BeSang and SK Hynix Sign Patent License Agreement

Oct 29, 2013, 16:52 ET from BeSang Inc.

BEAVERTON, Ore., Oct. 29, 2013 /PRNewswire/ -- BeSang Inc., the pioneer in TRUE 3DTM IC solutions, announced today it has signed a patent license agreement with SK hynix Inc. This license agreement covers the use of BeSang's patented innovations to be implemented in a broad range of 3D IC products offered by SK hynix Inc.   

"SK hynix is a top global semiconductor industry leader. Therefore, SK hynix is an important customer and this agreement validates the strength of BeSang's TRUE 3DTM IC solutions," said Dr. Sang-Yun Lee, CEO of BeSang Inc. "We look forward to the opportunity to expand our customer relationships beyond patent license agreements to showcase our technical contributions and know-how with customers."

BeSang's TRUE 3DTM IC technology enables vertical stacking of multiple device layers, and offers low cost and high-performance solutions to CPU, DSP, GPU, ASIC, FPGA, SoC, DRAM, SRAM, flash, image sensor, and SSD applications. BeSang has successfully demonstrated its disruptive TRUE 3DTM IC technologies in 2008.

About BeSang Inc.

BeSang is a pioneer in the design, development, and delivery of unsurpassed three-dimensional (3D) IC solutions, providing unmatched process and design technologies for TRUE 3DTM IC as well as technology licenses to customers. BeSang provides high-value intellectual properties related to its proprietary TRUE 3DTM ICs. The fabless semiconductor company is headquartered in Beaverton, Oregon, USA. Additional information is available at

SOURCE BeSang Inc.