PHOENIX, March 18, 2013 /PRNewswire/ -- FlipChip International (FCI), the global technology leader in flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s., a world-class provider of Wafer Level Micro Assembly Technologies and Services, announced today a partnership agreement. FCI will provide Sales and Marketing services to promote and leverage EZconn's highly sophisticated packaging technologies and services based in their Trutnov facility in the Czech Republic, thereby extending support for leading edge wafer level bumping and module assembly. EZconn will also support FCI's advanced packaging roadmap for 2.5D and 3D WLCSP and flip chip solutions for its global customers with this Partnership.
This strategic partnership will provide a platform for the promotion of the EZconn Czech a.s. Wafer Level Micro Assembly Technology and Services including volume production of customer specific micro-modules, optical diodes and transceivers of all kinds.
Bob Forcier, FCI President and CEO said, "We are excited about this partnership which combines EZconn's advanced wafer level assembly technologies with FCI's Wafer Level Packaging technologies creating a unique capability for next generation 2.5D and 3D packaging. The technology crossovers of these two technologies will enable further reductions in the Z axis and X-Y axis mechanical envelopes which is paramount to our mutual customers quest for miniaturization of their products in a variety of global markets".
Petr Tauchman, EZconn Czech a.s. Managing Director, said, "We are very pleased to enhance and extend our product portfolio with this partnership with FCI. There are synergies in our respective Product and Technology Roadmaps that will provide excellent advanced packaging solutions for our customers."
About EZconn Czech a.s:
EZconn Czech a.s is a subsidiary of EZconn Europe GmbH and part of the international company eGtran since 2006, providing products and service for the wafer scale level market.
FCI is a privately held supplier of products and services for the wafer bumping and wafer level packaging market.
SOURCE FlipChip International