Global and China Wafer Foundry Industry Report, 2010-2011
NEW YORK, July 12, 2011 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
Global and China Wafer Foundry Industry Report, 2010-2011
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The wafer foundries boomed in 2010 when the output value of wafer foundry industry rose 34% to US$26.88 billion. A lot of manufacturers turned loss into profit, including SMIC, Dongbu HiTek, VIS, ASMC, CRMTech, Towerjazz, and X-Fabd; hereinto, SMIC made the most rapid progress with the operating margin leaping to 1.4% from -90.1%.
Consequently, the wafer foundries are fully confident and substantially raise the capital expenditure to improve the capacity. For instance, SMIC brings forward the investment of RMB46 billion for capacity enhancement; while Global Foundries under Abu Dhabi SWF tries to beat UMC and takes the global No.2 position by doubling its capex in 2011 against that in 2010.
The flourish of smart phone and tablet PC is unlikely to benefit the entire wafer foundry industry, only TSMC and Samsung can enjoy the priority. TSMC, the leader in global wafer foundry industry, holds the market share of over 50%, with the technology at least half a year superior to that of other manufacturers and 1-3 years ahead of that of most manufacturers. 95% of the highest-end ICs worldwide are OEMed by TSMC, and the other manufacturers are merely the secondary or tertiary suppliers. Samsung relies on Apple, yet the conflict between Apple and Samsung has continued to escalate recently, so, it is certainly that partial A5 orders will go for TSMC and it is probable for TSMC to manage all the A6 orders.
Wafer foundry is by no means the OEM of ordinary electronic products, several tens of thousands of accumulated IP library compose the insuperable threshold, the investment can easily reach billions of US dollars, and the support from the huge and excellent talent teams is a must; as a result, wafer foundry is far more difficult than the fabrication of single IC. It is easy for Samsung to pose competition against the potential clients in that Samsung is the electronics giant and it also engages in some types of IC, yet TSMC, UMC, and SMIC turn out to be pure foundries, which limits the revenue scale of Samsung. In 2012, the revenue of Samsung will decline sharply as Apple transfers its orders to TSMC.
1/3 revenue of Global Foundries is contributed by AMD, its biggest client. Severely impacted by smart phones and table PCs, traditional PCs and notebook PCs have witnessed great decrease margin. Year 2011 will be arduous for AMD because of the powerful beat from Intel. Abu Dhabi SWF is still groping the way of controlling Global Foundries, so, perhaps it is inevitable for making losses in consecutive several years or even more than a decade.
As for the OEM fields of high-end products like 28nm node and of such special products as High Voltage/MEMS, they feature not so evident overcapacity; however, other fields will be amid overcapacity till 2013, and a majority of foundries will see the unavoidable loss.
1 Profile of Semiconductor Industry
2 Status Quo and Future of Semiconductor Industry
2.1 Overview
2.2 Wafer Foundry
2.3 Horizontal Comparison of Global Wafer Foundries
3 Semiconductor Market and Industry in China
3.1 Market
3.2 Industry
3.3 Wafer Foundry and IC Design Industry
4 Wafer Foundries
4.1 TSMC
4.2 UMC
4.3 Global Foundries
4.4 SMIC
4.5 Dongbu HiTek
4.6 VIS
4.7 MagnaChip
4.8 Grace Semiconductor
4.9 HHNEC
4.10 ASMC
4.11 TowerJazz
4.12 X-FAB
4.13 China Resources Microelectronics
4.14 Samsung Electronics
Selected Charts
Processing Flow Chart of Original Wafer
Flow Chart of Wafer Mount in Circuit
Cost Structure of 8-inch Wafer
Output Value of Global Semiconductor Industry, 2003-2012E
Global IC Shipment and Average Price, 2000Q1-2010Q4
Monthly Total Revenue of Taiwan-based ASE, SPIL, TSMC, and UMC, Jan.2003-Jan.2011
Output Value and Growth Margin of Global Wafer Foundry Industry, 2005-2013E
IC Revenue and Growth Margin in China, 2011-2013E
IC Market Size and Growth Margin in China, 2008-2013E
IC Output in China, 2005-2010
Revenue and Growth Margin of IC Industry in China, 2005-2010
Revenue and Growth Margin of IC Design Industry in China, 2006-2010
Revenue of IC Fabrication Industry in China, 2006-2010
Revenue of IC Testing & Packaging Industry in China, 2006-2010
Revenue and Operating Margin of TSMC, 2004-2010
Wafer Shipment and Capacity Utilization of TSMC, 2004-2010
Revenue and Operating Margin of TSMC, 2008Q1-2011Q1
TSMC Products by Application, 2009Q1-2010Q1
TSMC Revenue by Node, 2008Q3-2010Q2
TSMC 28nm Technical Roadmap
TSMC 28nm Technology Characteristics
UMC Revenue and Operating Margin, 2001-2010
UMC Shipment and Capacity Utilization, 2001-2010
UMC Revenue and Gross Margin, 2008Q1-2011Q1
UMC Revenue by Region, 2008Q1-2011Q1
UMC Revenue by Node, 2008Q1-2011Q1
UMC Revenue by Application, 2008Q1-2011Q1
UMC Shipment and Capacity Utilization, 2008Q1-2011Q1
CSM Revenue and Net Profit Margin, 2000-2009
CSM Revenue by Application, 2008Q3-2009Q3
Global Presence of Global Foundries
Technical Roadmap of Global Foundries
SMIC Revenue and Operating Margin, 2003-2010
SMIC Revenue, 2010H1
SMIC Revenue and Gross Margin, 2008Q1-2011Q1
SMIC Revenue by Application, 2008Q1-2011Q1
SMIC Revenue by Type, 2008Q1-2010Q2
SMIC Revenue by Client, 2008Q1-2010Q2
SMIC Revenue by Region, 2008Q1-2010Q2
SMIC Revenue by Region, 2010Q1-2011Q1
SMIC Revenue by Node, 2008Q1-2011Q1
SMIC Shipment and Capacity Utilization, 2008Q1-2011Q1
Plant Distribution of SMIC
Technical Capability of SMIC
Major Clients of SMIC
Revenue and Operating Margin of Dongbu HiTek, 2005-2012E
Shipment and Capacity Utilization of Dongbu Hitek, 2007-2012E
Profile of Dongbu
Wafer Foundry Profile of Dongbu Hitek
Wafer Foundry Capacity of Dongbu Hitek, 2007-2011
Technical Roadmap of Dongbu Hitek
Technology Characteristics of Dongbu Hitek
VIS Revenue and Operating Margin, 2005-2011
VIS Revenue and Gross Margin, 2008Q2-2011Q1
VIS Revenue by Node, 2008Q2-2011Q1
VIS Revenue by Application, 2008Q2-2011Q1
VIS Revenue by Product, 2009Q1-2011Q1
VIS Shipment and Capacity Utilization, 2008Q2-2011Q1
Technology Characteristics of VIS
Technical Roadmap of VIS
MagnaChip Revenue and Gross Margin, 2001-2010
MagnaChip Revenue and Operating Margin, 2005-2010
MagnaChip Revenue by Product, 2004-2010
MagnaChip Revenue by Region, 2006-2010
MagnaChip Revenue by Application, 2009-2010
Revenue of MagnaChip Power Solution Division, 2008Q2-2011Q1
Revenue of MagnaChip Power Solution Division by Region, 2008Q2-2011Q1
Technical Roadmap of Grace
HHNEC Roadmap
Equity Structure of ASMC
ASMC Revenue and Gross Margin, 2003-2010
Capacity Utilization of ASMC, 2008Q1-2011Q1
ASMC Revenue by Region, 2008Q3-2011Q1
ASMC Revenue by Client Type, 2008Q3-2011Q1
ASMC Revenue by Application, 2008Q3-2011Q1
ASMC Revenue by Wafer Foundry, 2008Q3-2011Q1
TowerJazz Revenue and Gross Profit, 2003-2010
TowerJazz Revenue by Technology, 2005-2010
TowerJazz Revenue by Region, 2007-2010
X-FAB Revenue and Operating Profit, 2004-2010
Revenue of China Resources Microelectronics by Region, 2006-2010
Revenue and EBITDA of China Resources Microelectronics, 2006-2010
Revenue of China Resources Microelectronics by Product, 2008-2010
Revenue of China Resources Microelectronics by Application, 2009-2010
Revenue of China Resources Microelectronics by Division, 2008-2010
Operating Profit of China Resources Microelectronics by Division, 2009-2010
Global Mobile Phone Shipment by Brand, 2010Q1-2011Q1
Global Smart Phone Shipment by Operating System, 2010Q3
Revenue of 17 Wafer Foundries Worldwide, 2007-2011E
Operating Margin, Capacity, and Output of Major Wafer Foundries Worldwide, 2009-2010
Top 10 IC Design Companies, IC Manufacturers, and IC Packaging & Testing Companies in China, 2010
Foundries with Available Production of above 6-inch Wafer in Mainland China
Capacity of TSMC Plants, 2008-2010
Capacity of UMC Plants, 2006Q1, 2007Q1, 2009Q4-2011Q1
CSM Wafer Shipment and Capacity Utilization, 2008Q3-2009Q3
Capacity of CSM Plants, 2008Q3-2009Q3
SMIC Capacity
Wafer Foundries of MagnaChip
Grace Revenue, 2004-2010
HHNEC Revenue, 2003-2010
Production Line Capacity of ASMC, 2011Q1
Capacity Utilization of ASMC Production Lines, 2010Q2 & 2011Q1
To order this report:
Electronic Component and Semiconductor Industry: Global and China Wafer Foundry Industry Report, 2010-2011
Electronic Component and Semiconductor Business News
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Nicolas Bombourg
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