Advanced IC Packaging Technologies, Materials, and Markets Report 2015-2019

Jul 06, 2015, 12:40 ET from Research and Markets

DUBLIN, June 29, 2015 /PRNewswire/ --

Research and Markets ( has announced the addition of the "Advanced IC Packaging Technologies, Materials, and Markets - 2015" report to their offering.

Advanced IC Packaging Technologies, Materials and Markets, 2015 Edition, captures the latest technology and market trends of the IC packaging industry by focusing on the most advanced packaging products and technologies - those most critical to success in developing cutting-edge products and maintaining technological leadership.

The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable electronic systems. Today's users ask for products with more functionality, added performance, higher speed, and smaller form factors. Advances in IC packaging technologies are providing solutions to meet these demands through a variety of techniques that result in ICs that are more powerful and provide greater functionality, while fitting into ever smaller and more highly integrated form factors. Multichip packages are on the leading edge of silicon integration, while advances in interconnection and substrate design are providing additional opportunities to improve package density. The future is bright for IC packaging.

Report Coverage:

- Stacked Packages
- System-in-Packages
- Interconnection Technologies
- Through-Silicon-Vias (TSV)
- 2.5D and 3D Integration
- Multi-row QFNs
- Fan-out WLPs

Report Highlights:

- Industry Outlook
- Market Analysis and Forecasts, 2013-2019
- Multichip Packaging Technology Trends
- Key Application Forecasts
- Company Profiles

Key Topics Covered:

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Overview of IC Packaging Markets Worldwide

Chapter 4: Interconnection Technologies

Chapter 5: Multichip Packages

Chapter 6: System-in-Package Solutions & Substrate Materials

Chapter 7: Advanced Single-Chip Packages

Chapter 8: Company Profiles

- 3D Plus, Inc.
- Advanced Semiconductor Engineering, Inc.
- Amkor Technology, Inc.
- CONNECTEC Japan Corporation
- Carsem, Inc.
- ChipMOS Technologies (Bermuda), Ltd.
- Deca Technologies
- FlipChip International, LLC
- HANA Micron Co., Ltd.
- Interconnect Systems Inc. (ISI)
- Palomar Technologies
- Powertech Technology, Inc.
- SPEL Semiconductor, Ltd.
- STATS ChipPAC, Ltd
- Shinko Electric Industries Co, Ltd
- Signetics Corporation
- Siliconware Precision Industries Co.
- United Test and Assembly Center, Ltd.
- Xintec, Inc.

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Media Contact: Laura Wood , +353-1-481-1716,

SOURCE Research and Markets