The global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based. The report also includes a discussion of the key vendors operating in this market.
Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties.
Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.
Market Challenges, Drivers and Trends
The semiconductor industry is facing many changes in technology, including the introduction of 3D ICs, including 3D NAND, FinFETs, and stacked dies. The increase in demand for multifunctional and high-performance ICs in electronic devices is driving the need for regular technological upgrades. 3D ICs are an ideal solution to meet the growing demand for smaller and higher-performance ICs in the consumer electronics segment. 3D NAND is another technology that provides a large memory storage area in minimal space; this technology will likely capture 54.82% of the total NAND market by the end of 2020.
According to the report, the demand for polymer adhesive wafer bonding equipment is rising due to the increasing adoption of advanced packaging applications like TSV, 2.5D and 3D ICs, stacked die packaging, and MEMS packaging. Polymer adhesive wafer bonding equipment provides reliable thinning and backside processing of the stacked dies. In addition, it lowers the cost of TSV (through-silicon via) integration. The rising demand for polymer adhesive wafer bonding equipment will, therefore, have a moderately high impact on the market for semiconductor devices as this equipment supports 3D packaging, which is the future of the semiconductor packaging and assembly industry.
Further, the report states that the currency fluctuation in countries such as China and Japan negatively effects the growth of semiconductor packaging materials market