Ceva Extends Wireless Connectivity IP Leadership as AI Moves to Connected Devices

IPnest ranks Ceva #1 in wireless interface IP with approximately 68% market share, 12 times that of the next-largest vendor, as the category grows approximately 14%

HSINCHU COUNTY, Taiwan, Nov. 2, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, today announced that it retained the #1 position in wireless interface IP in IPnest's September 2026 Design IP report. As AI expands across billions of connected devices, reliable, ultra-low-power wireless connectivity becomes essential for sharing data and context across them.

The category grew approximately 14% in 2025, and Ceva held 68% market share by IP revenue, 12 times that of the next-largest vendor. The result continues Ceva's leadership as documented in prior IPnest reports, which showed 67% share for 2023 and 68% for 2024. Ceva estimates that its wireless connectivity IP is used in approximately 30% of the world's Bluetooth-enabled IoT devices and 15% of Wi-Fi-enabled IoT devices shipped annually.

Through its Ceva-Waves portfolio, Ceva licenses Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP to semiconductor companies and OEMs building differentiated products. Its Bluetooth IP has more than 100 licensees, its Wi-Fi IP more than 60, and more than 30 customers have adopted both. Ceva is building on that reach by advancing Bluetooth High Data Throughput (HDT), developing Wi-Fi 8, and broadening its connectivity portfolio with PentaG-Edge, a 5G-Advanced modem IP subsystem for edge devices. These investments help customers bring intelligent, connected products to market across consumer electronics, automotive, industrial, PC and IoT applications, where devices increasingly need to exchange data with one another, networks and the cloud.

Wireless IP is an essential pillar of Ceva's Connect, Sense, and Infer strategy. Combined with Ceva's sensing IP and NeuPro NPUs, it gives chipmakers system-level IP for Physical AI, where the right AI model runs in the right place at the right time. Local inference handles latency- and power-sensitive work, while connectivity links each device to its peers and the cloud.

"AI is becoming an experience that follows people from one device to the next," said Ziv Hammer, Executive Vice President, Connectivity & Sensing Division at Ceva. "Each of those devices needs to exchange data and context, perceive its surroundings, and interpret what it perceives locally. Our sustained leadership position in wireless IP reflects the trust customers place in Ceva, and our multi-standard portfolio gives companies throughout the industry the connectivity they need to build the next generation of intelligent products."

Ceva will share its wireless connectivity and Physical AI roadmap at its technology symposium events in Hsinchu, Taiwan, on November 2 and in Shanghai, China, on November 5. For more information on Ceva-Waves wireless connectivity IP, visit https://www.ceva-ip.com/product/ceva-waves-links/.

Market share and vendor comparison are based on wireless interface IP revenue estimates in IPnest's September 2026 Design IP report.

About Ceva

Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.

With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

SOURCE Ceva, Inc.