Concise Analysis of the International Semiconductor & IC Packaging Materials Market - Forecast to 2019

DUBLIN, Apr. 24, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/6m36d6/semiconductor_and) has announced the addition of the "Concise Analysis of the International Semiconductor & IC Packaging Materials Market - Forecast to 2019" report to their offering.

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Semiconductor and IC Packaging materials are mainly developed to protect the electronic components such as semiconductors and ICs from external impact and corrosion. A few types of semiconductor and IC packaging materials are organic substrates, bonding wires, leadframes, and encapsulation resins. These materials are manufactured with several types of packaging technologies such as SP, GA, QFN, and DFN.

Due to the recent global economic downturn in 2008, the electronics packaging market witnessed a downfall of over 20%. The decreased market revenue is due to the gradual decrease in demand of gold bonding wires and also the fluctuations in currency exchange rates.

The semiconductor and IC packaging materials market is driven by the range of applications, which increases the R&D efforts to make electronic packaging materials highly resourceful, along with the huge demand from the electronic components industry due to increased population that finds electronic packaging materials useful in a myriad of applications. Growing advancements and technological inventions in semiconductor and IC packaging materials market would be quite effective in the future. Semiconductor and IC packaging materials have been well perceived in various dominant end-user markets in the last few decades, and are expected to be used for diverse applications in the future.

Globally, the Asia-Pacific region dominated the semiconductor and IC packaging materials market revenue in 2013. China, Japan, Taiwan, and South Korea are the major countries with emerging markets possessing a huge demand for electronic packaging materials. Asia-Pacific's semiconductor and IC packaging materials market for end-user applications is expected to grow at a CAGR of 5.0% from 2014 to 2019, which is far higher than that of North America.

Key Topics Covered:

1 Introduction

2 Executive Summary

3 Semiconductor & IC Packaging Materials Premium Insights

4 Semiconductor & IC Packaging Materials Market Overview

5 Semiconductor & IC Packaging Materials Market, By Type

6 Semiconductor & IC Packaging Materials Market, By Ppackaging Technology

7 Semiconductor & IC Packaging Materials Market, By Type

8 Semiconductor & IC Packaging Materials Market, Competitive Landscape

9 Company Profiles

Companies Mentioned:

• Alent Plc
• Basf Se
• Henkel Ag & Company
• Hitachi Chemical Co. Ltd.
• Kyocera Chemical Co. Ltd.
• Lg Chemical Ltd.
• Mitsui High-Tec Inc.
• Sumitomo Chemical Co. Ltd.
• Tanaka Holdings Co., Ltd.
• Toray Industries Corporation

For more information visit http://www.researchandmarkets.com/research/6m36d6/semiconductor_and

Media Contact: Laura Wood, +353-1-481-1716, [email protected]

SOURCE Research and Markets