NEW YORK, Feb. 23, 2021 /PRNewswire/ -- Technavio announces the release of its latest report on the ceramic packaging market. The market is segmented by end-user (consumer electronics, automotive, healthcare, and others), material (glass-ceramic packaging and non-glass ceramic packaging), geography (APAC, Europe, MEA, North America, and South America). Get a Free Sample Report Delivered Instantly
The report offers an in-depth analysis of recent developments, changes in market regulations, product approvals, product launches, and the market behavior across various segments.
Ceramic Packaging Market: Key Findings
- Ceramic packaging market value to grow by USD 6.74 billion at over 7% CAGR during 2021-2025
- 74% of market growth to originate from APAC during the forecast period
- Based on the end-user, the consumer electronics segment will offer maximum opportunities for vendors during the forecast period
- Ceramic packaging market is expected to have a neutral impact due to the spread of COVID-19
Ceramic packaging Market: Growth Drivers
The significant growth in the consumer electronics industry is one of the prime factors driving the growth of the market. Factors such as strong economic growth, increasing literacy rate, and rising purchasing power are increasing the demand for smartphones. In addition, advances in wireless mobile telecommunication technology, such as IoT, 3G, and 4G have further fueled the adoption of other smart devices globally. Also, the demand for common consumer electronics products, such as audio and video systems, electronic accessories, multimedia players, digital cameras, camcorders, refrigerators, and washing machines is increasing significantly across the world. As a result of these factors, the consumption of ceramic packaging is likely to increase, thereby driving the growth of the market during the forecast period.
"Growth of medical and healthcare devices industry and the increasing use of electronics in automobiles will further boost market growth during the forecast period", says a senior analyst at Technavio.
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Ceramic Packaging Market: Major Vendors
Aerospace Semiconductor Inc.
Aerospace Semiconductor Inc. operates its business through the Unified segment. The company offers different package which may improve the thermal performance, pinout configuration, electrical performance, or mechanical size and shape. Some of these packaging include multilayer ceramic packages, pressed ceramic packages, and metal can packages.
AMETEK Inc. operates its business through segments such as Electronic Instruments and Electromechanical. The company offers high performance solutions for advanced electronic application. It offers glass-to-metal seals (GTMS), glass-to-fiber seals (GTFS), ceramic to metal seal (CTMS) and high-temperature co-fired ceramics (HTCC) for hermetic packaging.
Aptasic SA operates its business through the Unified segment. The company offers a large panel of packaging solutions from low volume to mass production including laminate substrate packages, standard package families, discrete package families, ceramic packages, specific packages, etc.
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