PHOENIX, May 12, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in Flip Chip bumping and Wafer Level Packaging announced they will sponsor the MagnaChip Semiconductor Corporation's 4th Annual Foundry Technology Symposium in Hsinchu, Taiwan on Wednesday, May 21st and in Santa Clara California on Thursday, June 12th.
At the symposium, FlipChip will provide information and support on a broad range of advanced wafer level packaging technologies, highlighting world-class service and reliability. FlipChip will also be promoting its increasing capabilities in high volume IC Assembly and Test, following the acquisition of Millennium Microtech Shanghai. FlipChip is a technology leader in Wafer Level Packaging and provides global support through a worldwide sales and manufacturing structure. FlipChip International will be located in the front lobby to provide customer support and to promote quick turn engineering projects, MPW wafers and collaborating with customers on their special packaging needs. FlipChip works closely with all the world's leading semiconductor foundries, including MagnaChip. MagnaChip's broad technology capability and emphasis on specialty processes matches well with FlipChip's advanced packaging solutions and high volume production facilities.
David Wilkie, FlipChip's CEO said, "FCI is very pleased to announce its sponsorship of the MagnaChip Semiconductor Foundry Technology Symposium this year. We are proud of our relationship with MagnaChip and our growth will continue with them over the next few years. FlipChip has a long history of providing advanced packaging technology solutions to many Magnachip customers. Like FCI, MagnaChip is a world class manufacturing company offering many high end and specialty process technologies to their customers."
FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume manufacturing and advanced packaging technology. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Lead frame assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, AZ, Shanghai, China and Porto, Portugal.
SOURCE FlipChip International