$16.9 Bn High Density Interconnect Market - Global Forecast to 2023: Rising Demand For Connected Devices & Evolution Of 5G Technology
DUBLIN, March 26, 2019 /PRNewswire/ -- The "High Density Interconnect Market by Product (4-6 Layers HDI, 8-10 Layers HDI, and 10+ Layers HDI), End User (Automotive, Consumer Electronics, Telecommunications, Medical), Application, and Geography - Global Forecast to 2023" report has been added to ResearchAndMarkets.com's offering.
The market for HDI is expected to grow from USD 9.46 billion in 2018 to USD 16.88 billion by 2023, at a CAGR of 12.29% from 2018 to 2023.
High density interconnect (HDI) is a technology that provides for a much denser construction of a board by the ability to place increasingly smaller components in closer proximity, which also results in shorter paths between components. HDI technology is far more than the miniaturization of circuit design. HDI PCB is used to reduce size and weight, as well as to enhance the electrical performance of devices. HDI PCBs are made through microvia and buried vias and sequential lamination with insulation materials and conductor wiring for a higher density of routing.
Factors driving the growth of the HDI market include growing demand for smart consumer electronics and wearable devices and increasing adoption of advanced electronics and safety measures in the automotive vertical.
The increasing usage of consumer electronics devices, such as smartphones, portable computers, navigation devices, media players, digital cameras, gaming consoles, and e-readers, is a major driver for the growth of the HDI market. HDI boards are preferred for applications where space, performance, reliability, and weight are concerns. This makes them more suitable for nearly every application related to consumer electronics. The automotive vertical requires PCBs which have high reliability, long life service, and are cost effective. PCBs are used in many ways in the automotive industry and have changed the way people drive. An increasing shift toward sophisticated safety systems, electric/hybrid vehicles, and infotainment systems in the automotive vertical is driving the higher implementation of HDI PCBs in automobiles.
Opportunities for this market include rising demand for connected devices to implement IoT and the evolution of 5G technology. However, rapid changes in technology and increasing functionality of electronic devices are some challenges for the growth of the HDI market.
The competitive landscape shows that most players have adopted acquisitions, collaborations, and partnerships as the primary growth and competitive strategies between January 2016 and June 2018. Other strategy adopted by the players are product developments and expansions.
Key Topics Covered:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Premium Insights
4.1 Attractive Opportunities In HDI Market
4.2 HDI Market, By Product Type
4.3 HDI Market In APAC, By Application And Country
4.4 HDI Market, By Region
4.5 Country-Wise Analysis Of HDI Market
4.6 HDI Market, By End User
5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Growing Demand For Smart Consumer Electronics And Wearable Devices
5.2.1.2 Increasing Adoption Of Advanced Electronics And Safety Measures In Automotive Vertical
5.2.2 Restraints
5.2.2.1 Complex Manufacturing Process
5.2.3 Opportunities
5.2.3.1 Rising Demand For Connected Devices
5.2.3.2 Evolution Of 5G Technology
5.2.4 Challenges
5.2.4.1 Rapid Changes In Technology And Increasing Functionality Of Electronic Devices
5.3 Value Chain Analysis
6 HDI Market, By Product
6.1 Introduction
6.2 4-6 Layers HDI
6.2.1 Communications Devices And Equipment Likely To Be Major Consumer Of 4-6 Layers HDI
6.3 8-10 Layers HDI
6.3.1 HDI Market For 8-10 Layers HDI To Witness Second-Highest CAGR During Forecast Period
6.4 10+ Layers HDI
6.4.1 10+ Layers HDI To Occupy Largest Share Of HDI Market During Forecast Period
7 HDI Market, By End User
7.1 Introduction
7.2 Automotive
7.2.1 Automotive Segment To Witness Second-Highest CAGR In HDI Market During Forecast Period
7.3 Consumer Electronics
7.3.1 Computer And Display Application To Account For Largest Share Of HDI Market For Consumer Electronics During Forecast Period
7.4 Telecommunication
7.4.1 Telecommunication To Hold Largest Share Of HDI Market During Forecast Period
7.5 Medical
7.5.1 HDI Market For Medical To Register Highest CAGR During Forecast Period
7.6 Others
7.6.1 10+ Layers To Witness Highest CAGR In HDI Market For Other End Users During Forecast Period
8 HDI Market, By Application
8.1 Introduction
8.2 Automotive Electronics
8.2.1 Increasing Number Of Applications, Such As Autonomous Driving And Infotainment, To Propel Demand For HDI PCBs In Automotive Electronics
8.3 Computer And Display
8.3.1 Consumer Electronics Segment To Account For Largest Share Of HDI Market For Computer And Display During Forecast Period
8.4 Communication Devices And Equipment
8.4.1 Communication Devices And Equipment To Account For The Largest Share Of The HDI Market During Forecast Period
8.5 Audio/Audiovisual (Av) Devices
8.5.1 RoW To Witness Second-Highest CAGR In HDI Market For Audio/Av Devices
8.6 Connected Devices
8.6.1 Connected Devices To Exhibit Second-Highest CAGR In HDI Market During Forecast Period
8.7 Wearable Devices
8.7.1 Market For Wearable Devices To Grow At Highest CAGR During Forecast Period
8.8 Others
8.8.1 Medical Segment To Register Highest CAGR In HDI Market For Other Applications During Forecast Period
9 HDI Market, By Geography
10 Competitive Landscape
10.1 Overview
10.2 Market Share Analysis
10.3 Competitive Leadership Mapping
10.3.1 Visionary Leaders
10.3.2 Dynamic Differentiators
10.3.3 Innovators
10.3.4 Emerging Companies
10.4 Product Excellence
10.5 Business Excellence
10.6 Competitive Scenario
10.6.1 Acquisitions, Collaborations, And Partnerships
10.6.2 Expansions
11 Company Profiles
- Austria Technologie & Systemtechnik
- Bittele Electronics
- CMK
- Compeq Co.
- Daeduck GDS Co.
- Epec
- Fujitsu Interconnect Technologies
- Kingboard Holdings
- Meiko Electronics Co.
- Multek
- NCAB Group
- Nod Electronics
- Rush PCB
- Shenzhen Kinwong Electronic Co.
- Sierra Circuits
- TTM Technologies
- Unimicron
- Wuzhu Technology Co.
- Wrth Elektronik Circuit Board Technology
- Zhen Ding Tech.
For more information about this report visit https://www.researchandmarkets.com/research/6xls2h/16_9_bn_high?w=5
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