PUNE, India, August 28, 2015 /PRNewswire/ --
Global and China Advanced Packaging Market Report, 2014-2015 offers a study of 24 advanced packaging vendors, technical trends as well as analysis of global and Chinese semiconductor market and advanced packaging industry.
Complete report on advanced packaging market spread across 170 pages, reviewing 24 companies as well as supported with 243 charts is now available at http://www.rnrmarketresearch.com/global-and-china-advanced-packaging-industry-report-2014-2015-market-report.html .
Global outsourced semiconductor assembly and test (OSAT) market was valued at about USD27.1 billion in 2014, expanding by 7.9% from 2013, is expected to swell by 7.0% to USD29 billion in 2015, and will further slow down to 3.8% in 2016, but start to accelerate with growth rate of 6.0% in 2017. Within advanced packaging market, memory packaging and test is the largest single-product packaging and test in OSAT field, HMC and HBM are expected to spring up after 2017, accelerating the expansion of OSAT. It is predicted that SiP and ePoP will be main drivers behind OSAT growth in 2015 and 2016.
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also advanced packaging market and other companies that specialize in silicon interposer layers.
According to this advanced packaging market report, two pronounced trends of OSAT industry are: 1) Revenue growth of large companies far exceeds that of small ones, as the former has more funding for R&D than the latter, and OSAT industry hungers for new technologies. Long-term development of the companies cannot be realized without adequate technology accumulation. 2) Chinese OAST companies grow at the fastest rate, largely due to strong liquidity and hot stock market, which provide strong financial backing for OSAT companies, thus giving them adequate funds for R&D and capacity expansion. Chinese OSAT companies, by virtue of powerful weapon of capital, enter the stage of rapid development, and will boost its scale and technical competence via more acquisitions.
Advanced packaging market companies and test vendors mentioned in this research report include ASE, Amkor, SPIL, STATS ChipPAC, PTI, Greatek, ChipMOS, KYEC, Unisem, FATC, JECT, UTAC, Lingsen Precision, Nantong Fujitsu Microelectronics, Walton Advanced Engineering, Chipbond, J-DEVICES, MPI, STS Semiconductor, Signetics, Hana Micron, NEPES, Tianshui Huatian Technology and China Wafer Level CSP. Order a copy of Global and China Advanced Packaging Industry Report, 2014-2015 market research at http://www.rnrmarketresearch.com/contacts/purchase?rname=394445 .
The downstream markets of IC packaging segment discussed as a part of advanced packaging market analysis in this research cover global memory market, supply and demand of DRAM, supply and demand of NAND, global mobile phone market, global mobile phone industry, Chinese mobile phone market, laptop computer market, tablet pc market and server market. A dedicated chapter to advanced packaging market and test industry covers information on packaging & test industry size, middle-end packaging & test industry, China semiconductor packaging & test industry, ranking of Chinese semiconductor packaging & test vendors, semiconductor test, ranking of global packaging & test vendors, foundry industry size, Chinese IC market, China semiconductor industry, Chinese government's supportive policies for semiconductor industry, recent M&As in China's semiconductor field, forecast of China IC industry development and development goals of China foundry industry.
Another market research, on same lines, titled Global Advanced Packaging Industry Report 2015 is spread across 182 pages and profiles companies like Amkor, ASE, Stats Chippac, Chipmos, Greatek, KYEC, PTI, SPIL, Lingsen, Walton, Nantong Fujitsu, Unisem, UTAC, JECT, FATC, Signetics, Tianshui Huatian Technology, Hana Micron, NEPES, STS Semiconductor, J-DEVICES, MPI, China Wafer Level CSP and Chipbond. Supported with 87 tables and figures, this report provides 2015-2020 forecasts for advanced packaging market capacity production overview, production market share analysis, sales overview, supply sales and shortage, import export consumption as well as cost price production value gross margin. Comprehensive table of contents and more on this research is available at http://www.rnrmarketresearch.com/global-advanced-packaging-industry-report-2015-market-report.html .
Explore more reports on packaging market at http://www.rnrmarketresearch.com/reports/manufacturing-construction/packaging .
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