Global Market for Semiconductor Devices for High Temperature Applications 2019-2023

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May 02, 2019, 19:30 ET

DUBLIN, May 2, 2019 /PRNewswire/ -- The "Semiconductor Devices for High Temperature Applications: Market Opportunities" report has been added to ResearchAndMarkets.com's offering.

The market for semiconductor devices used in high-temperature applications is segmented into categories by:

Type: GaN, SiC, GaAs, and diamond semiconductor substrate.
GaN product: power semiconductors and GaN radio frequency (RF) devices.
GaN wafer size: 2-inch, 4-inch, 6-inch, and 8-inch wafer sizes.
GaN application: information and communication technology, automotive, consumer electronics, defense and aerospace, and others.
SiC products: black silicon carbide, green silicon carbide and others.
SiC application: electronics and semiconductors, steel and energy, automotive, aerospace and aviation, military and defense, medical and healthcare, and others.
GaAs wafer production method: vertical gradient freeze (VGF), liquid-encapsulated Czochralski (LEC), molecular beam epitaxy (MBE), metal-organic vapor phase epitaxy (MOVPE), and others.
GaAs application: mobile devices, photovoltaic devices, wireless communication, optoelectronic devices, aerospace and defense, and others.
Diamond semiconductor substrate type: natural and synthetic.
Diamond semiconductor substrate application: healthcare, consumer electronics, construction and mining, and others.
Region: North America is segmented into the U.S., Canada and Mexico; Europe is segmented into the U.K., Germany, Italy, Russia, and the other Commonwealth Independent States; Asia-Pacific is segmented into China, Japan, India, and the rest of Asia-Pacific; Latin America covers Brazil and the rest of Latin America; and the Rest of the World (RoW) covers the Middle East and Africa.
In addition to industry and competitive analyses of the semiconductor devices for high-temperature applications market, this report also provides an exhaustive patent analysis and company profiles for key players active in the global market.

The Report Includes:

69 data tables and 57 additional tables
An overview of the global markets and applications of high-temperature semiconductor devices
Analyses of market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
Explanation of drivers, restraints, key developments and future outlook of the high-temperature semiconductor devices industry
Description of Gallium Nitride (GaN), Silicon Carbide (SiC), and Gallium Arsenide (GaAs); their products and application
Detailed profiles of the major players in the market, including Cree Inc., Infineon Technologies Ag, Allegro Microsystems Llc, Smart Modular Technologies (WWH) Inc., Genesic Semiconductor Inc., The Dow Chemical Co., and United Silicon Carbide Inc.

Key Topics Covered:

Chapter 1 Introduction

Scope of Report
Research Methodology
Intended Audience
Information Sources
Geographic Breakdown

Chapter 2 Summary and Highlights

Chapter 3 Market and Technology Background

Market Definition and Evolution of Semiconductor Devices for High-Temperature Applications
Future Outlook and Expectations
Market Dynamics
Drivers
Restraints
Key Developments in Semiconductor Devices for High-Temperature Applications
Gallium Nitride
Silicon Carbide
Gallium Arsenide
Diamond
Quotes by Key Opinion Leaders
Value Chain Analysis
Raw Materials
Components
Design and Conception
Manufacture
Assembly, Packaging and Testing
Customer Service

Chapter 4 Market Breakdown by Gallium Nitride

GaN Market Breakdown by GaN Product
Power Semiconductors
Schottky Diodes
High Electron Mobility Transistors
Integrated Circuits
GaN-on-Si
GaN RF Devices
HEMTs
GaN-based ICs
GaN-based Opto-semiconductors
GaN Market Breakdown by Wafer Size
2-inch Wafer Size
4-inch Wafer Size
6-inch Wafer Size
8-inch Wafer Size
GaN Market Breakdown by Application
Information and Communication Technology Applications
Automotive Applications
Consumer Electronics Applications
Defense and Aerospace Applications
Industrial and Medical Applications
Other Applications

Chapter 5 Market Breakdown by Silicon Carbide

SiC Market Breakdown by SiC Product
Black Silicon Carbide
Green Silicon Carbide
Other Materials
SiC Market Breakdown by Application
Power Electronics and Semiconductor Applications
Steel and Energy Applications
Automotive Applications
Aerospace and Aviation Applications
Military and Defense Applications
Medical and Healthcare Applications
Other Applications

Chapter 6 Market Breakdown by GaAs

GaAs Market Breakdown by Wafer Production Method
Liquid-Encapsulated Czochralski Method
Vertical Gradient Freeze Method
Molecular Beam Epitaxy
Metal-Organic Vapor Phase Epitaxy
Other Methods
GaAs Market Breakdown by Application
Mobile Devices
Photovoltaic Devices
Wireless Communications
Optoelectronic Devices
Aerospace and Defense Applications
Other Applications

Chapter 7 Market Breakdown by Diamond Semiconductor Substrate

Diamond Semiconductor Substrate Market by Type
Natural Diamond
Synthetic Diamond
Diamond Semiconductor Substrate Market by Application
Healthcare Applications
Consumer Electronics
Construction and Mining Applications
Other Applications

Chapter 8 Market Breakdown by Region

North America
Europe
Asia-Pacific
Latin America
Rest of the World

Chapter 9 Analysis of Market Opportunities

Development of 5G and Automotive Technology as Drivers of the GaN and SiC Markets
Huge Opportunities Offered by Diamond
Growth Opportunities Offered by the Oil and Gas Industry
Untapped Opportunities in Developing Countries
Market Share Analysis

Chapter 10 Patent Review and New Developments