UMC Enters High Volume Touch IC Production Using Foundry Industry's First 0.11um eFlash Process

HSINCHU, Taiwan, Sept. 22, 2015 /PRNewswire/ -- United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process. The specialized technology, first introduced by UMC in late 2012 as the foundry industry's first, true 12-volt aluminum back-end-of-line (BEoL) process, is developed for next generation touch controller IC and IoT applications. Compared to 0.18um, 0.11um provides smaller and faster logic devices for higher performance, while enabling the integration of higher density embedded Flash and SRAM for use in microcontrollers for touch-screen products of all sizes.

Kurt Huang, senior director of corporate marketing at UMC, said, "Touch panels have become the predominant interface used for today's electronics. A key advantage of UMC's touch platform solution is that we provide the 0.11um eFlash with proprietary flash macro design services to IC designers. We also offer the best cost vs. performance by incorporating an aluminum BEoL process to serve the highly competitive touch IC market. In addition, just like our 0.18um eFlash, support for true 12-volt power meets the high signal-to-noise ratio (SNR) requirements needed for today's larger touch screens and "hovering" applications used during web navigation on touch surfaces."

UMC's 0.11um touch IC platform delivers more than three times the SNR improvement over today's widely used 3.3V solution, allowing IC designers to create a new generation of enhanced touch interface products. The foundry has extensive experience manufacturing touch controller ICs, with more than 30 touch customers in production at the foundry and over 40 million touch ICs shipped per month. The 0.11um process is developed on 8-inch manufacturing using the most aggressive aluminum BEoL technology, allowing touch IC designers to enjoy lower NRE and related costs to increase market competitiveness. UMC also provides in-house flash IP to speed time-to-market and facilitate customization to address evolving market trends. An ultra-low leakage (uLL) process is currently being developed to further reduce core current on devices and SRAM by up to four times.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q100 Grade-0 automotive industry manufacturing capabilities. UMC's 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

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