EMDT, MD+DI, and Qmed Announce Virtual Event Dedicated to Developments in Materials for Medical Applications

Mar 22, 2011, 11:13 ET from UBM Canon

LOS ANGELES, March 22, 2011 /PRNewswire/ -- UBM Canon's Medical Device Media Group today announced its leading brands, EMDT (European Medical Device Technology), MD+DI (Medical Device & Diagnostic Industry), and Qmed, the world's only 100% qualified medical device supplier directory and search engine, will host a combined virtual conference and tradeshow focusing on current and emerging innovations in materials for medical applications.

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The virtual event will take place on 24 May 2011, from 11:00–19:00 (London); 12:00-20:00 (Paris); 6:00 A.M.–2:00 P.M. (New York). Registration is now available. The virtual conference and tradeshow offers attendees the opportunity to learn from and interact directly with industry experts and technology providers via a keynote address by an industry expert, sessions focused on how materials enable advances in medical technology directly followed by Q&A opportunities, panel discussions, and live chat sessions. This topic-specific, focused environment is available directly from virtually anywhere an attendee has online access.

Topics to be covered include: The Building Blocks of Medical Innovation, Materials Selection for Catheters, Emerging Technologies in Orthopaedic Materials, Materials for Implantable Devices, Trends in Packaging Materials, The Pros and Cons of PVC, and Medical Device Coatings. Learn more about sessions here.

The virtual exhibition hall will house stands staffed by suppliers of materials and related products and service providers. Booths will be equipped with white papers, videos, brochures, and live chat capabilities that provide medical device OEMs with the opportunity to engage with suppliers and gather educational information.

"We are able to deliver rich content to our audience through topic specific virtual events," stated Stephen Corrick, Vice President and Executive Director of UBM Canon Publishing. "Building on their reputation for delivering quality content to the global medical device industry, our editorial team researches and defines key topics and speakers that have industry insight- in this case- into cutting-edge trends in materials. The virtual event platform allows for open discussion and the exchange of ideas with industry leaders. Medical device OEMs also have the opportunity to interact directly with leading suppliers and service providers to the medical device industry."

The Developments in Materials for Medical Applications virtual event has several tiered sponsorship opportunities available that include speaking and exhibiting opportunities. Event sponsors benefit from interacting with a targeted, interested audience, high-quality lead generation, and audience-engagement data. Sponsor branding will be included in all attendee promotions that will run across EMDT, MD+DI, and Qmed online, print and e-newsletter branded products as well as on any promotions to UBM Canon's master data file of over 350,000 medical device professionals worldwide.

Sponsors already committed to the event include: Member Sponsor NuSil and Exhibiting Sponsor BioCoat.

For more information regarding speaking opportunities, contact Rich Nass at rich.nass@ubm.com. For information on sponsorship opportunities, contact your account executive or email: medicalsales@ubm.com.

To register, visit the Developments in Materials for Medical Applications registration page.

About UBM Canon

UBM Canon, the leading B2B media company dedicated exclusively to the global $3.0 trillion advanced manufacturing sector, helps support the flow of information, commerce and innovation in such sophisticated segments as medical devices and pharmaceutical development. UBM Canon also addresses cutting-edge developments in broader areas of advanced engineering design and manufacturing, and manufacturing processes and packaging. UBM Canon is part of UBM (UBM.L) a global provider of media and information services for professional B2B communities and markets.