NEW YORK, Jan. 6, 2012 /PRNewswire/ -- Action Products International, Inc. (OTC Pink: APII) and Core Wafer Systems, Inc. are announcing it has received almost $4M in 2012 contracts for PDQ-WARp and PDQ-WLR product lines within its semiconductor business unit.
In 2009, Core Wafer Systems, Inc. and SEMATECH announced that they had partnered to develop Deep Submicron Reliability Test Solutions for next-generation semiconductor technologies. In the 24 months since this original announcement, CWS has been deeply involved with the Front End Processes (FEP) program and has completed development of WARp, an Expert System, which is a tool set to perform submicron reliability tests. This Expert System assists engineers in the evaluation of manufacturing processes and the devices being manufactured, while revolutionizing the way in which this evaluation is performed and analyzed.
PDQ-WARp is scheduled to be shown to the marketplace at the International Conference on Microelectronic Test Structures (ICMTS) on March 19-22, 2012 and at International Reliability Physics Symposium (IRPS) April 15-19, 2012. PDQ-WARp will start shipping in June 22, 2012.
CWS is also nearing release of new versions within the deep nanometer component of their most successful reliability library PDQ-WLR, for High-Volume Manufacturing Agilent Test Systems 4062UX, 4070 and 4080 systems. This major release, PDQ-WLR 8.0 is the most advanced version for accounting the deep nanometer effects since its previous release of PDQ-WLR 3.02. In addition, the new versions have added operating system support for LINUX and UNIX. The PDQ-WLR library is currently in use by 95% of the worldwide semiconductor manufacturers and this new version is expected to be available in March 30, 2012.
"All existing engineering and manufacturing customers that utilize deep submicron technologies will find that the advanced PDQ-WARp Expert System and the release of PDQ-WLR 8.0 are a huge leap forward from any available reliability products for Engineering and Manufacturing," states Gary Polistena, CEO of Action Products International, "TSMC, UMC, Texas Instruments, DMEA, and Applied Materials are just a subset of our customer base that we feel will benefit as we address their concerns around existing capabilities to measure reliability at the deep submicron level.
The semiconductor business unit has received orders near $4 million dollars from customers who wish to move forward with these advanced solutions, and we expect that as 2012 progresses there will be additional new orders and upgrades from the current customer base and from new customers. We will soon be releasing additional announcements pertaining to our progress in the magnetics business unit and our progress in rebranding the company with Core Wafer Systems as the focal point. Actions to be taken in re-branding APII will include a new company name, logo, and increasing executive leadership announcements."
About Action Products International, Inc.
Action Products International, Inc. (OTC Pink: APII.PK) is the parent company of Core Wafer Systems, Inc., a technology leader with a propriety parallel measurement schema for evaluation of physical phenomena in semiconductor devices and processes. Their software and hardware is used in the testing and data mining of today's most commonly used hard drives, memory, magnetics, and other advanced semiconductor and nanotechnology-based device components. More information about Core Wafer Systems, the WARp product offering, and its other products is available at http://www.corewafer.com or http://www.actionproductsinternational.com.
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SOURCE Action Products International, Inc.