FREMONT, Calif., March 2, 2016 /PRNewswire/ -- Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, named Hung Le to the position of Senior Vice President of IC Engineering, which includes product, test, layout, technology, CAD and digital design.
Mr. Le has over 35 years of experience in a variety of technology and IC design and manufacturing roles. He most recently served as Senior Director of Operations for Integrated Device Technology where his focus was on new product introductions. Prior to joining IDT, he held various engineering management positions at Exar, PMC-Sierra, Zoran and Trilogy Corporation. He began his career in the semiconductor industry at Texas Instruments, after receiving his BSEE and MSEE from MIT. He was awarded ten patents in the field of process technology, semiconductor device and circuit design.
"We are delighted to have Hung back at Exar in engineering," said Richard L. Leza, Exar's Interim Chief Executive Officer. "He is an exceptionally qualified and highly regarded technology executive. We look forward to his contribution on day one and his help in improving productivity with his unique semiconductor industry experience."
With the addition of Hung Le, Exar announced today that Dimitry Goder will continue to serve as Senior Vice President of Research and Development. Dimitry's focus is on front-end engineering that includes design and applications.
Exar Corporation designs, develops and markets analog mixed-signal products for the industrial and embedded systems communications, high-end consumer and infrastructure markets. Exar's broad product portfolio includes power management, signal conditioning, interface, display, data management and video processing solutions. Exar has locations worldwide providing real-time customer support. For more information, visit www.exar.com.
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SOURCE Exar Corporation