Global e-Beam Wafer Inspection System Market 2014-2018

Dec 24, 2013, 08:15 ET from Reportlinker

NEW YORK, Dec. 24, 2013 /PRNewswire/ -- announces that a new market research report is available in its catalogue:

Global e-Beam Wafer Inspection System Market 2014-2018

TechNavio forecasts The Global e-Beam Wafer Inspection System Market 2014-2018 with a CAGR of 25.9 percent for the period 2013–2018. Several driving factors and trends will contribute to this growth—all of which will be outlined with detail in this report.

TechNavio's analysts use a unique methodology to scrutinize individual vendor performance, trends, drivers and challenges, and a number of other factors to provide the most accurate and detailed market research reports possible.

A more specific breakdown of this report's contents is below.

Overview of market share and landscape for the following key countries: • APAC

• Americas


More specific breakdown of the market share for the following countries: Taiwan

South Korea

• US

Overview and impact analysis of: • 4 Market Drivers

• 4 Market Challenges

• 4 Market Trends

Market Shares and SWOT Analysis for these vendors: • Applied Materials Inc.

• ASML Holding N.V.

• Hermes Microvision Inc.

• Hitachi High-Tech Corp.

• KLA-Tencor Corp.

• Lam Research Corp.

Five Force Model Impact Analysis of: • Suppliers

• Buyers

• Substitutes

• New entrants

• Market competition

Note: All of the segments above are supplemented with a combination of statistical data, graphical analysis, and verbal explanation.

After purchasing any of our reports, you can request a one hour meeting to discuss any questions you may have with our team of analysts.

Methodology Research methodology is based on extensive primary and secondary research. Primary research includes in-depth interviews with industry experts, vendors, resellers and customers. Secondary research includes Technavio Platform, industry publications, company reports, news articles, analyst reports, trade associations and the data published by Government agencies.

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

03.1 Market Overview

03.2 Product Offerings

04. Market Research Methodology

04.1 Market Research Process

04.2 Research Methodology

05. Introduction

06. Market Landscape

06.1 Technology Landscape

06.2 Market Size and Forecast by Value

06.3 Market Size and Forecast by Volume

06.5 Five Forces Analysis

07. Geographical Segmentation

07.1 Global e-Beam Wafer Inspection System Market by Geographical Segmentation 2013-2018

08. Key Leading Countries

08.1 Taiwan

08.2 South Korea

08.3 USA

09. Buying Criteria

10. Market Growth Drivers

11. Drivers and their Impact

12. Market Challenges

13. Impact of Drivers and Challenges

14. Market Trends

15. Trends and their Impact

16. Vendor Landscape

16.1 Competitive Scenario

16.2 Key Vendors in the Market 2013

16.3 Other Prominent Vendors

17. Key Vendor Analysis

17.1 Applied Materials Inc.

17.1.1 Business Overview

17.1.2 Business Segmentation

17.1.3 Key Information

17.1.4 SWOT Analysis

17.2 ASML Holding N.V.

17.2.1 Business Overview

17.2.2 Business Segmentation

17.2.3 Key Information

17.2.4 SWOT Analysis

17.3 Hermes Microvision Inc.

17.3.1 Business Overview

17.3.2 Business Segmentation

17.3.3 Key Information

17.3.4 SWOT Analysis

17.4 Hitachi High-Technologies Corp.

17.4.1 Business Overview

17.4.2 Business Segmentation

17.4.3 Key Information

17.4.4 SWOT Analysis

17.5 KLA-Tencor Corp.

17.5.1 Business Overview

17.5.2 Business Segmentation

17.5.3 Key Information

17.5.4 SWOT Analysis

17.6 Lam Research Corp.

17.6.1 Business Overview

17.6.2 Business Segmentation

17.6.3 Key Information

17.6.4 SWOT Analysis

18. Other Reports in this Series

List of Exhibits Exhibit 1: Market Research Methodology

Exhibit 2: Semiconductor Industry Value Chain

Exhibit 3: E-beam Wafer Inspection Process Chart

Exhibit 4: Global e-Beam Wafer Inspection System Market 2013-2018 (US$ million)

Exhibit 5: Global e-Beam Wafer Inspection System Market 2013-2018 (Units)

Exhibit 6: Global e-Beam Wafer Inspection System Market by Geographical Segmentation 2013-2018

Exhibit 7: Penetration of e-Beam Wafer Inspection System Vs Optical Wafer Inspection System 2013-2018

Exhibit 8: ASP of e-Beam Wafer Inspection System per Unit 2013-2018 (US$ million per unit)

Exhibit 9: Applied Materials Business Segmentation 2013

Exhibit 10: ASML Holding N.V. Business Segmentation 2013

Exhibit 11: Hermes Microvision Inc. Business Segmentation 2013

Exhibit 12: Hitachi High-Technologies Corp. Business Segmentation 2013

Exhibit 13: KLA-Tencor Corp. Business Segmentation 2013

Exhibit 14: Lam Research Corp. Business Segmentation 2013

Companies Mentioned Applied Materials Inc., ASML Holding N.V., Hermes Microvision Inc., Hitachi High-Tech Corp., KLA-Tencor Corp., and Lam Research Corp.

To order this report: Global e-Beam Wafer Inspection System Market 2014-2018

Contact Clare:

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Intl:+1 339 368 6001

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