NSING Technologies Surpasses 250 Million Bluetooth Chips Shipped Powered by Ceva Technology

Long-standing collaboration combines Ceva-Waves Bluetooth Low Energy IP with NSING Technologies' RF and MCU expertise to enable connected devices across consumer, automotive and industrial markets

SHANGHAI, Nov. 5, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that NSING Technologies, a leading provider of microcontrollers and semiconductor solutions, has surpassed 250 million Bluetooth chips shipped incorporating Ceva-Waves Bluetooth Low Energy (LE) IP. The milestone highlights the success of the companies' long-standing collaboration and the widespread adoption of NSING Technologies' Bluetooth-enabled products across wearables, consumer electronics, smart home, automotive and industrial applications.

NSING Technologies has built its Bluetooth product portfolio on Ceva-Waves Bluetooth LE IP, combining Ceva's proven connectivity technology with its own low-power RF designs and MCU architectures. This approach has enabled NSING Technologies to develop a broad range of highly integrated, power-efficient Bluetooth solutions while accelerating product development and maintaining consistent performance and standards compliance across successive product generations.

The collaboration spans multiple generations of NSING Technologies' Bluetooth products, including its N32WB452 series of dual-core Bluetooth LE MCUs and N32WB03x series of ultra-low-power Bluetooth LE SoCs. These solutions support a diverse range of applications, including electronic toll collection systems, wireless remote controls, smart lighting, e-bike security systems, indoor positioning and industrial wireless connectivity.

"Reaching 250 million Bluetooth chip shipments reflects the strength of our product portfolio and the trust our customers place in our technology," said Xinhui Mu, Vice President, NSING Technologies. "Ceva has been a valued technology partner in our growth, and we look forward to building on this success as we expand our presence in new markets and applications."

"The scale of NSING Technologies' Bluetooth shipments illustrates the tremendous reach of wireless connectivity and the role Ceva plays in enabling it," said Ziv Hammer, Executive Vice President, Connectivity & Sensing Division at Ceva. "With billions of Ceva-powered devices deployed worldwide, milestones like this demonstrate how our IP licensing model translates into sustained, high-volume production and long-term royalty opportunities."

Ceva's comprehensive Ceva-Waves wireless connectivity IP portfolio includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput (HDT), Wi-Fi and Ultra-Wideband (UWB), supported by integrated hardware and software solutions. These technologies underpin the Connect pillar of Ceva's strategy to enable devices to Connect, Sense, and Infer as part of the broader industry shift toward Physical AI. Licensed by leading semiconductor companies worldwide, Ceva's wireless connectivity IP is deployed in billions of devices. For more information on Ceva's Bluetooth platform, visit https://www.ceva-ip.com/product/ceva-waves-bluetooth/.

About NSING

NSING TECHNOLOGIES INC. (NSING), a leading enterprise in MCUs and security ICs, operates a dual-headquarters system with Shenzhen as its domestic headquarters and Singapore as its international headquarters. The company holds leading strengths in security, SoC, RF, and power-supply technologies. With AI computing infrastructure, embodied AI, and on-device AI as its core strategic directions, NSING provides consumer-grade, industrial-grade, and automotive-grade ICs, as well as complete system solutions for global customers. Its products empower diverse application scenarios, including embodied robots, AI computing infrastructure, industrial control, automotive electronics, consumer electronics, and medical care.

For more information, visit https://nsing.com.sg  and follow us on LinkedIn.

About Ceva, Inc.

Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.

With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

SOURCE Ceva, Inc.