Delta Highlights Collaboration with NVIDIA in Advancing Energy-efficient 800 VDC Power and Cooling Solutions for AI Data Centers at OCP Global Summit 2026

FREMONT, Calif., Oct. 15, 2026 /PRNewswire/ -- Delta Electronics, a global leader in power management and smart green solutions, is highlighting how its collaboration with NVIDIA accelerates the development of NVIDIA 800 VDC power and cooling solutions for increasingly dense AI factories at the OCP Global Summit 2026.

NVIDIA 800 VDC MGX-compatible power racks help existing data centers scale AI compute performance and power density, creating an upgrade path for future AI infrastructure. Alongside the NVIDIA AI Factory MGX Ecosystem Ceremony on October 14, Delta, is showcasing next-gen energy-efficient solutions for 800 VDC architecture-based AI factories, including 800 VDC 660kW In-Row Power Rack systems with 480kW backup power for NVIDIA Vera Rubin NVL72 and other NVIDIA MGX racks, as well as the new 800 VDC Liquid-to-Liquid CDU with up to 2.5 MW cooling capacity.

NVIDIA MGX is a modular reference architecture for accelerated computing, helping system builders design future-compatible systems faster, reducing costs, accelerating time to market, and improving ROI.

"Scaling AI requires power and cooling infrastructure that evolves alongside computing platforms," said Ted Shyy, Executive Vice President of Power Electronics Business, Delta Electronics, at the NVIDIA AI Factory MGX Ecosystem Ceremony. "Our collaboration with NVIDIA helps us align Delta's power and thermal management expertise with next-generation AI infrastructure requirements. At OCP, we share how 800 VDC power delivery and integrated cooling can help customers improve efficiency and support increasingly dense AI systems."

Advancing Efficient Power Delivery from Facility to Rack for the NVIDIA MGX Platform

Delta is showcasing its Solid State Transformer (SST), which converts medium-voltage AC directly to 800 VDC without intermediate conversion steps. Delta's HVDC Power Distribution Board (PDB) then converts 800 VDC or ±400 VDC to 54 VDC and 12 VDC to power AI servers. The PDB achieves up to 98% conversion efficiency at a power density of 1,000 W/in³, with built-in hot-swap capability to support reliable operation. Together, these technologies simplify grid-to-chip power conversion and reduce energy losses to meet next-generation AI power demands.

For high-capacity power delivery, Delta is highlighting its latest 800 VDC In-Row Power Rack for NVIDIA Vera Rubin NVL72 and other MGX racks. Six 7RU power modules, each combining a 3RU 110 kW power shelf and a 4RU 80 kW battery backup unit (BBU), deliver 660 kW of total output and 480 kW of backup power. A 90 kW DC/DC Power Shelf then converts 800 VDC to 50 V at up to 98.5% efficiency.

Integrating Power and Cooling for Next-Generation AI Infrastructure

Delta is also showcasing its 5,000A liquid-cooled busbar for NVIDIA 3rd generation MGX racks, combining high-current power distribution with liquid cooling to manage heat in the power delivery system. Its NVIDIA MGX rack and manifold support cooling for high-density Vera Rubin platforms, while its DC Busway provides efficient power distribution for upcoming 800 VDC architectures. Delta's power architecture supports Intelligent Power Smoothing (IPS) with up to 98% efficiency and offers configurations including a compact 800 kW In-Row Power solution without BBU and a 660 kW In-Row Power system with integrated BBU to meet varied deployment needs.

Delta's thermal management portfolio supports 800 VDC-based AI data centers with cooling from row to chip. Highlights include the new 800 VDC 2.5 MW Liquid-to-Liquid Cooling Distribution Unit (L2L CDU) and a new cold plate designed for NVIDIA Vera Rubin NVL72.

The L2L CDU features three hot-swappable pumps to support zero-downtime targets – each with an integrated converter and control module. Together the pumps (3+0) deliver a combined flow rate of up to 3,850 LPM and 60 psi of pressure at the operating point. The micro-channel cold plate combines micro-channel structures and a multi-impinging flow design to enhance heat transfer and reduce flow resistance. Passive flow control and advanced metal bonding processes support high cooling capacity and reliability.

Together, these cooling solutions address the evolving thermal requirements of next-generation AI infrastructure.

Sharing Expertise on Next-Generation AI Power and Cooling Architectures

Delta also presented "Delta 800 VDC Power and Cooling Solutions for Data Centers" on October 12. The executive session featured Ralf Pieper, Research and Design Director, Custom Design Business Unit, Delta Electronics, and Mike Tu, Principal Electrical Engineer, NVIDIA. The discussion explored Delta's 800 VDC power architectures, rack-level power delivery, and liquid cooling for efficient, reliable, and scalable AI infrastructure.

For more information, visit Delta's OCP Global Summit 2026 event page.

About Delta Electronics (Americas)

Headquartered in Fremont, CA, Delta Electronics (Americas) is a subsidiary of Delta Electronics, Inc. (TWSE: 2308), a global leader in power management and smart green solutions. We have operated in the Americas for almost 40 years, with offices, R&D centers, manufacturing, and service facilities across the U.S., Canada, Mexico, Brazil, and more. Our smart, energy-saving solutions serve customers across data centers, IT, telecom, renewable energy and microgrids, EV charging and powertrains, building automation, industrial automation, lighting, and other major industries.

Please visit: www.deltaww.com | www.delta-americas.com

SOURCE Delta Electronics (Americas)