Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC

First production deployment of Ceva's NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices

ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ -- As AI becomes embedded across the physical world, workloads are increasingly being processed where they can run most effectively and efficiently, from the cloud to the device itself. For Physical AI systems that must sense, interpret and respond to their surroundings in real time, this is driving greater intelligence directly into power-constrained edge devices. Ceva, Inc. (NASDAQ: CEVA), the leader in silicon and software IP for the Smart Edge, today announced that Mobilint, a leading AI semiconductor company, has deployed Ceva's SensPro™ AI DSP and NeuPro-Nano™ NPU in its REGULUS edge AI System-on-Chip (SoC), marking the first production deployment of Ceva's NeuPro NPU family.

Designed as a standalone processor for on-device AI, REGULUS integrates Ceva's SensPro AI DSP and NeuPro-Nano NPN32 NPU within Mobilint's highly integrated processing architecture. Delivering 10 TOPS of AI performance at under 3W and supporting up to 8GB of memory, REGULUS is designed for real-time AI across power- and space-constrained applications including robotics, drones, machine vision, smart cameras and IoT devices.

The multi-engine architecture enables different sensing and AI workloads to run on the processing engine best suited to the task. SensPro provides programmable processing for sensing and signal-processing workloads, while NeuPro-Nano provides highly efficient neural processing for always-on inference use cases. Together, these technologies complement Mobilint's proprietary AI processing architecture, adding flexible sensing and inference capabilities to address the diverse and evolving requirements of Physical AI devices.

"REGULUS brings together the specialized processing capabilities needed to run sophisticated AI workloads directly on the device within very tight power constraints," said Dongjoo Shin, CEO of Mobilint. "Ceva's SensPro and NeuPro-Nano add flexible sensing, signal processing and inference capabilities to REGULUS, helping us address the diverse workloads our customers need to build the next generation of intelligent edge devices."

REGULUS is already enabling commercial products, including Mobilint's MLD-R1 AI USB accelerator, first previewed at COMPUTEX 2026 and now shipping. Designed to add on-device AI to existing systems, MLD-R1 supports computer vision, video analytics and generative AI workloads for applications including smart factories, robotics, machine vision, security, medical devices and digital signage, with support for widely used AI frameworks and ecosystems including PyTorch, ONNX, Hugging Face, TensorFlow, TFLite and Keras.

"REGULUS marks an important milestone for Ceva as the first production deployment of our NeuPro NPU family, demonstrating the progress we are making in bringing our AI technology into commercial silicon," said Yaron Galitzky, Executive Vice President and General Manager, AI Division at Ceva. "Together, NeuPro-Nano and SensPro provide efficient, flexible sensing and inference processing that helps address the diverse workloads Physical AI devices need to perform locally and in real time."

Product information for REGULUS and MLD-R1 is available at https://www.mobilint.com/regulus. For more on Ceva's Edge AI portfolio, visit https://www.ceva-ip.com/solutions/edge-ai/ 

About Mobilint

Founded in 2019 and headquartered in Seoul, Korea, Mobilint is a fabless AI semiconductor company specializing in high-performance, energy-efficient NPUs and AI SoCs for edge and on-device AI applications. The company owns proprietary NPU IP and AI SoC design technologies, with proven deployments across smart city, healthcare, autonomous driving, security, industrial AI, and mobile AI device applications. Learn more: www.mobilint.com.

About Ceva, Inc.

Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.

With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

SOURCE Ceva, Inc.