NEW YORK, Aug. 1, 2016 /PRNewswire/ -- This BCC Research report discusses factors currently driving and restraining growth in flip chip technology market as well as factors that will have an impact on the future of this industry.
Use this report to:
Gain insight into opportunities and highlights of the innovation-driven flip-chip market and the major regions and countries of the market.
Analyze various applications of flip-chip technology and the market dynamics of each application.
Identify segments with high growth prospects along with future applications within each segment.
Assess the most relevant patent data
The global market for flip-chip technology totaled $24.9 billion in 2015.
The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021. The flip-chip technology market for copper (Cu) pillar bumping totaled $8.3 billion in 2015.
The market should total $9.8 billion and $21.2 billion in 2016 and 2021 respectively, increasing at a CAGR of 16.7% from 2016 to 2021.
The market for gold stud and plated solder bumping totaled $6.5 billion in 2015, and should total $7.7 billion and $10.1 billion in 2016 and 2021 respectively, increasing at a CAGR of 5.6% from 2016 to 2021.
STUDY GOALS AND OBJECTIVES
The objective of the report is to analyze flip-chip technology market dynamics and trends, including the prime factors driving the market. The report discusses factors currently driving and restraining growth in this market as well as those factors that will have an impact on the future of the industry. The goals and objectives of this report are as follows:
To understand opportunities and highlights of the innovation-driven flip-chip market and the major regions and countries of the market.
To analyze various application of the flip-chip market and the market dynamics of each application.
To identify segments with high growth prospects along with future applications withineach segment.
To examine key trends related to the product, technology, prices, and applications that shape and influence the flip-chip market.
To examine region-specific developments in the market.
To understand the major stakeholders in the market and the competitive landscapefor market leaders.
To analyze growth strategies of key players in the flip-chip market.
To analyze patent data where relevant
REASONS FOR CONDUCTING THE STUDY
New levels of performance of electronics technology have been enabled by flip-chip technology, fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products. During the forecast period, flip-chip interconnect technology is expected to show remarkable growth over other interconnect technologies. Increasing complexity of the architecture of chip design and fabrication is responsible for this exponential growth rate. The market has grown due to increased demand for small-size chips ranging from around 12 mm to 35 mm. This study defines the scope of flip chips with segmental analyses such as by application and end user, helping the reader gain knowledge about technological as well as analytical aspects of the industry.
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