DALLAS, June 24, 2015 /PRNewswire/ --
According to a new market research report "Failure Analysis Market by equipment (SEM, TEM, FIB, Dual), Technology (SIMS, EDX, CMP, FIB, BIM, RIE), Application (Material Science, Bio Science, Industrial & Electronics), Geography - Forecast to 2020", published by MarketsandMarkets, the Failure Analysis Market is expected to reach $7,147.0 Million by 2020, at a CAGR of 7.52% from 2015 to 2020.
Browse 89 market Tables and 66 Figures spread through 236 Pages and an in-depth TOC on "Failure Analysis Market"
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Failure analysis for equipment is widely used in sectors such as bioscience, material science, industrial science, and electronics. The failure analysis equipment market is expected to reach $7,147.0 Million by 2020, at a CAGR of 7.52% from 2015 to 2020.
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The report segments the Failure Analysis Market on the basis of equipment, technology, application, and geography. Furthermore, it estimates and forecasts the market, along with analyzing various trends in the same. The market based on geography has been segmented into North America, Europe, and APAC among others. These regions have been further split into respective countries which comprise the market for this product. Furthermore, North America has been segmented into the U.S., Canada, and Mexico; Europe comprises the U.K, Germany, France, and others; APAC comprises Japan, China, India, and others; and RoW comprises the Middle East & Africa and Latin America. The market overview section of the report includes the drivers, restraints, opportunities, current market trends, and the technologies expected to revolutionize the industry.
The Failure Analysis Market has been segmented based on the technology into secondary ion mass spectroscopy (SIMS), energy dispersive X-ray spectroscopy (EDS/EDX), chemical mechanical planarization (CMP), focused ion beam (FIB), broad ion milling (BIM), and reactive ion etching (RIE). The market has also been segmented based on applications into material science, bioscience, industrial science, and electronics.
This report focuses on providing an insight into the overall Failure Analysis Market, with detailed market segmentations, combined with the qualitative analysis of each and every aspect of the classification on the basis of equipment, technology, application, and geography. The said market has been estimated and forecast till 2020 to identify key revenue pockets for the same.
The global Failure Analysis Market for TEM is expected to grow at a CAGR of 7.61%, and the APAC market is expected to grow at a high CAGR of 8.04% during the forecast period.
The Failure Analysis Market is highly competitive with a few leading players, namely, Carl Zeiss SMT GmbH (Germany), FEI Company (U.S.), JEOL Ltd. (Japan), Hitachi High- Technologies (Japan) and Tescan (U.S.).
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