3D Glass & Silicon Interposers

NEW YORK, Oct. 8, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

3D Glass & Silicon Interposers

http://www.reportlinker.com/p01008832/3D-Glass--Silicon-Interposers.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Glass_Manufacturing

Why and how 2.5D integration will impact more than 15% of the IC substrate business by 2017

2.5D AND 3D INTEGRATION IS SET TO BE A LONG-LASTING TREND IN THE SEMICONDUCTOR INDUSTRY

In this 2012 edition of that report, we provide more evidence of our findings from two years ago: after refining the applications and drivers of 3D interposers and 2.5D integration with the use of detailed forecasts, Yole Développement estimates that far from being a stepping-stone technology to full 3D integration, 3D interposers and 2.5D integration is emerging as a mass volume, long-lasting trend in the semiconductor industry. 

THE BUSINESS GENERATED BY THE 2.5D INTERPOSER SUBSTRATE WILL GROW RAPIDLY, TO AN EXPECTED TOTAL VALUE OF $1.6B IN 2017 $1.6B STRONG DIGITAL DRIVERS WILL SHIFT TECHNOLOGY AND SUPPLY CHAIN PARADIGMS

Also, we show evidence that this emerging infrastructure, which was initially focused on MEMS and sensors, is shifting paradigms to logic modules driven by stringent electrical and thermal performance requirements. As a result, the demand for interposers is shifting to fine-pitch 300mm diameter silicon wafers and high-accuracy flip chip micro-bumping and assembly. 

Graphical Processor Units for gaming and computing and high-performance ASICs and FPGAs are paving the way, with high volumes first expected in 2013. As these drivers increasingly appear as must-haves to serve the ever-increasing need for larger electrical bandwidths imposed by graphical sophistication, cloud computing and many more end uses, leading companies are busy creating the appropriate infrastructure. 

The semiconductor supply chain is adapting to these significant in substrate technologies. 

Wafer foundries appear to be the most able entities to offer manufacturing solutions on the open market, both technically and in terms of capex investment capabilities. But their ambition extends far beyond the manufacturing of wafers, and into assembly and test services as well. 

Concurrently, some of the major IDMs are preparing to exploit their wide capabilities and to enter the open foundry and assembly services side for 2.5D and 3D integration based on such new type of IC package substrate technologies.

IS COST REALLY AN ISSUE IN THE LONG TERM?

Significant investments began in 2012, with more than $150M capex expected and driven by both wafer foundries (TSMC, Global Foundries) and OSATs (Amkor, ASE). No one, especially in Taiwan, wants to be left behind in this high-growth story, as it clearly appears to be a central piece of the increasing middle-end business and infrastructure, halfway between the front-end silicon foundries and the back-end assembly & test facilities.

The question now is: "can anyone build a profitable business case to support the growth of 2.5D/3D interposers"? In other words, how long will it take for investing companies to be paid back, while offering affordable prices to their customers? Yole expects the expansion model of this new technology trend to follow a traditional path: first, high-value modules are expected to use the technology to offer unprecedented high performance, followed by higher volume applications. 

The nice thing about 2.5D interposers is that they do not only allow for unprecedented performance: they can do so for a much lower cost than any competing technology. Through a few cost cases in this report, we demonstrate that cost can be a strong adoption driver too. No, silicon and glass interposers are not "additional dead pieces of hardware in the package" -- on the contrary, they are among the top five key elements of the semiconductor roadmap for the decade 2010-2020.

KEY FEATURES OF THE REPORT

-Detailed view, by product and device type, of the key applications driving the commercialization of  2.5D interposer substrates-Detailed 2011 – 2017 market forecast in both unit and wafer shipments, including a revenues analysis of Middle-end to Back-end assembly & test-related activities-Overview of the positioning of different key players, and an understanding of supply chain challenges happening between the different business models in place-Technology trends & roadmaps, including the topic of glass interposers and the possible move to large PANEL area processing, leveraging LCD or PCB infrastructures-Detailed cost structure of several different 2.5D interposer packages: system-level evaluation of several different case scenarios, analyzing the expected cost decrease trend over five years-Analysis of the required investment in terms of capex between 2011 - 2017

COMPANIES CITED IN THIS REPORT

Altera, Amkor, Allvia, Apple, Asahi Glass Corporation (AGC),  ASE, Bosch, Avago Technologies, CEA-Leti, Cisco, Dai Nippon Print (DNP), Dalsa, EPWorks, eSilicon, Flip Chip International (FCI), Fraunhofer Institüt, Fujikura, Fujitsu, GlobalFoundries, GlobalUniChip (GUC), Hoya,Huawei, Ibiden, IBM, IME, IMEC,  Intel, ipdia, LG Innotek, LSI Logic, Mediatek, Micron, Murata, Nepes, Nokia, Oracle, PlanOptik, Qualcomm, Samsung, Sematech, Semtech, Sensonor, Shinko, Sibdi, Silex, Sony, SPIL, StatsChipPac, STMicroelectronics, Suss Microtec, TDK-Epcos, Tecnisco, Teledyne, Texas Instruments, Tezzaron, tMt, Toshiba, TSMC, UMC, Unisem, Viagan, VisEra, VTI Technologies, Xilinx and more…

Table of Contents

Executive Summary p.15

Supply Chain Analysis p.42

Market Forecasts p.54

2010-2017  wafer forecasts p.57

2010-2017 unit forecasts p.76

2010-2017  revenue (M$) forecasts P.90

2011 interposer wafer capacity p.96

Applications and Drivers p.102

System partitioning interposers p.107

MEMS & sensors 3D capping interposers p.138

Interposers for CMOS image sensors p.158

3D silicon substrates for High-Power LEDs p.167

3D integrated passive devices p.196

Misc. Glass/silicon package substrates    p.207

Technologies and Roadmaps p.215

Technologies and design rules for interposers, by  applications p.216

Interposer manufacturing process flow p.233

Assembly and test p.236

Reliability p.250

Design and modeling p.252

Focus on Glass interposers p.256

Focus on PANEL interposers p.263

Roadmaps p.282

Technology Alternatives    p.292

Organic interposers strike back !

2.5D integration with fan-out WLP (eWLB)

3D Interposers and 2.5D ModulesCost Case 

Studies p.302

Cost model and cost down roadmap of a large

2.5D FPGA structure p.304

Cost model of a 2.5D APE for tablets p.325

Capex Investment Forecasts p.330

Conclusions p.337

APPENDIX p.344

To order this report:Glass_Manufacturing Industry: 3D Glass & Silicon Interposers

Nicolas Bombourg

Reportlinker

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