Gennum to Present at Ethernet Technology Summit and ISSCC Conference
BURLINGTON, ON, Feb. 9 /PRNewswire/ - Design engineers from Gennum Corporation (TSX: GND), a leading supplier of high-speed optical, analog and mixed signal semiconductor solutions, and its Snowbush IP Group will present papers at two important industry events in February, the Ethernet Technology Summit and the IEEE International Solid-State Circuits Conference (ISSCC).
| Ethernet Technology Summit 2011 | |
| What: | Saman Sadr, Director of Analog Design for Gennum's Snowbush Group, will present during the conference's "Workshop on High-Speed (25 Gbps) Signaling (Part 2): 25G SerDes IP and 100G Ethernet Applications". |
| Where: | Santa Clara Marriott, Santa Clara, CA |
| When: | Tuesday, February 22, 1:00 p.m. |
| ___________ | |
| What: | Ed Frlan, Product Definition Specialist for Gennum, will present "Enabling 100GbE Using 4x25Gb/s Retimed Interfaces". |
| Where: | Santa Clara Marriott, Santa Clara, CA |
| When: | Wednesday, February 23, 8:30 a.m. |
| International Solid-State Circuits Conference (ISSCC). 2011 | |
| What: | Mehrdad Ramezani, Senior IC Design Engineer for Gennum's Snowbush Group, will present "An 8.4mw/Gb/s 4-lane 48Gb/s Multi-Standard-Compliant Transceiver in 40nm Digital CMOS Technology". |
| Where: | Marriott Marquis Hotel, San Francisco, CA |
| When: | Wednesday, February 23, 10:15 a.m. |
| ___________ | |
| What: | Marcus van Ierssel, Senior Analog IC Designer for Gennum's Snowbush Group, will present "High-Speed Transceivers: Standards, Challenges, and Future: Ethernet/PCIe/SATA/USB PHY Implementation Challenges and Tradeoffs". |
| Where: | Marriott Marquis Hotel, San Francisco, CA |
| When: | Thursday February 24, 10:35 a.m. |
About the Ethernet Technology Summit
Ethernet Technology Summit focuses on the latest advances in Ethernet technology, particularly the new specifications for 40/100 GbE, Fibre Channel over Ethernet (FCoE), and Energy-Efficient Ethernet. It features the latest information on these advances from the experts who are developing the specifications and designing the initial products for them. www.ethernetsummit.com.
About the IEEE International Solid-State Circuits Conference (ISSCC)
ISSCC is the flagship conference of the Solid-State Circuits Society and is the premier forum for presenting advances in solid-state circuits and systems-on-a-chip. The Conference will feature more than 200 technical presentations representing benchmark results, design in state-of-the-art process technologies, and circuits in emerging device technologies. ISSCC 2011 will also feature a variety of educational events (tutorials, short course), advanced-circuit forums and evening sessions. www.isscc.org.
About the Gennum Snowbush IP Group
The Gennum Snowbush IP group offers a team of interconnect specialist to design and deliver silicon-proven, high-speed serial interface IP. Comprising one of the industry's most robust, widely-deployed, production-tested and customizable family of IP cores, the Snowbush IP portfolio satisfies the needs of today's most demanding high-speed serial communication protocols and applications. The offering includes complete, integrated, PHY and controller solutions for standards like USB, PCI Express® and Serial ATA (SATA), and single and multi-standard SerDes for applications with data rates from 1 Gb/s to over 10 Gb/s. Gennum's Snowbush IP group is committed to supportingcustomers with diverse foundry and process requirements, offering IP cores for TSMC, UMC, Common Platform, and Fujitsu processes. For more information, visit www.snowbush.com.
About Gennum
Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores to serve the rising global demand for high-speed data transmission products in the broadcast, networking, storage and telecommunications markets. Gennum offers proven optical, analog and mixed-signal solutions with uncompromising signal integrity to support standards such as high-definition (HD) video, Fibre Channel, InfiniBand®, Ethernet, SONET and PCI Express®. The company is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, India and the United Kingdom. www.gennum.com.
Gennum and the Gennum logo are registered trademarks of Gennum Corporation. All other product or service names are the property of their respective owners. Gennum Corporation, 2011.
SOURCE Gennum Corporation
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