Epson's PrecisionCore Printhead with MicroTFP Inkjet Dies: 2018 Reverse Cost Analysis Report - Company Profile, Physical Analysis, Sensor Manufacturing Process, Cost Analysis & Selling Price
DUBLIN, Nov. 6, 2018 /PRNewswire/ --
The "Epson PrecisionCore Printhead with MicroTFP Inkjet Dies" report has been added to ResearchAndMarkets.com's offering.
The MEMS inkjet printhead market is expected to reach $1B in 2023, with a 3.5% compound annual growth rate (CAGR) from 2017 to 2023. Within that, office printers and industrial segments are driving innovative technologies for piezo printheads, with CAGR of 2.7% and 18% respectively for the next five years.
Epson is the first printer manufacturer to integrate a thin film lead zirconate titanate (PZT) MEMS inkjet die into its industrial and office printers. Called a microTFP inkjet die, where TFP stands for thin film piezo, this MEMS device can be assembled in arrays of two, four, or more, according to the need. Each microTFP can print one color, with 600dpi density.
This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the microTFP inkjet MEMS and the PrecisionCore printhead supplied by Epson.
The inkjet MEMS uses patented tech-nology, based on non-standard silicon crystals, to manufacture the pressure chambers and manifolds. The PZT actuators and the two electrodes have complex structures in their material choices and stacking structures. The final component is also a complex structure with nozzle plate, pressure chambers, manifolds and channels all manufactured on a silicon substrate and bonded together.
The microTFP has two rows of nozzles staggered on the die to obtain 600dpi. The PrecisionCore is a four-color printhead. One microTFP MEMS device is used per color. The driver integrated circuits are assembled in the printhead.
This report includes a comparison between the Xaar 1201 and the Epson PrecisionCore printhead.
Key Topics Covered:
1. Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
- Epson
3. Physical Analysis
- Printer Disassembly
- Printhead
- Disassembly and cross-section
- Electronic Board
- Driver IC
- Die dimension
- Transistor
- MicroTFP Inkjet Die
- Inkjet die disassembly and cross-section
- Nozzle plate
- Flow path substrate
- Vibration plate cost
- Protection substrate cost
- PZT actuator
- Final assembly cost
- Comparison
4. Sensor Manufacturing Process
- Driver IC
- MircoTFP Inkjet Die
- PrecisionCore Printhead
5. Cost Analysis
- Accessing the BOM
- MicroTFP inkjet Die
- Driver wafer and die cost
- Flow path substrate cost
- Vibration plate cost
- Protection substrate cost
- Final assembly cost
- Component cost sensor die
- BOM Cost
- Material Cost Breakdown by Component Category
- Accessing the Added Value (AV) Cost
- Details of the Electronic Board AV Cost and the Housing AV Cost
- Manufacturing Cost Breakdown for 3M units
6. Selling Price
For more information about this report visit https://www.researchandmarkets.com/research/z92cd8/epsons?w=5
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