ALISO VIEJO, Calif., Jan. 31, 2013 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its SmartFusion®2 Starter Kit, providing designers with a basic prototyping platform for the company's SmartFusion2 system-on-chip (SoC) field programmable gate arrays (FPGAs).
The SmartFusion2 Starter Kit supports industry-standard interfaces including Ethernet, USB, SPI, I2C and UART and includes a comprehensive breadboard to support unique design requirements. The kit can be used with Microsemi's Libero SoC v11.0 beta software, which includes a free Libero Gold license and comes preloaded with a uClinux demo. By using the included USB WiFi adapter, the kit has support for RaLink 5370 USB wireless radios, allowing uClinux to setup a wireless access point that serves DHCP WiFi connections.
Users can start a HTTPD server and then access the SmartFusion2 device via a smart phone web browser or other wireless device. Emcraft Systems' Linux-based development environment is also supported. The SmartFusion2 device is available on an Emcraft Systems miniature (34mm x 59mm) mezzanine form factor system-on-module (M2S-SOM), which connects to the SOM-BSB-EXT baseboard. The kit is USB powered, includes FlashPro4 programming and features the following user interfaces and capabilities:
- SmartFusion2 SoC FPGA in the FG896 package (M2S050T-FG896ES)
- 10/100 Ethernet interface and RJ-45 connector
- USB OTG interface and mini-USB connector
- USB based Wi-Fi module
- 64MB LPDDR, 16MB SPI flash
- User push-button connected to GPIO on the SOM
- Two user-controlled LEDs connected to GPIO on the SOM
- Breadboard area available for GPIO or FPGA I/O connection
- Power good LED indicating presence of the +3.3 V SOM power
- Reset push button, reset-out LED
- Depending on the design, can provide necessary power supply voltages (+5 V, +3.3 V, +1.5 V for power-optimized SOM operation) from external sources through dedicated pads on the breadboard
About SmartFusion2 SoC FPGAs Microsemi's next-generation SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, defense, aviation, and industrial and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM® Cortex™-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip. For more information about Microsemi's SmartFusion2 SoC FPGAs, visit www.microsemi.com/smartfusion2.
Avent Memec Hosts SmartFusion2 Events Throughout US Microsemi distributor Avnet Memec North America will host hands-on training sessions on SmartFusion2 with the new starter kits. Attendees will receive a SmartFusion2 starter kit at the completion of the training. For more information on the Avnet Memec North America events, visit www.em.avnet.com/sf2speedway.
About Microsemi Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new SmartFusion2 Starter Kit, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation