NEW YORK, April 24, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
The Global Ingot and Wafer market has witnessed significant changes during the last few years due to worldwide financial turmoil and pricing decreases of solar modules. As a result, many manufactures have reduced their production, while a few manufactures have managed to sustain their status. Despite of these adverse circumstances, the future market outlook, on the contrary, appears to be progressive because of advancements in innovative solar technologies, increases in government funding and favourable policies, intensives and overall competitive advantages compared to other energy sources. Considering this plethora of market trends and political and economic factors, who has been able to survive? Who are the frontrunners and who had been pushed out of the competition?
To help unravel the answers to these questions, ENF is ready to offer its 1st edition of Global Ingot and Wafer Manufactures Report, which provides detailed insight into the market.
The total data collection process has taken 6 man-months, concluding February 2012. Since then, we have been rigorously conducting quality checks to ensure our status as the most accurate and trustworthy source of PV information on the market.
• 289 Ingot manufacturers
• 258 Wafer manufacturers
• Market trends - price, capacity and production
• Individual company profiles
• Equipment data collected
•Materials data collected
289 ingot manufacturers included in the survey
ENF collected production and capacity data from 205 companies
Equipment data has been collected from 242 companies
Material data has been collected from 189 companies
258 wafer manufacturers included in the survey
ENF collected production and capacity data from 181 companies
Equipment data has been collected from 227 companies
Material data has been collected from 138 companies
Detailed information collected, analysed and presented in an Excel file
Company basic info
Company Vertical Integration Information
Ingot or wafer production
Ingot and wafer technology
Capacity: Data spanning the years 2004 to 2012
Production: Data spanning the years 2004 to 2012
Diameter of ingots produced: Data spanning the years 2005 to 2012
Wafer thickness: Data spanning the years 2005 to 2012
Saw wire thickness: Data spanning the years 2005 to 2012
Ingot production equipment brand, model and numbers: Details of production equipment used for sorting, growing, testing and other processes.
Wafer production equipment brand, model and numbers: Details of production equipment used for cutting, grinding, slicing, cleaning, testing and other processes.
Ingot production materials brand and proportion: Polysilicon and quartz crucible.
Wafer production materials brand and proportion: Saw wire, Silicon carbide and cutting liquid.
Capacity definition details: The amount that can be achieved at most based on their factory conditions (including all factors that could possibly affect the production) at the end of the year.
Company key contacts: Contact details and languages spoken for: CEO, Purchasing director, Sales director, and Plant manager.
Background information on each company (when they were founded, when they started producing ingots/wafers etc.
Miscellaneous extra information on each company obtained from telephone interviews.
Company Background Information
Vertical integration chart showing areas of the PV industry the company operates in.
Company founding time and producing time.
Company key contact details and languages spoken (CEO, Purchasing director, Sales director and Plant manager).
Ingot capacity (2004 to 2012) and the proportion of mono and poly.
Ingot production (2004 to 2012) split into internal usage for panel production and external sale to other manufacturers.
Ingot size (2005-2012).
Production equipment details. Brand, model and number of pieces (sorting equipment, growing furnaces, testers/sorters)
Production raw material details. Brand and proportion (polysilicon and quartz crucible)
Wafer Capacity (2004 to 2012)
Wafer Production (2004 to 2012), including the proportion of different types(e.g. Mono 125mm*125mm and poly 156mm*156mm)
Saw wire thickness(2005-2012)
Production equipment details. Brand, model and number of pieces (cutting machine, grinding machine, slicing machine, cleaning machine and testers etc.)
Production raw material details. Brand and proportion (saw wire, silicon carbide and cutting liquid)
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