Axcelis Announces the Launch of the Company's New GSD Ovation ES Enabling Best-in-Class High Current Batch Implant Capability for Engineered Substrates

BEVERLY, Mass., Sept. 8, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (NASDAQ: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's GSD Ovation™ ES high current ion implanter, targeted specifically for engineered substrates.

Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enables best-in-class high current Hydrogen & Helium implant capability for engineered substrate applications, including wafer splitting. The system is an evolution of the GSD Ovation Series platform, the industry benchmark for batch implanter productivity."

The GSD Ovation ES system delivers superior flexibility and capital efficiency. It provides production-proven wafer handling capability for multiple substrate types, including SiC, LiTaO3, LiNbO3, in a wide range of thickness and weights. It also offers superior beam power and wafer cooling capability. The system is available today with factory demo capability to meet customer application needs.

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CONTACTS:
Press/Media Relations Contact: 
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: [email protected] 

Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: [email protected] 

SOURCE Axcelis Technologies, Inc.