NEXTFLEX ANNOUNCES NEW AFFILIATED ALABAMA "NODE" TO SUPPORT GROWING NATIONAL HYBRID ELECTRONICS COMMUNITY

Node to provide regional supply chain support and catalyze additive and hybrid electronics development and commercialization

HUNTSVILLE, Ala., Oct. 15, 2025 /PRNewswire/ -- NextFlex^®, America's Hybrid Electronics Manufacturing Innovation Institute, today announced the launch of a new Alabama Node. The Alabama Node will accelerate the commercialization of hybrid electronics by boosting innovation, technology transition, and adoption.

NextFlex Nodes serve as regional hubs for collaboration, providing the industry and supply chain access to facilities, equipment, and infrastructure that fast-track hybrid electronics design, development, and manufacturing adoption. They also extend the reach of NextFlex's advanced manufacturing education and workforce development programs, while supporting the national mission to drive technology innovation, strengthen the U.S. manufacturing workforce, and promote strong and competitive advanced manufacturing in America.

"The launch of the Alabama Node represents another significant step toward realizing our national vision for hybrid electronics innovation and commercialization," said Dan Gamota, Executive Director of NextFlex. "By partnering with Auburn University and the State of Alabama, we're expanding the reach of hybrid electronics manufacturing collaboration and workforce development, while strengthening the nation's capacity to design, build, and deploy cutting-edge electronics for automotive, aerospace, and defense applications. Together, we're accelerating the pace of innovation and ensuring that U.S. manufacturing remains globally competitive for decades to come."

The Alabama Node will be led by Auburn University, working in close partnership with the State of Alabama and additional industrial and academic partners. A $20 million State of Alabama grant will fund electronics manufacturing infrastructure, analysis capabilities, and support technology, workforce, and economic development statewide.

Auburn University's Senior Vice-President for Research and Economic Development, Dr. Steve Taylor, said, "The establishment of the NextFlex Alabama Node at Auburn University will enable new mechanisms for small, medium, and large enterprises in the State of Alabama to achieve retrenchment of US domestic electronics manufacturing using additive-manufactured electronics. The Alabama Node has been built upon the work of Auburn University's Electronics Packaging Research Institute over the last 25 years, and more recently, as a Tier-1 Founding Member of the NextFlex Manufacturing Innovation Institute over the last 10 years. Auburn University's Prof. Pradeep Lall, a NextFlex Fellow, who led the establishment of the Alabama Node, is a world-renowned expert in additive-manufactured electronics and will serve as the Node's Director."

"Hybrid electronics are revolutionizing the automotive and aerospace sectors by delivering lightweight, sophisticated, and highly efficient systems that significantly elevate performance and safety. Whether it's touch control interfaces, advanced driver-assistance systems, or state-of-the-art avionics, hybrid electronics are at the forefront of innovation. These developments are also driving the electrification of vehicles and aircraft, resulting in electric ground and airborne platforms with greater fuel efficiency and lower emissions," said Pradeep Lall, MacFarlane Distinguished Professor and Alumni Professor at Auburn University, and the Academic Co-Lead of NextFlex's Automotive and Asset Monitoring Technical Working Groups.

Priority technology areas of focus for the NextFlex Alabama Node include advanced packaging for electronics in harsh environments and additive printed electronics. The Alabama Node is strategically positioned to strengthen regional ties, leveraging the state's robust commercial and defense manufacturing base in areas such as aerospace, automotive, and shipbuilding. By doing so, it will boost the competitiveness of the regional hybrid electronics supply chain and complement the capabilities of the NextFlex Technology Hub in San Jose, California.

This marks the fourth regional Node established by NextFlex, joining existing Nodes in New York, Massachusetts, and Missouri, underscoring the growing momentum of hybrid electronics across the nation.

About NextFlex
NextFlex is the nation's hub for hybrid electronics innovation and manufacturing readiness. As a public-private partnership and a DoD-sponsored Manufacturing Innovation Institute, NextFlex is partially funded by Air Force Research Laboratory Cooperative Agreement number FA8650-20-2-5506. NextFlex includes a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of U.S. manufacturing and commercialization of hybrid electronics. Since its formation in 2015, NextFlex and its members collectively facilitate innovation, narrow the manufacturing workforce gap, and promote sustainable manufacturing ecosystems. For more information, visit www.nextflex.us and follow NextFlex on LinkedIn.

About Hybrid Electronics
Hybrid Electronics are shaping the future of electronics manufacturing, delivering breakthrough solutions for PCB manufacturers and electronics systems integrators. By combining silicon ICs with novel additive printing processes and advanced materials, Hybrid Electronics enable lightweight, low-cost, and energy-efficient smart products with rapid time to market. These systems can be not only flexible, conformable, and stretchable, but also environmentally friendly—unlocking applications across consumer, commercial, and defense markets.

About Auburn University and the Electronics Packaging Research Institute (EPRI)
Auburn University is a nationally recognized land-grant institution in Auburn, Alabama, serving more than 30,000 students across 15 colleges and schools. Known for excellence in engineering, science, and innovation, Auburn drives research and economic growth across the state and nation. The Auburn University Electronics Packaging Research Institute (EPRI) leads advancements in microelectronics packaging and manufacturing through collaboration with industry, government, and academic partners. EPRI at Auburn University has extensive facilities for additive and subtractive electronics design, manufacturing, and testing. The institute is active in NextFlex projects and specializes in electronics for harsh environments, including automotive, military, and defense uses. For more information, visit www.auburn.edu.

C ontacts
NextFlex
Karen Savala, 408-797-2219
[email protected]

Auburn University
Jeremy D. Henderson, 334-844-3591
[email protected]

SOURCE NextFlex