Global Electronic Smart Packaging (RFID, NFC, BLE and EAS) Market 2016-2022 - Market Will Witness a CAGR of 45.5% - Research and Markets
DUBLIN, August 5, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "Worldwide Electronic Smart Packaging Market - Technologies (RFID, NFC, BLE and EAS), Applications, End-Users, By Regions - Drivers, Opportunities, Trends, and Forecasts, 2016-2022" report to their offering.
It is estimated that the Worldwide Electronic Smart Packaging market will witness a CAGR of 45.5% during the forecast period 2016-2022.
Now with key enabling technology, printed electronics are boosting the potential opportunities for smart packaging by lowering the costs. In the future, the smart packaging market will witness a rapid growth and is expected to grow tremendously, due to the use of printed electronics in packaging. Printed electronics is a key in enabling smart packaging innovations and a fast-growing market for the industries.
In the recent years, the smart packaging has become a fast growing segment across the world. The printed electronics has evolved as a new technology in smart packaging, where companies have started investing in electronics in packaging. Some of the players included in the report are Thin Film Electronics, Smartrac NV, Bemis Company, Sealed Air and PakSense. It is expected that electronic smart packaging will drive the market in the upcoming years for its less cost, flexibility and additional functionality on the packaging. The smart packaging market is segmented by technologies, applications, end-users and geographic regions. High growth is expected in Europe and North America in the next 3-4 years.
The study covers and analyzes the Worldwide Electronic Smart Packaging market. Bringing out the complete key insights of the industry, the report aims to provide an opportunity for players to understand the latest trends, current market scenario, government initiative, and technologies related to the market. In addition, helps the venture capitalist in understanding the companies better and take informed decisions.
Key Topics Covered:
1 Industry Outlook
2 Report Outline
3 Market Snapshot
3.1 Total Addressable Market (TAM)
3.2 Segmented Addressable Market (SAM)
3.3 Related Markets
4 Electronic Smart Packaging
5 Market Characteristics
5.1 Evolution
5.2 Architecture
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Technology adoption
5.3.1.2 Consumer demand
5.3.1.3 Ageing population
5.3.1.4 Low cost and less weight
5.3.2 Restraints
5.3.2.1 Lack of awareness about electronics in smart packaging
5.3.2.2 Increasing competition leading to price war
5.3.3 Opportunities
5.3.3.1 Use of NFC technology
5.3.3.2 Improving market conditions and falling costs
5.3.4 DRO - Impact Analysis
6 Printed Electronics in Smart Packaging
6.1 Overview
6.1.1 Printed electronic in smart packaging and their challenges
6.1.2 Electronics v/s Printed Electronics
6.1.3 Scope of printed electronics in smart packaging
6.1.4 Future impact of electronics in smart packaging
6.1.5 Future Investment and projects
7 Technology: Market Size and Analysis
7.1 Overview
7.2 Radio Frequency Identification (RFID)
7.3 NFC
7.4 Bluetooth Low Energy (BLE)
7.5 Electronic Article Surveillance (EAS)
8 Applications: Market Size and Analysis
8.1 Overview
8.2 Printed Light
8.3 Printed Touch
8.4 Printed Antennas
8.5 Printed RFID
8.6 Printed Sensors
9 End-Users: Market Size and Analysis
9.1 Overview
9.2 Food
9.3 Beverage
9.4 Healthcare
9.5 Personal Care
9.6 Logistics/Transporting
9.7 Industry Machineries
10 Regions: Market Size and Analysis
11 Vendor Profiles
13 Companies to Watch for
14 Competitive Landscape
Companies Mentioned
- 3M Co.
- Ametek Inc.
- Bemis Company Inc.
- Blue Spark Technologies Inc.
- NEXX Systems Inc.
- PakSense
- Printechnologics
- PST Sensors
- RR Donnelley & Sons Co.
- Saralon GmbH
- Sealed Air
- Smartrac N.V.
- Thin Film Electronics ASA
For more information visit http://www.researchandmarkets.com/research/sv8kqs/worldwide
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SOURCE Research and Markets
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