Calling All Chipheads: DesignCon Announces 2011 Program

First Design Engineering Event of the Year Opens January 31 - February 3, 2011.

Oct 18, 2010, 14:00 ET from EE Times Group

SAN FRANCISCO, Oct. 18 /PRNewswire/ -- EE Times Group, a UBM company and the daily source of essential business and technical information for the electronics industry's decision makers, today announced the conference program for DesignCon, historically the season opening event for the electronics design community. The annual conference and trade show begins January 31st at the Santa Clara Convention Center, Santa Clara, Calif., and runs through February 2nd, with the companion Exhibition running February 2nd and 3rd. Agilent Technology has been named the event's Host Sponsor, and will be holding a half-day educational forum on January 31st and February 1st.



DesignCon, the industry's premiere conference for design engineers, is under the new management of the EE Times Group who promises to build on the excellent reputation established by the conference since 1994. Conference chairs anticipate more than 100 tutorials and technical sessions will be presented addressing critical issues around RF and signal integrity, PCB design tools, design verification tools, interconnect technologies, semiconductor components and ICs and other important topics. Sponsors to date include Agilent, 3M, Amphenol, SST of America, FCI, Hirose, LeCroy, Mentor Graphics, Rambus, Samtec, Sigrity, Tektronix, and Tyco Electronics. More information about the sessions, panels and keynotes is available on the new DesignCon website:

"DesignCon has established its leadership position and credibility by delivering a highly technical conference developed by engineers for engineers," said Ron Wilson, EE Times director of content and media, events. "We will build on success of this conference creating an interactive environment for engineers to engage with peers from industry leading companies and institutions allowing them to share ideas and learn from each other as they create tomorrow's products."

Companies interested in sponsorships or exhibiting at DesignCon should contact Sean Raman at or at (415) 947-6622 for more information. 

About EE Times Group (

EE Times Group is the global leader in media and marketing solutions for the electronics industry. EE Times Group delivers results for the key influencers and decision makers involved in the design, development and commercialization of technology through its market leading brands, peer communities and professional education services. More than 1.1 million engineering professionals engage with EE Times Group brands which include EE Times, TechOnline, DesignLines and across the globe to accelerate technology sales. The international electronics community gathers at EE Times Group's market leading events such as the Embedded Systems Conferences, DesignCon and ARM Technology Conference to share, learn, discuss, and advance the critical issues and challenges facing the electronics industry. Additionally, EE Times Group provides end-to-end services ranging from next-generation marketing, integrated media, custom solutions and research. EE Times Group is part of UBM (UBM.L) a global provider of media and information services for professional B2B communities and markets.

About United Business Media Limited

UBM (UBM.L) focuses on two principal activities: worldwide information distribution, targeting and monitoring; and, the development and monetization of B2B communities and markets. UBM's businesses inform markets and serve professional commercial communities -- from doctors to game developers, from journalists to jewelry traders, from farmers to pharmacists -- with integrated events, online, print and business information products. Our 6,500 staff in more than 30 countries are organized into specialist teams that serve these communities, bringing buyers and sellers together, helping them to do business and their markets to work effectively and efficiently. For more information, go to


Susan Cain

Linda Uslaner

Cain Communication

EE Times Group



SOURCE EE Times Group