NEW YORK, Jan. 15, 2015 /PRNewswire/ -- Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV INTEGRATION IS CREATING GROWTH AND SIGNIFICANT INTEREST IN THE EQUIPMENT & MATERIALS INDUSTRY
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year.
In addition, logic manufacturers will diversify investments from System-on-Chip to Package-on-Package and will benefit from Advanced Packaging platforms such as 2.5D interposer and FO WLP to stimulate their high-volume production.
The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%. Growth will mainly be driven by the expansion of the next generation Wafer-level-packaging platforms (3D TSV stacked memories, multi-layer RDL for FO WLP & WLCSP), which are becoming more complex and requiring additional and various thin layers, as well as advanced materials, to achieve better performance.
This report will present a comprehensive overview of the main equipment and materials used in the 3D & WLP applications. In addition, it includes insights on a number of equipment tools, breakdown by wafer size & revenue, by type of equipment & materials and advanced packaging applications. Moreover, it also provides details about key suppliers, market share and technological highlights that impact the 3D & WLP industry.
Equipment & materials market forecasts are calculated for 2013–2019.
Read the full report: http://www.reportlinker.com/p02601926-summary/view-report.html
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