HSINCHU, Taiwan, Sept. 27, 2018 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 andNASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that the Company will host investor meetings in Singapore and Hong Kong from October 1 - 4, 2018. The non-deal roadshow will be sponsored by Fubon Securities and Jefferies LLC.
Management from the Company, including S.J. Cheng, Chairman and President, Jesse Huang, Vice President of the New Product Development Management Center, and Dr. G.S. Shen, Deputy Director of Strategy and Investor Relations, will host meetings with institutional investors to discuss the Company's recent financial performance, healthy business trends and significant growth opportunities. The meetings will not be webcast but the update presentation slides used will be available on the Company's website.
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 andNASDAQ: IMOS) (http://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.
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