DUBLIN, Apr. 24, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/l7zh33/3d_ics_market) has announced the addition of the "3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" report to their offering.

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This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.

The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred.

This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.

Apart from the detailed sub-segment analysis as mentioned below, this report also provides company profiles of key market players. The competitive profiling of these players includes company and financial overview, business strategies adopted by them, and their recent developments which can help in assessing competition in the market. Major companies included in this report are Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).

Key Topics Covered:

Chapter 1 Preface

Chapter 2 Executive Summary

Chapter 3 3D ICs Market Overview

Chapter 4 Global 3D ICs Market, by End-Use Industry

Chapter 5 Global 3D ICs Market, by Substrate Type

Chapter 6 Global 3D ICs Market, by Fabrication Process

Chapter 7 Global 3D ICs Market, by Product

Chapter 8 Global 3D ICs Market, by Geography

Chapter 9 Company Profiles

Companies Mentioned:

• Elpida Memory, Inc. (Micron Technology, Inc.)
• MonolithIC 3D Inc.
• STATS ChipPAC Ltd.
• Taiwan Semiconductor Manufacturing Company, Ltd.
• Tezzaron Semiconductor Corporation
• The 3M Company
• United Microelectronics Corporation
• XILINX, Inc.
• Ziptronix, Inc.

For more information visit http://www.researchandmarkets.com/research/l7zh33/3d_ics_market

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets