$4.5 Bn Hermetic Packaging Market - Global Forecast to 2022
DUBLIN, Feb. 23, 2018 /PRNewswire/ --
The "Hermetic Packaging Market by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages), Type (Ceramic-Metal and Glass-Metal Sealing), End-User Industry, Geography - Global Forecast to 2022" report has been added to ResearchAndMarkets.com's offering.
The overall hermetic packaging market is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52 Billion by 2023, growing at a CAGR of 6.80% between 2018 and 2023.
The key factors driving this market is growing need of protecting highly sensitive electronic components from extraneous particles, such as moisture, atmospheric pressure, and soil/grime; and strong demand for hermetically packaged components from the industries such as automotive, electronics, and aeronautics.
This report segments the hermetic packaging market on the basis of configuration, type, application, industry, and geography. The market, on the basis of configuration, is driven by high adoption rate of the multilayer ceramic packages for high frequency applications such as data communication, wireless communication, and optical communication, as multilayer ceramic packages offer better hermeticity than other configurations for high-frequency applications, and also enable a large number of electrical feedthroughs within small spaces.
The market in APAC is expected to hold the largest market share and also projected to grow at the highest CAGR between 2018 and 2022. Increasing energy needs (backed by the high GDP growth rates) in developing countries, such as China and India, is creating huge opportunities for manufacturers of hermetically packaged electronic components in APAC. China, Japan, and India, among others, are now stepping up in space research activities, such as satellite launches and space exploration missions, which is expected to add to the high growth of the hermetic packaging market in APAC during the forecast period.
The major challenges for the companies in the market are the high infrastructure cost incurred by controlled and regulated packaging environment and competition from near-hermetic packaging. SCHOTT AG (Germany), AMETEK (US), Amkor Technology (US), Texas Instruments (US), Teledyne Microelectronics (US), Kyocera Corporation (Japan), Materion Corporation (Japan), Egide (France), Micross Components (US), Legacy Technologies Inc. (US) are the major players that adopt various strategies such as new product developments; mergers and acquisitions; partnerships, agreements, and collaborations to cater to the needs of customers.
Key Topics Covered:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Premium Insights
5 Market Overview
6 Hermetic Packaging Market, By Configuration
7 Hermetic Packaging Market, By Type
8 Hermetic Packaging Market, By Application
9 Hermetic Packaging Market, By Industry
10 Geographic Analysis
11 Competitive Landscape
12 Company Profiles
- Ametek
- Amkor
- CHI
- Coat-X
- Complete Hermetics
- Egide
- Hermetic Solutions Group
- Intersil
- Kyocera
- Legacy Technologies
- Materion
- Micross Components
- Primoceler
- SGA Technologies
- SHP
- Schott
- Stratedge
- Teledyne Microelectronics
- Texas Instruments
- Willow Technologies
For more information about this report visit https://www.researchandmarkets.com/research/9bnzk7/4_5_bn_hermetic?w=5
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SOURCE Research and Markets
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