DUBLIN, Nov. 19, 2015 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/cqmpbr/global_organic) has announced the addition of the "Global Organic Substrate Packaging Material Market 2015-2019" report to their offering.
The global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.
This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market.
The growing demand for system integration, cost benefits, and complete system configuration will propel the growth of SiP during the forecast period. SiP dies can be stacked either vertically or horizontally, and they are connected to bonding wires and solder bumps.
Apart from multiple ICs of different functionalities, it can contain passive components such as MEMS, mechanical parts, filters, and connectors in a single package. This ensures that the package functions as a motherboard, a sub-system in itself. They are implemented in RF and wireless devices like cellular phones, Bluetooth devices, and modems.
According to the report, LTE 4G network requires base station system on chip (SoC), which doubles the performance of LTE and reduces power consumption. SoC integrates all the components of a circuit on a single chip. It uses IC substrate chips as the base on which the circuit is built. It is available in ball grid packages.
SoC has low manufacturing costs because of the presence of fewer packages than multichip systems, and the packaging is simple. Base stations can handle the immense amount of traffic in 4G network only with the use of SoC. Thus, the use of SoC in LTE network is increasing the demand for IC substrate chips, thereby driving the growth of the market.
Further, the report states that the market is dependent on performance of global semiconductor equipment industry.
- ASE Kaohsiung
- Mitsubishi Gas Chemical
- STATS ChipPAC
Key Topics Covered:
Part 01: Executive summary
Part 02: Scope of the report
Part 03: Market research methodology
Part 04: Introduction
Part 05: Market landscape
Part 06: Market segmentation by packaging technology
Part 07: Geographical segmentation
Part 08: Key leading countries
Part 09: Market drivers
Part 10: Impact of drivers
Part 11: Market challenges
Part 12: Impact of drivers and challenges
Part 13: Market trends
Part 14: Vendor landscape
Part 15: Key vendor analysis
Part 16: Appendix
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SOURCE Research and Markets