NEW YORK, Dec. 24, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
TechNavio forecasts The Global e-Beam Wafer Inspection System Market 2014-2018 with a CAGR of 25.9 percent for the period 2013–2018. Several driving factors and trends will contribute to this growth—all of which will be outlined with detail in this report.
TechNavio's analysts use a unique methodology to scrutinize individual vendor performance, trends, drivers and challenges, and a number of other factors to provide the most accurate and detailed market research reports possible.
A more specific breakdown of this report's contents is below.
Overview of market share and landscape for the following key countries:
More specific breakdown of the market share for the following countries:Taiwan
• South Korea
Overview and impact analysis of:
• 4 Market Challenges
• 4 Market Trends
Market Shares and SWOT Analysis for these vendors:
• ASML Holding N.V.
• Hermes Microvision Inc.
• Hitachi High-Tech Corp.
• KLA-Tencor Corp.
• Lam Research Corp.
Five Force Model Impact Analysis of:
• New entrants
• Market competition
Note: All of the segments above are supplemented with a combination of statistical data, graphical analysis, and verbal explanation.
After purchasing any of our reports, you can request a one hour meeting to discuss any questions you may have with our team of analysts.
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
06. Market Landscape
06.1 Technology Landscape
06.2 Market Size and Forecast by Value
06.3 Market Size and Forecast by Volume
06.5 Five Forces Analysis
07. Geographical Segmentation
07.1 Global e-Beam Wafer Inspection System Market by Geographical Segmentation 2013-2018
08. Key Leading Countries
08.2 South Korea
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and their Impact
16. Vendor Landscape
16.1 Competitive Scenario
16.2 Key Vendors in the Market 2013
16.3 Other Prominent Vendors
17. Key Vendor Analysis
17.1 Applied Materials Inc.
17.1.1 Business Overview
17.1.2 Business Segmentation
17.1.3 Key Information
17.1.4 SWOT Analysis
17.2 ASML Holding N.V.
17.2.1 Business Overview
17.2.2 Business Segmentation
17.2.3 Key Information
17.2.4 SWOT Analysis
17.3 Hermes Microvision Inc.
17.3.1 Business Overview
17.3.2 Business Segmentation
17.3.3 Key Information
17.3.4 SWOT Analysis
17.4 Hitachi High-Technologies Corp.
17.4.1 Business Overview
17.4.2 Business Segmentation
17.4.3 Key Information
17.4.4 SWOT Analysis
17.5 KLA-Tencor Corp.
17.5.1 Business Overview
17.5.2 Business Segmentation
17.5.3 Key Information
17.5.4 SWOT Analysis
17.6 Lam Research Corp.
17.6.1 Business Overview
17.6.2 Business Segmentation
17.6.3 Key Information
17.6.4 SWOT Analysis
18. Other Reports in this Series
List of Exhibits
Exhibit 2: Semiconductor Industry Value Chain
Exhibit 3: E-beam Wafer Inspection Process Chart
Exhibit 4: Global e-Beam Wafer Inspection System Market 2013-2018 (US$ million)
Exhibit 5: Global e-Beam Wafer Inspection System Market 2013-2018 (Units)
Exhibit 6: Global e-Beam Wafer Inspection System Market by Geographical Segmentation 2013-2018
Exhibit 7: Penetration of e-Beam Wafer Inspection System Vs Optical Wafer Inspection System 2013-2018
Exhibit 8: ASP of e-Beam Wafer Inspection System per Unit 2013-2018 (US$ million per unit)
Exhibit 9: Applied Materials Business Segmentation 2013
Exhibit 10: ASML Holding N.V. Business Segmentation 2013
Exhibit 11: Hermes Microvision Inc. Business Segmentation 2013
Exhibit 12: Hitachi High-Technologies Corp. Business Segmentation 2013
Exhibit 13: KLA-Tencor Corp. Business Segmentation 2013
Exhibit 14: Lam Research Corp. Business Segmentation 2013
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