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CEVA Computer Vision DSP Powers Evomotion ROD-1 360° Video Camera

Rockchip RV1108 visual processor with CEVA-XM4 DSP handles Evomotion's high-resolution real-time stitching on-board at 70% lower power consumption compared to CPU/GPU implementations


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CEVA, Inc.

Jun 21, 2017, 07:00 ET

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MOUNTAIN VIEW, Calif., June 21, 2017 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and Evomotion Technology, Ltd, one of the leading deep learning and computer vision combining hardware solution providers in the industry, today announced that the companies have collaborated to enable advanced imaging and computer vision features for Evomotion's ROD-1/360°/720° dual-lens spherical camera. The ROD-1 is capable of taking 3k resolution 30fps videos and 4k resolution photos with panoramic stitching in real-time, implemented on the CEVA-XM4 imaging and vision DSP, eliminating the need for post-processing on a smartphone or PC. The camera is now available and is one of the best value 360 degree cameras in the market today. A YouTube video introducing the ROD-1 can be seen at https://www.youtube.com/watch?v=39asfnXNQs0.

Evomotion and CEVA, Inc have collaborated to enable advanced imaging and computer vision features for Evomotion’s ROD-1/360°/720° dual-lens spherical camera. The camera utilizes Rockchip RV1108 visual processors, which include the CEVA-XM4 DSP to handle advanced imaging and computer vision tasks. While achieving the same panoramic stitching performance, the power consumption of CEVA-XM4 is 70% lower compared to a CPU/GPU implementation.
Evomotion and CEVA, Inc have collaborated to enable advanced imaging and computer vision features for Evomotion’s ROD-1/360°/720° dual-lens spherical camera. The camera utilizes Rockchip RV1108 visual processors, which include the CEVA-XM4 DSP to handle advanced imaging and computer vision tasks. While achieving the same panoramic stitching performance, the power consumption of CEVA-XM4 is 70% lower compared to a CPU/GPU implementation.

The camera utilizes Rockchip RV1108 visual processors, which include the CEVA-XM4 DSP to handle advanced imaging and computer vision tasks. Evomotion ported a range of imaging algorithms and high-performance stitching to the fully-programmable CEVA-XM4 using CEVA's development environment and tools, supported by CEVA and Rockchip engineers. Following this successful project, CEVA and Evomotion intend to extend the partnership to include broader imaging solutions for dashcam, sports camera, SLAM and real-time 3D reconstruction in the future.

Lufang Gao, CEO of Evomotion, commented: "With the increasing demand of edge processing and embedded intelligence products, a powerful and power efficient smart vision platform being able to handle computer vision and deep learning algorithms is needed for our customers and the industry. The CEVA-XM4 DSP and Rockchip's RV1108 platform deliver best-in-class performance for us to continually deliver customer value to the market."

Weibing Huang, CTO of Evomotion, added: "We were extremely impressed with the quality and capabilities CEVA's software development environment, allowing us to easily and efficiently develop our algorithms. In addition to the stitching, the CEVA-XM4 also handles distortion, color correction and other image enhancement features, with notably low power consumption. While achieving the same stitching performance, the power consumption of CEVA-XM4 is 70% lower compared to a CPU/GPU implementation."

Ilan Yona, vice president and general manager of the Vision Business Unit at CEVA, commented: "Evomotion's 360 degree camera is an excellent endorsement of the strong computer vision capabilities of our CEVA-XM4 DSP, seamlessly handling multiple algorithms and creating outstanding video quality from dual camera streams stitched together in real-time. Our goal is to bring computer vision and deep learning capabilities to every camera-enabled mass market device, and working directly with innovative companies like Evomotion who deploy our technology is an essential step to achieving this."

CEVA will be demonstrating the Evomotion ROD-1 and other CEVA-powered products at the upcoming Mobile World Congress Shanghai, June 28 to July 01.  On CEVA's Booth W5.A33-35 visitors can meet the team and learn more about how CEVA's signal processing IPs for communications, connectivity, imaging, vision and sound can help to truly differentiate next-generation products.

CEVA's latest generation imaging and vision DSP platforms address the extreme processing requirements and low power constraints of the most sophisticated machine learning and machine vision applications used in smartphones, surveillance, augmented reality, Sense and Avoid drones and self-driving cars. These DSP-based platforms include a hybrid architecture composed of scalar and vector DSP processors coupled with a comprehensive Application Development Kit (ADK) to streamline software deployment. The CEVA ADK includes: CEVA-Link for seamless software level integration with a host processor; a range of widely used and optimized software algorithms; the CEVA Deep Neural Network (CDNN2) real-time Neural Network software framework which streamlines machine learning deployment at a fraction of the power consumption of the leading GPU-based systems, and; state-of-the-art development and debugging tools. For more information, visit http://www.ceva-dsp.com/app/imaging-computer-vision/.

About Evomotion Technology, Ltd. 
Evomotion is one of the leading Deep Learning and Computer Vision combining hardware solution providers in the industry. By emerging the patented SLAM (simultaneous localization and mapping), 3D reconstruction, panoramic stitching algorithm and best-selling consumer electronic products, covering different form factor, price tag and platforms, reference designs released by Evomotion continually helping partners delivering new exciting products. In Evomotion, we unswervingly keep driving the smart manufacturing forward. For more information, visit http://www.evomotion.com/.

About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging, computer vision and deep learning for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube and LinkedIn.

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SOURCE CEVA, Inc.

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