TI high-temperature H.E.A.T. evaluation module speeds safe testing of electronics for harsh and hot environments

DALLAS, June 23, 2011 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the H.E.A.T. (harsh environment acquisition terminal) evaluation module (EVM), the industry's first high-temperature data acquisition system, which includes a complete set of TI signal chain components qualified for extreme temperature operation from -55 degrees Celsius (C) to 210 degrees C. The H.E.A.T. EVM is test-oven ready and qualified to operate up to 200 hours at oven temperatures of up to 200 degrees C. It accepts eight channels of analog data and conditions, digitizes and processes these signals for a variety of applications in ruggedized, high-temperature environments including downhole drilling, jet engines and heavy industrial applications.

The H.E.A.T. EVM eliminates the need for expensive up-screening and qualification testing of industrial-grade components for temperature ranges outside their datasheet specifications. The tool allows manufacturers to develop applications with components qualified for harsh environments quickly and safely and cuts development, testing and qualification time by up to one year. For H.E.A.T. EVM details or to order, see www.ti.com/heat-pr

Key features and benefits of the H.E.A.T. EVM

• Six channels optimized for temperature, pressure sensors and accelerometers plus two general-purpose channels (fully differential and single-ended).
• Comprehensive set of components qualified for operating temperatures from -55 degrees C to 210 degrees C and guaranteed for at least 1,000 hours operating life.
  • ADS1278-HT – octal simultaneous sampling 24-bit 128-KSPS ADC
  • SM470R1B1M-HT – ARM7 microcontroller
  • OPA211-HT – low-noise, precision operational amplifier
  • OPA2333-HT – low-power, zero-drift series operational amplifier
  • INA333-HT – zero-drift, low-power, single-supply instrumentation amplifier
  • THS4521-HT – low-power, fully differential amplifier
  • REF5025-HT – 2.5-V precision voltage reference
  • SN65HVD233-HT – CAN transceiver
  • SN65HVD11-HT – RS-485 transceiver
• Made with polyimide material, and incorporating high-temperature rated passive components and high-temperature solder material, the EVM is test oven ready and can withstand temperatures of up to 200 degrees C for 200 operating hours.

Tools, availability and pricing

The H.E.A.T. EVM complements TI's full portfolio of analog and embedded processing products for high-temperature, high-reliability environments. The board is immediately available for $5,749.

A H.E.A.T. EVM User Guide is available for download, describing initialization and calibration of the hardware, channel configuration and more.

All individual high-temperature semiconductor components in the H.E.A.T. EVM are available in both a high-temperature ceramic package, and in Known Good Die (KGD) for smallest package integration.

Find out more about TI's H.E.A.T. EVM and high-temperature portfolio

• Learn more and order the H.E.A.T. EVM: www.ti.com/heat-pr
• Explore TI's full portfolio of high-temperature ICs and related system block diagrams: www.ti.com/hightemp-pr
• Download TI's High-Temperature Guide: www.ti.com/hightempguide-pr
• Ask questions, share knowledge and help solve problems with fellow engineers in the TI E2E™ High Reliability Community: www.ti.com/hirelforum-pr

About high-reliability and high-temperature components from TI

Customers count on TI's high-reliability expertise and the industry's broadest portfolio of analog and embedded processing products to provide complete semiconductor solutions and value-added services for challenging or extreme environments in industrial, space, aerospace, defense, medical and consumer markets. TI offers solutions and services for extended temperature ranges for -55 degrees C up to 220 degrees C, radiation hardened designs, baseline control, extended product life cycles, obsolescence mitigation, quality conformance to military standards, ITAR flow support and in-house process technology. TI's high-reliability packaging capabilities include ceramic, plastic and Known Good Die (KGD) wafer solutions. More at www.ti.com/hirel

About Texas Instruments

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SOURCE Texas Instruments Incorporated