SANTA MONICA, Calif., Nov. 16, 2017 /PRNewswire/ -- DesignCon 2018, the nation's premier conference for chip, board and systems design engineers, today announced three new keynote presentations covering NASA's New Horizons mission, the safety of autonomous vehicles and expert predictions of future challenges within engineering. Taking place January 30 - February 1, DesignCon 2018 will feature a unique keynote presentation on each day of the conference, providing sought-after perspectives on the latest industry trends. Keynote speakers include Alice Bowman, Todd Hubing, Steve Sandler and Istvan Novak, hailing from organizations and institutions such as Johns Hopkins University, Clemson University, Picotest, Oracle and more. To learn more about DesignCon 2018 and the featured keynote presenters, please visit: designcon.com
"The 2018 DesignCon keynote lineup supports not only the technical aspects of the electronic design community, but also speaks to larger, wide-reaching topics that resonate within the vast electronics industry," said Nina Brown, vice president of events, UBM. "Our technical program committee (TPC) and content experts thoughtfully curated these speakers to ensure that the content speaks directly to engineers, but also will be of practical interest to the industry as a whole."
Full details on this year's keynote presentations:
New Horizons: Journey to Pluto and Beyond
Presented by: Alice Bowman, New Horizons Mission Operations Manager, Johns Hopkins University Applied Physics Laboratory
Along with leading the Space Exploration Sector's Space Mission Operations Group at Johns Hopkins University, Bowman also serves as Mission Operations Manager (MOM) for NASA's New Horizons mission. Bowman supervises staff members who operate deep-space and Earth-orbiting spacecraft, and as the New Horizons MOM, Bowman leads the team that commands and controls the spacecraft that made a historic close flyby of Pluto in July 2015 and continues deeper into the solar system's distant Kuiper Belt region.
In her presentation, New Horizons: Journey to Pluto and Beyond, Bowman will speak about her experience leading the New Horizons Mission and more specifically describe some of the technical challenges faced while piloting the New Horizons spacecraft through the solar system.
How Do We Make Autonomous Vehicles Safe Enough?
Presented by: Todd Hubing, Professor Emeritus of Electrical and Computer Engineering, Clemson University
Dr. Todd Hubing, Professor Emeritus of Electrical and Computer Engineering at Clemson University and previously the Michelin Professor of Vehicle Electronics, was an engineer at IBM for seven years and a faculty member at the University of Missouri-Rolla for 17 years before joining Clemson in 2006. At Clemson, he established the Clemson Vehicular Electronics Laboratory where he supervised research projects and taught classes in vehicle electronics, electromagnetic compatibility and digital signal integrity.
Dr. Hubing's presentation, How Do We Make Autonomous Vehicles Safe Enough?, will discuss the current reliability of autonomous vehicles and the challenges in designing them. Dr. Hubing will also cover how to ensure immunity to electromagnetic interference in future autonomous vehicles.
Signal Integrity, Power Integrity & Electromagnetic Interference Challenges: Looking Ahead Through 2023
Panel discussion with:
Steve Sandler, Managing Director, Picotest
Istvan Novak, Senior Principal Engineer, Oracle
Eric Bogatin, Adjunct Professor, University of Colorado
Alfred Neves, Chief Technologist, Wind River Technology
Kenneth Wyatt, Sr. EMC Engineer, Wyatt Technical Services LLC
This panel, filled by thought leaders within the electronic engineering and design community, will focus on challenges that engineers are currently facing and how they can proactively predict new challenges before they arise. More specifically, this panel will strive to predict the effect that challenges in signal integrity, power integrity and electromagnetic interference will have on the industry within the next five years.
The keynote presentations headline a larger, 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will feature over 100 technical sessions, three full day boot-camps, and more. To learn more and see the full conference schedule please visit: schedule.designcon.com
Register for DesignCon 2018:
To register for the event please visit: designcon.tech.ubm.com
To apply for a media pass please visit: designcon.tech.ubm.com/2018/index/registrations/media
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com. DesignCon is organized by UBM plc. UBM is the largest pure-play B2B Events organizer in the world. Our 3,750+ people, based in more than 20 countries, serve more than 50 different sectors. Our deep knowledge and passion for these sectors allow us to create valuable experiences which enable our customers to succeed. Please visit www.ubm.com for the latest news and information about UBM.