und besteht aus einem einzelnen VCSEL-Array mit Flip-Chip mit Standard-SMT zu einer gedruckten Platine (PCB). Eine Halterung als Montagebasis für den VCSEL-Chip und weitere SMT-Komponenten auf derselben Platine entfallen. Die integrierten, auf der Rückseite geätzten Mikrolinsen von TriLumina ermöglichen eine integrierte Optik, was die Teilegröße im Vergleich zu herkömmlichen VCSELs mit separaten Linsen weiter reduziert. Es stellt in seiner Klasse die kleinste Baugröße mit den niedrigsten Implementierungskosten bereit und ist damit ideal für Mobilgeräte.

Direkte Flip-Chip-SMT-Technologie kam zwar bereits in anderen Komponenten zur Anwendung, darunter Chips für Hochfrequenz (HF) und Leistungs-Feldeffekttransistoren (FET), aber TriLuminas VoB ist die Premiere der Einsatzmöglichkeit dieser Technologie in einem VCSEL-Gerät. Das VCSEL-Gerät nutzt Kupfersäulen mit Lötkontakthügeln, die derzeit für andere Produkttypen verwendet werden, und wird mit bleifreier Standard-SMT direkt auf einer Platine angebracht. Dies hat den zusätzlichen Vorzug eingebauter hermetischer Abdichtung und exzellenter thermischer Eigenschaften aufgrund von TriLuminas einzigartiger, rückseitig emittierender VCSEL-Struktur. Muster der VoB-Produktfamilie sind ab jetzt verfügbar. Um Datenblätter sowie weitere technische und preisliche Informationen zu erhalten, wenden Sie sich bitte an TriLumina.

Weitere Informationen erhalten Sie unter http://www.trilumina.com.

Foto - https://mma.prnewswire.com/media/1029733/TriLumina_3_W_VoB_SMT_VCSEL_Pencil.jpg

Logo - https://mma.prnewswire.com/media/950577/TriLumina_Logo.jpg

Related Links

http://www.trilumina.com

SOURCE TriLumina

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