Foxconn Interconnect Technology, Ltd. Unveils 25G/100G Data Center Solutions at OFC 2016

SAN JOSE, Calif., March 21, 2016 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of interconnect solutions, today introduced a new portfolio of 25G and 100G optical and copper products targeting data center applications. Based on Broadcom's industry-leading integrated circuits and optical components, the portfolio includes 25G and 100G pluggable transceiver modules, active optical cables (AOCs) and direct attach copper cables (DACs), as well as mating I/O connectors and cages.

Portfolio Highlights

25G SFP28 Transceiver Module, AOC and DAC

• Optical transceiver compliant with electrical and optical specifications of IEEE 802.3by for 25GBASE-SR to support 100m link distance using OM4 multimode fiber (MMF)
• Multiple transceiver options supporting different forward error correction (FEC) requirements
• 1 to 20 meter long AOC compliant with electrical specifications of IEEE 802.3by
• 4x25G Octopus AOC and DAC designed to connect 25G servers to 100G top-of-rack switches
• 1 to 5 meter long passive DAC with optimized signal integrity for cost effective, high speed networking applications

100G QSFP28 Transceiver Module, AOC and DAC

• Optical transceiver compliant with electrical and optical specifications of IEEE 802.3bm for 100GBASE-SR4 to support 100m link distance using OM4 MMF
• Multiple 100G SR4 transceiver options supporting different forward error correction (FEC) requirements
• Extended SR4 (eSR4) optics to support 300m link distance using OM4 MMF
• 4-channel Parallel Single Mode (PSM4) and 4-lane Coarse Wavelength Division Multiplexing (CWDM4) optical modules to support link distance beyond 300 meters
• 1 to 20 meter long AOC compliant with electrical specifications of IEEE 802.3bm
• 1 to 5 meter long passive DAC with optimized signal integrity for cost effective, high speed networking applications

FIT will be showcasing the new products in the Booth 3841 at the OFC 2016 exhibition in Anaheim, California, USA from March 22^nd to 24^th.

"Broadcom is pleased to have a partner like FIT in developing and delivering state-of-the-art fiber optic module solutions for a variety of form factors and speeds. Through this strategic partnership we are now able to allow our expanded customer base greater flexibility in solving a multitude of interconnect challenges associated with modern data center networks," said Mitchell Fields, Vice President and General Manager of the Fiber Optics Products Division for Broadcom Limited.

"Incorporating a team of highly skilled engineers with roots tracing back to HP, Agilent and Avago, FIT is fully dedicated to developing advanced optical and copper solutions to address today's critical interconnect challenges. With the industry's most comprehensive offering of 25G and 100G solutions for data center applications, FIT is well positioned to support the industry-wide upgrade of data speeds across the data center network," said Philip Gadd, Vice President and General Manager of Foxconn Interconnect Technology, Limited.

Availability
FIT is currently sampling both the new 25G and 100G pluggable transceiver modules. FIT also offers respective I/O connectors and cages for the SFP28 and QSFP28 module form factors with superior EMI protection and enhanced thermal dissipation. Please contact your local FIT sales representative for samples and pricing.

In addition to the 25G and 100G solutions, FIT plans to release the 32G SFP28 and 128G QSFP28 optical transceiver solutions for Fibre Channel applications in the second half of 2016.

Further information on FIT's new pluggable transceiver modules, AOCs, DACs, cages and connectors can be found online at

Avago Technologies - Optical Transceivers
FIT - Connectors
FIT - Cable Assembly
FIT - External Cable Assembly

About Foxconn Interconnect Technology, Limited
Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.

For more information, visit FIT's website: http://www.fit-foxconn.com

Press Contact:
Pamela Fong
FIT Public Relations – US & EU
[email protected]

Caution Concerning Forward Looking Statements
We are disclosing forward-looking information so that investors, potential investors, and other owners can better understand the mentioned Companies' future prospects and make informed investment decisions. The information in this press release contains "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. These statements can be identified by the fact that they do not relate strictly to historical or current facts. Any forward-looking statement made by the Companies speaks only as of the date on which it is made. The Companies are under no obligation to, and expressly disclaim any obligation to, update or alter their forward-looking statements, whether as a result of new information, subsequent events or otherwise.

SOURCE Foxconn Interconnect Technology, Ltd.

Related Links

http://www.fit-foxconn.com