ALISO VIEJO, Calif., Jan. 15, 2013 /PRNewswire/ -- Microsemi Corporation (Nasdaq : MSCC ), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new generation of industrial temperature, silicon carbide (SiC) standard power modules. They are ideally suited for use in high power switch mode power supplies, motor drives, uninterruptible power supplies, solar inverters, oil exploration and other high power, high voltage industrial applications requiring high performance and reliability. The power module family is also offered with extended temperature ranges to meet next-generation power conversion system requirements for higher power densities, operating frequencies and efficiencies.
SiC technology delivers higher breakdown field strength and improved thermal conductivity compared to silicon material. This enables improved performance characteristics in parameters including zero reverse recovery, temperature independent behavior, higher voltage capability and higher temperature operation to achieve new levels of performance, efficiency and reliability.
"We applied our extensive expertise in power semiconductor integration and packaging to deliver a next-generation family of silicon carbide power modules that deliver outstanding levels of performance, reliability and overall quality," says Philippe Dupin, general manager of Microsemi's Power Module Products group. "Our new modules also allow designers to shrink system size and weight, while reducing total systems costs."
About the New SiC Modules
Microsemi's new industrial temperature SiC power modules feature multiple circuit topologies and are integrated into low profile packages. The majority of the new module product family uses aluminum nitride (AIN) substrates to enable isolation from the heat sink, which improves heat transfer to the cooling system.
Additional features include high speed switching, low switching losses, low input capacitance, low drive requirements, low profile and minimum parasitic inductance which enable high frequency, high performance, high density and energy-saving power systems.
The new industrial temperature module family includes the following parameters and devices:
- 1200V boost chopper configuration, rated from 50 to 100 amp (Part numbers: APT100MC120JCU2 and APT50MC120JCU2)
- 1200V phase leg configuration, rated from 40 to 200 amp (Part numbers: APTMC120AM08CD3AG, APTMC120AM20CT1AG, and APTMC120AM55CT1AG)
- 600V neutral point clamped configuration, dedicated to three level inverters for solar or UPS applications, rated from 20 to 160 amp (Part numbers: APTMC60TLM14CAG, APTMC60TLM20CT3AG, APTMC60TLM55CT3AG, and APTMC60TL11CT3AG)
- Neutral point clamped configuration, 600V/1200V mixed voltage, rated from 20 to 50 amp (Part numbers: APTMC120HRM40CT3G and APTMC120HR11CT3G)
Microsemi's SiC product portfolio includes Schottky diodes in both discrete and module packages, and power modules with a mix of SiC Schottky diodes and IGBT or MOSFET transistors in both standard and custom configurations.
Samples of Microsemi's industrial temperature, SiC standard power modules are available within short lead times. For more information, contact your local distributor or Microsemi sales representative.
Microsemi Corporation (Nasdaq : MSCC ) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new generation of industrial temperature, silicon carbide (SiC) standard power modules, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation