Chatsworth Products Showcases Rack, Power, and Cooling Solutions for AI and HPC at SC26

SC26 showcase features CPI's OCP Open Rack V3, previews of upcoming power and cooling solutions, and integrated liquid cooling solutions for high-density environments.

SIMI VALLEY, Calif., Nov. 10, 2026 /PRNewswire/ -- Chatsworth Products, Inc. (CPI), a global manufacturer of infrastructure solutions supporting AI, high-performance computing (HPC), and other demanding data center environments, today announced CPI's OCP Open Rack V3 (ORV3), expanding its portfolio of high-density infrastructure solutions. At Supercomputing 2026 (SC26), CPI will showcase its broader rack, power, and cooling capabilities. Attendees will also get an early look at upcoming eConnect® PDUs with 480V Input and CoolStream™ Rear Door Heat Exchanger (RDHx), alongside ZutaCore® HyperCool® waterless direct-to-chip liquid cooling integrated into CPI's ZetaFrame® Cabinet System.

Increasing rack densities are creating more complex infrastructure decisions around equipment integration, power distribution, and thermal management. These interconnected requirements are influencing how data center operators plan and deploy infrastructure to support next-generation AI and HPC environments.

"As AI and HPC workloads drive greater demands on data center infrastructure, organizations must consider how rack architecture, power distribution, and cooling technologies work together to support performance and scalability," said Sam Rodriguez, Senior Product Manager, Cabinets, Containment and Industrial Solutions, Chatsworth Products. "Our expanded portfolio reflects CPI's commitment to helping customers address these challenges with flexible infrastructure solutions, backed by engineering expertise and U.S.-based manufacturing capabilities."

Flexible Open Rack Architecture for Evolving Infrastructure Requirements

CPI's ORV3 carries the OCP Accepted® designation from the Open Compute Project Foundation, recognizing its alignment with OCP specifications and principles. Available in standard and customer-specific 44OU and 48OU ORV3 and High-Power Rack (HPR) configurations, the solution supports 21-inch Open Rack equipment, with optional support for 19-inch EIA equipment.

Optional 48V DC power shelf solutions range from 18 kW to 33 kW, while compatible busbars range from 350 A to 2500 A, providing additional options for rack-level power distribution.

Key capabilities include:

• Customizable Open Rack Architecture: Standard and customer-specific 44OU and 48OU ORV3 and HPR configurations support diverse deployment requirements.
• Support for OCP-Standard Components: Designed to accommodate OCP-standard 48V DC busbars, power shelves, and IT equipment for integration within Open Rack environments.
• Compatible Power Distribution Solutions: Optional 48V DC power shelves and busbars support integrated rack-level power distribution, with factory-installed busbars available to streamline deployment.
• U.S.-Based Manufacturing: Domestic manufacturing capabilities provide flexibility to address customer-specific requirements and support deployment planning.
• Engineering Expertise and Support: CPI's engineering and technical support teams assist customers with rack configuration, component integration, and deployment requirements.

Previewing Upcoming Power and Cooling Technologies

CPI will also offer attendees an early look at two upcoming solutions designed to address evolving power and thermal management requirements in high-density data center environments.

The upcoming eConnect® PDUs with 480V Input are designed to support higher rack-level power requirements, helping organizations plan power distribution infrastructure for increasingly demanding AI and HPC workloads.

CPI will also preview its CoolStream™ Rear Door Heat Exchanger (RDHx), designed to bring liquid-assisted cooling to the rack level. The solution supports high-density thermal management while helping organizations address space and cooling infrastructure considerations.

Showcasing Integrated Liquid Cooling Capabilities

CPI will also showcase ZutaCore® HyperCool® waterless two-phase direct-to-chip liquid cooling integrated into CPI's ZetaFrame® Cabinet System.

The solution brings together ZutaCore's advanced liquid cooling technology with CPI's cabinet infrastructure, demonstrating how complementary technologies can help organizations address increasing heat loads, infrastructure efficiency, and thermal management requirements in high-density AI and HPC environments.

Explore CPI's High-Density Infrastructure Solutions at SC26

CPI will exhibit at Supercomputing 2026 (SC26), taking place November 15–20, 2026, at McCormick Place in Chicago, Illinois. During the exhibition, November 17–19, attendees can explore CPI's ORV3, preview upcoming eConnect PDUs with 480V Input and CoolStream RDHx, and see ZutaCore's waterless direct-to-chip liquid cooling integrated into the ZetaFrame Cabinet System.

Visit CPI at Booth #4203 to connect with the team and learn how its rack, power, and cooling solutions support evolving AI and HPC infrastructure requirements.

Click here for more information about CPI's ORV3.

About Chatsworth Products (CPI)

Chatsworth Products (CPI) is a global manufacturer of products and solutions that power and protect businesses' ever-growing investment in information and communications technology for IT and industrial automation applications. As a trusted business partner, CPI is uniquely prepared to respond to requirements with global availability and rapid product customization, giving businesses a competitive advantage. With decades of experience engineering thermal, power and cable management solutions for the data center, enterprise networking and industrial enclosure markets, CPI is well positioned to provide organizations with unequaled application expertise, customer service and technical support, as well as a global network of industry-leading distributors. 

Media Contact 

Maren Price
Chatsworth Products
612-387-5115
[email protected] 

SOURCE Chatsworth Products, Inc.