Delta Unveils 'From-Grid-to-Chip' Cooling Innovations for AI Infrastructure and for New 800 VDC, ±400 VDC Architectures at SC26

CHICAGO, Nov. 11, 2026 /PRNewswire/ -- Delta Electronics, a global leader in power management and smart green solutions, is attending Supercomputing 2026 (SC26) to showcase its latest liquid and air-cooling solutions for AI infrastructure, and the emerging 800 VDC and ±400 VDC power architectures. Key highlights from the wide solutions portfolio spanning chip, board, rack, row, and facility-level applications, include the 800 VDC-powered 2.5 MW In-Row Liquid-to-Liquid Coolant Distribution Unit (L2L CDU), the hot-swappable cold plate solution with a modular design for stacked SSDs, and the ultra-thin multi-channel flow Power Shelf Embedded Cold Plate for the optimum cooling of up to 3,000W in computing components.

"Delta's unique strength in cooling comes from the deep integration of our core power and thermal management technologies, enabling us to address the increasingly complex demands of AI infrastructure," said Martin Tsai, General Manager of Fans and Thermal Management Business Group, Delta Electronics. "Particularly our full stack chip-to-system liquid cooling solutions are expanding beyond compute platforms to next-generation networking, memory/storage, and power cooling applications." With this comprehensive portfolio, Delta is well positioned to address the cooling challenges of next-generation data centers.

Advancing Thermal Management at the Chip and Board

At the chip level, Delta further advances thermal management with next-generation cooling technologies that feature advanced thermal interface materials and micro-channel lid structures.

At the board level, Delta is introducing its latest cold plate solutions, extending liquid cooling beyond traditional computing applications to address the thermal management needs of power, memory, and networking applications. Making its debut, the Power Shelf Embedded Cold Plate features a customizable, ultra-thin design, flexible manifold layouts, and low-resistance multi-channel flow paths to deliver targeted cooling for hotspot in space-constrained power systems. Delta will also showcase its Vertical Power Delivery (VPD) Double-Sided Cooling Solution for Open Adapter Card (OAC) architectures, supporting cooling for up to 3,000 W of computing components and 500 W of power components within a slim 40 mm cold plate profile, with heat flux exceeding 170 W/cm². For memory applications, Delta will also feature its hot-swappable SSD cold plate solution with a modular design for stacked SSDs, to enhance serviceability, scalability, and thermal performance.

Scaling Coolant Distribution from Rack to Row

At the rack level, Delta will showcase its latest 4U In-Rack Coolant Distribution Unit (CDU), delivering up to 200 kW of cooling capacity. At the row level, highlights include the Project Deschutes Open In-Row CDU, which delivers up to 2 MW of cooling at a 3°C approach temperature, and the Google OCP Project Brazos rack-mounted liquid-to-air CDU, delivering up to 60 kW per rack through a self-contained, closed-loop design.

Next-Generation AI Power and Cooling Architectures

As AI data center power architecture evolves toward higher-voltage distribution, increasing heat generation from power conversion and delivery systems introduces new thermal management requirements. To address these challenges, Delta will feature a dedicated exhibition area highlighting cooling technologies designed for 800 VDC and ±400 VDC infrastructure.

Supporting emerging 800 VDC and ±400 VDC power architectures, key highlights include the 800 VDC 2.5 MW In-Row Liquid-to-Liquid Coolant Distribution Unit (L2L CDU), equipped featuring three 800 VDC 25 kW hot-swappable pumps in a 3+0 configuration designed to support zero-downtime operation, with a flow rate of up to 3,850 LPM and 60 psi of pressure at the operating point. For air cooling, Delta will introduce its next-generation fan wall solution, featuring 450 mm EC blowers, with high-efficiency brushless DC motors, biomimetic impellers, and waterproof protection, also designed to support these advanced power architectures.

Attendees can visit Delta at #1443 during SC26 at McCormick Place in Chicago, Illinois from November 17 to 19, 2026 to explore its comprehensive 'From-Grid-to-Chip' cooling solutions portfolio. Our experts will be available to discuss thermal management requirements across computing, networking, and power applications.

About Delta Electronics (Americas)

Headquartered in Fremont, CA, Delta Electronics (Americas) is a subsidiary of Delta Electronics, Inc. (TWSE: 2308), a global leader in power management and smart green solutions. We have operated in the Americas for almost 40 years, with offices, R&D centers, manufacturing, and service facilities across the U.S., Canada, Mexico, Brazil, and more. Our smart, energy-saving solutions serve customers across data centers, IT, telecom, renewable energy and microgrids, EV charging and powertrains, building automation, industrial automation, lighting, and other major industries.

Please visit: www.deltaww.com | www.delta-americas.com

SOURCE Delta Electronics (Americas)