Global System-On-A-Chip Industry

Mar 16, 2011, 16:37 ET from Reportlinker

NEW YORK, March 16, 2011 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Global System-On-A-Chip Industry

http://www.reportlinker.com/p0397779/Global-System-On-A-Chip-Industry.html

This report analyzes the worldwide markets for System-On-A-Chip (SoC) in US$ Million. The global market is analyzed for following end-use segments– Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The report also analyzes the global market for SoCs by the following two major types- SoCs Based on Standard Cell, and SoCs Based on Embedded IP. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2007 through 2015. Also, a six-year historic analysis is provided for these markets. The report profiles 189 companies including many key and niche players such as Actel Corporation, Altera Corporation, ARC International, ARM Holdings, Broadcom Corporation, Core Logic, Freescale Semiconductor, GCT Semiconductor Inc., Infineon Technologies, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Matsushita Electric Industrial Co., Ltd, Mentor Graphics Corporation, NEC Electronics Corporation, NVIDIA Corporation, ON Semiconductors Corporation, Palmchip Corporation, Provigent, Inc., Renesas Technology Corp., Samsung Electronics Co., Ltd., STMicroelectronics N.V., Synopsys Inc., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments, Toshiba America Electronics Components, Xilinx, Inc., Zilog Inc., and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

SYSTEM-ON-A-CHIP MCP-1471

A GLOBAL STRATEGIC BUSINESS REPORT

CONTENTS

1. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS 1

Study Reliability and Reporting Limitations 1

Disclaimers 2

Data Interpretation & Reporting Level 3

Quantitative Techniques & Analytics 3

Product Definitions and Scope of Study 3

2. INDUSTRY OVERVIEW 5

Semiconductor and IC Industry: A Rudimentary Overview 5

Developments in ICs Over the Years 5

System-on-A-Chip (SoC): A Major Breakthrough in Semiconductor

Industry 6

Market Overview 6

Increasing Need for Compactness and High Speed Performance -

Rationale for Adoption of SoCs in Electronics Industry 7

Current Market Scenario 7

Instability of the Chip Industry Echoes Downstream Into the

SoC Market 7

Recovery Gets Underway 8

Post Recession Opportunities in Key End-Use Sectors 9

Outlook 9

Computers and Consumer Electronics - Primary Revenue

Contributors 10

Use of SoCs in Communication Equipment Gains Traction 10

Wide Application of SoCs in Mobile Phones and Broadband

Networks 11

SoCs Market Embracing New Changes in Design Methodology 11

Developments in Multiple Systems-on-a-Chip Augurs Well for SoC

Market 11

Key Growth Drivers 12

New End-Use Devices Spark Up SoCs Market 12

Standardization to Drive the Market 12

Innovations to Drive Growth 13

Advent of Three-Dimensional Chips to Boost the Market 13

Appeal of 3D Chip Soars Among End-Use Sectors 14

Competitive Overview 14

Historic Statistical Findings: A Review 15

Table 1: Global Hard Disk Drives (HDD) SoCs Market (2005):

Market Share Breakdown by Company for Agere, Marvell and

STMicroelectronics (includes corresponding Graph/Chart) 15

Table 2: Global Programmable Logic Device (PLD) Market

(2005): Percentage Share Breakdown by Company for Xilinx,

Altera and Others (includes corresponding Graph/Chart) 15

3. MARKET TRENDS & CHALLENGES 16

Increasing Usage of SoC Solutions in Medical Field 16

Growing Demand for 90-nm Technology 16

Customization to Meet Client's Requirements 16

Customizable Analog IPs Add New Dimension to Complex SoCs 17

Embedded Software to Power System-on-a-Chip (SoC) Solutions 17

Advanced ESL Design-for-Verification Solution to Reduce

Verification Time for Complex SoCs 18

Dual-Core Processors Gain Ground 18

SoC IP Designs Witness Rising Demand 18

ASIC Designs for Supersystems Make a Foray 19

Development of IP Market 19

Emergence of System-above-Chip (SaC) Market 19

Advent of Lab-on-a-Chip (LoC) Technology 20

Development of Reusable IPs 20

Innovations Address Power Leakage and Multiple Tasks Handling 20

Multi-Tasking Microprocessors Gain Significance 21

EDA and Silicon Intellectual-Property (IP), Two Burgeoning

Sectors 21

FPGA Makes Inroads in the Semiconductor Chips Market 22

Development of Premanufactured ASICs, and Flash-and SRAM-

Series of FPGAs 22

Innovative Design Configuration of FPGAs 22

Emergence of Three-Tier Design Approach of FPGA-Based Chips 23

Evolution of System-On-A-Programmable Chip (SOPC) 23

Standard Logic and Interface Equipment Prevails 23

Compact Size of Logic Devices Favors Growth 24

Key Challenges 24

High Costs, a Major Deterrent 24

Time-to-Market Pressures 25

Verification Challenges 25

Testers - A Solution to the Challenge 26

IP Compatibility Issue 27

Issues Related to Marketing of ICs 27

Customer & Software Support and Staffing Challenges 27

System-in-Package (SiP) : A Potential Threat to System-on-a-Chip 28

SiP Market 28

4. SEMICONDUCTOR INDUSTRY OVERVIEW 29

Global Semiconductor Industry - An Overview 29

The Moore's Law Gives Rise to Sophisticated, Faster and

Cheaper Chips 29

Technology Advancements Provide Necessary Impetus 29

Semiconductor Industry by Geographic Markets 29

Asia and the US - Two Major Semiconductors Market 29

Leading Semiconductor Players 30

Table 3: World Market for Semiconductors (2009): Breakdown of

Revenue of Top 20 Players (In US$ Billion) (includes

corresponding Graph/Chart) 30

Table 4: Global Semiconductors Market (2008): Percentage

Market Share Breakdown by End-Use Segment (includes

corresponding Graph/Chart) 31

MEMS Market 31

5. PRODUCT OVERVIEW 32

SoC - Emerging Technology in the Global Semiconductor Industry 32

Components of SoC 32

System-on-a-Chip (SoC) Block Diagram 32

SoC Design Benefits 33

"Second-Generation" SoCs 33

ASIC SSOC - A New Dimension 33

SoC Device Types 33

Standard Cells 33

Embedded IP 34

Micro Logic IP 34

Memory IP 34

ASIC/PLD IP 34

Analog IP & Other Components 34

Standards For SOCs 34

SoC Processor Types 35

Soft Instruction Processors 35

Configurable Processors 35

Total Design Strategies for SoC 35

Architecture Strategy 36

Design-for-Test Strategy 36

Validation Strategy 36

Synthesis and Back-End Strategy 36

Integration Strategy 37

6. SOC END-USE APPLICATIONS 38

Computers 38

Communications Equipment 38

Consumer Electronics Devices 38

Automotive Applications 38

Others 39

Industrial Automation & Military 39

Medical & Office Devices 39

CRM and Hearing Aid Products Dominate the Category 39

New Mixed-Signal Radio-Frequency (RF) Technology Design 40

SoC-Equipped Nanorobots 40

7. SOC INTELLECTUAL PROPERTY (IP) 41

Interconnect - A Growing Sector of Semiconductor IP Market 41

8. SOC TECHNOLOGICAL DEVELOPMENTS BY SELECT MARKET PLAYERS 42

System-on-a-Chip (SoC) for Printers 42

W-OFDM-SoCs 42

Xilinx® Virtex™ FPGAs and Embedded Solutions 42

EPON-Based System-on-a-Chip (SoC) 43

RapidChip® SoC Prototyping Platform 43

Analog Devices Othello-E Transceiver 43

True System-on-a-Chip (SoC) 44

9. PRODUCT DEVELOPMENTS & LAUNCHES 45

Fujitsu Unveils Three SoC Products 45

Texas Instruments Develops SoC Architecture Based on Multicore

DSPs 45

Broadcom Launches New Bluetooth SoC Solution 46

Triad Semiconductor Unveils Mocha-1™ Line of SoCs 47

Broadcom Releases High Definition Cable Converter Box 48

STMicroelectronics Unveils STi7108 System-on-Chip 48

DesignArt Unveils DAN3000 System-on-Chip Platform 49

Freescale Unveils i.MX508 Application Processor to Support

eReaders 50

Digi Releases Rabbit 6000 51

GlobalFoundries Releases SoC Platform Jointly with ARM 51

CSEM Introduces Customized SoC with Integrated DSP 52

Broadcom Rolls Out Foremost DTA SoC Solution 52

NEC Electronics to Launch Camera Engine 151 SoC 53

Scintera Networks Launches SC1887: Adaptive RFPAL System-on-Chip 54

Actions Semiconductor Launches Series 25 Product Range 55

ChipWrights Unveils CW5631 SoC Based Hardware Development Kit 55

Multi-Protocol, Multi-Rate PHY Offered as Single SoC Solution 56

Conexant Unveils SoC Solution CX92137 57

AppliedMicro Launches APM 83290 SoC 57

Ambarella Introduces A5s SoC 59

Silicon Laboratories Releases EZRadio Wireless IC Solution 59

Savi Technology Launches RFID SoC 60

DiBcom Releases Tuner-Demodulator SoC for DVB-T and ISDB-T 61

Sigma Releases SMP8656 Media Processor SoC 61

Dust Networks Launches ARM Cortex-M3 Processor 61

Teridian Launches 6618 Energy Measurement SoC 62

DesignArt Launches DAN3000 SoC Series 63

Broadcom Unveils WLAN Router SoC Solutions 64

Cavium Networks Introduces PureVu Family of Single-Chip Video

Processors 65

Broadcom Introduces SoC Solutions for Digital TV Transmission

in Japan 65

IMEC Announces Tools to Optimize MPSoC Design Platforms 66

Maxim Integrated Products Rolls Out MAXQ7667 Microcontroller 66

Creative Introduces ZiiLABS ZMS-05 67

Xilinx Introduces Innovative Development Kits 68

Symwave Develops Single Chip USB 3.0 SW6316, a Storage Controller 69

Broadcom Introduces MoCA-integrated SoCs in the US Market 70

ViXS Systems Plans to Integrate CryptoFirewall Security into

XCode 4000 Array 70

NEC Electronics Releases Universal Serial Bus 3.0 SoC Design 71

Broadcom Launches Multi-Format HD STB SoC Solution 71

Aptina Unveils SoC Image Sensor 72

Broadcom Unveils PND on a Chip SoC BCM4760 73

Sequans Communications Launches SQN1220 73

Atheros Communications Introduces Combined WLAN and Bluetooth

Connectivity 74

GCT Semiconductor Rolls Out GDM7205 Single Chip Mobile WiMAX

Solution 74

Intel Plans to Debut 32-nm Westmere Chips 75

Avnera Introduces AudioMagic 2G 76

Magma Unveils RTL-to-GDSII Reference Flow for POWERVR SGX

Graphic Accelerator Cores 76

Cyprus Introduces CY8C28xxx PSoC 1 77

MosChip Unveiled System-on-a-Chip (SoC) Processor 78

Freescale Releases MPC8536E PowerQUICC III Processor 79

Intel Introduces CE3100 Processor 79

Intel Introduces EP80579 SoC 80

Samsung Electronics Launches S5K4AW CMOS Image Sensor 80

Win Enterprises Introduces Two New Network Platforms with

Intel SoC 81

Panovasic Develops a New System-on-Chip, Apollo I 81

austriamicrosystems Rolls Out a New SoC Magnetic Rotary Encoder 82

Cypress Launches a New PSoC NV Series 83

Neotion Unveils a New Common Interface (CI) Module Range 83

Intel Unveils Intel Media Processor CE 3100 83

Broadcom Launches BCM3545 DTA SoC Solution 84

Eurotech Introduces Eurotech A3pci8024 85

CPU Technology to Launch Acalis CPU872 SoC with Embedded DRAM,

Tamper Protection 85

picoChip Unveils PC3xx SoC Range for the Femtocell Sector 86

Samsung Unveils Processors for Digital Photo Frames 86

Marvell Launches New SoC Devices, Marvell® 88F6000 Series 87

Ralink to Introduce New PHY and Ethernet Switch Integrated AP

/Router SoC 88

NEC Introduces New EMMA SoCs with In-Built Advanced H.264 VCS

Support 88

Freescale Semiconductor Launches New Highly Integrated Two-

Core SoC Device 89

Novelics Unveils One-Transistor SRAM for SoC Designers 90

Emerson to Roll Out a Single-board Computer with Dual-Core

PowerPC 90

ON Semiconductor Expands IP with Several New IP Blocks 91

GE Fanuc Unveils a New SoC-Based Multicomputer 91

Mindspeed Introduces Comcerto 300 Series of Access VoIP

Processors 92

Samsung to Deploy PO4010 Image Sensors in Portable Camera

Handsets 92

Magnum Semiconductor Releases ZV1050 Multimedia Application

Processor 93

Broadcom Unveils Advanced Encoder/Transcoder SoC Solution 94

Broadcom Showcases High Definition Set-Top Box System-on-a-Chip 94

Broadcom Unveils a Single Chip DBS Set-Top-Box Solution 94

GCT Semiconductor Unveils SoC Solution Supporting WiMAX and

WiFi Functionality 94

Infineon Releases CAT-iq™ Wireless Engine 95

Broadcom Showcases a Whole New Range of SoC Solutions for

Mobile Devices 95

NVIDIA Introduces an Innovative Applications Processor 95

Samsung Introduces Single-Chip Decoder 95

Toshiba Introduces SoC Solution for ATSC LCD HDTVs 95

Broadcom Uncovers Reference Design Platform for HD Optical

Disc Players 96

Broadcom Introduces Digital-to-Analog Adapter 96

STMicroelectronics Introduces 'ST21NFCA' - SoC Solution for

the NFC Market 96

Broadcom Unveils SoC Solutions for the Mobile TV Market 96

New Series of IC Tuners from Infineon 96

TI Integrates Bluetooth®, FM and GPS Technologies on to a

Single Chip 97

STMicroelectronics Releases Bluetooth® and FM-Radio SoC Solution 97

Upgraded Version of 90-Nanometer Reference Flow from SMIC and

Synopsys 97

Syntax-Brillian Opts Digital TV SoC Solution from Broadcom 97

Broadcom Showcases BCM7400B SoC 97

Marvell Introduces Bluetooth Single-Chip Solution 98

D2 Technologies Unveils Embedded VoIP Software 98

Broadcom Rolls Out the New BCM4325 Single-Chip 98

Westinghouse Digital Selects BCM3560 SoC Solution 98

Broadcom Releases the BCM7118 Single Chip 98

Infineon Launches 3G ADSL2+ SoC 99

ARC International Launches New VRaptor™ Media Architecture 99

MOSAID Rolls Out Memorize™ and Fractional-N PLL 99

Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers 99

Alvand Technologies Unveils SoC Humming-B™ Family of Tuners 100

MagnaChip Releases MC531EA SoC Imaging Solution 100

Genesis Microchip Unveils the Chaplin DTV family of ICs 100

PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design

Solution 100

STMicroelectronics Unleashes the SPEAr Head600 and SPEAr

Plus600 ICs 100

CAST, Inc. Rolls Out the SoC Kernels 100

ARM and Northwest Logic's PCI-SIG-compliant solution 101

Cypress Releases The PSoC Express 2.1 101

Texas Instruments Unveils Single-Chip NaviLink™ 5.0 Solution 101

Sonics Launches New Version of SonicsMX® SMART Interconnect™

Solution 101

SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip 101

10. RECENT INDUSTRY ACTIVITY 102

Ralink Merges Operations with TrendChip 102

Broadcom Partners with Skyworth-Hitune 102

Broadcom Acquires Teknovus 103

Carbon Design Teams Up with VeriSilicon 103

austriamicrosystems Broadens Use of Cadence Technology 103

SiS Selects Cadence Design Systems 104

Renesas Electronics America Begins Operations as Subsidiary of

Renesas Electronics 105

Novatek Chooses Tensilica HiFi Audio Frequency DSP 105

Arrow Electronics Takes Over ETEQ Components 106

MIPS Technologies Joins Forces with Tensilica 106

CoWare and Tensilica Collaborate 107

Marvell and E Ink Announce the Availability of Marvell®

ARMADA™, 166E Application Processor 107

Virage Logic Announces Acquisition of NXP's Horizontal CMOS

Semiconductor IP Rights and Development Team 108

Virage Logic Announces Purchase of ARC International 109

Sigma Designs to Take Over Coppergate Communications 109

CoWare and ARM Collaborate 110

Cadence Inks Collaboration Agreement with ARM 111

Samsung Electronics and Sigma Designs Collaborate 112

Entropic and ViXS Systems Collaborate to Develop HD NAS

Reference Design 112

BroadLight, Jungo Announce Partnership for GPON Residential

Gateway Reference Platform 113

Entropic and Intel Digital Home to Announce Collaboration 114

MosChip and IdealBT Sign Technology Partnership 114

UEI Acquires Universal Remote Control Software Technology and

Associated Assets from Zilog 115

Synopsys Acquires CHIPit Business Division of ProDesign 116

Mentor Graphics Takes Over LogicVision 116

Fujitsu to Use Atrenta's SpyGlass-CDC Product to Reduce Design

Risks 116

ZF Micro and Chip-1 Exchange Signs Distribution Agreement 117

eSilicon Associates with SiCortex for HPC Products 118

Arrow Electronics Takes Over Excel Tech 118

Comtrend Deploys BL2348 GPON RG SoC Solution of BroadLight 118

ARM Inks Technology Licensing Agreement with Toshiba 119

ARC Inks Licensing Agreement with TM Technology 119

Elpida Memory Inks Partnership Agreement with UMC 120

Silvus Technologies Inks Partnership Agreement with Ittiam

Systems 120

China Digital TV Inks Collaboration Agreement with Intel 121

NextWave Wireless and Huawei Collaborate 121

Teradyne Acquires Eagle Test 123

Billion Electric Deploys BroadLight BL2348RGSoC Solution 123

Sigma Designs Inks Collaboration Agreement with Microsoft 123

Broadcom Acquires DTV Business of AMD 125

Arkados and STMicro Enters into Agreement to Produce HomePlug

AV SoC 125

Airtel Selects Broadcom to Introduce DTH TV Service 126

GainSpan Enters into Strategic Partnership with Ekahau 126

NEC Signs Agreement with IBM 126

Intel Enters into Partnership with Yahoo 127

Mindspeed Technologies Forms Alliance with ARM 127

Gennum Takes Over ASIC Architect 127

DSP Group Licenses VoStoc from SPIRIT DSP 128

Pixelplus Signs Agreement with KC Uppertech 128

Wasion and Teridian Enter into an Alliance 128

ON Semiconductor Acquires AMI Semiconductor 128

Broadcom Takes Over Sunext Design 129

Broadcom Collaborates with Microsoft 129

Broadcom Along with Coship Provides HD Set-Top Box Solution in

China 129

Zilog Signs Distribution Agreement with Nu Horizons 129

BroadLight partners with ITRI 130

ARC Extends Collaboration Agreement with Toshiba 130

Samsung Uses Integrated FM Radio and Bluetooth® SoC from Broadcom 130

NEC Opts Wipro to Provide Semiconductor Design Solutions 130

Axiom Invests US$3 Million for New R&D Center in India 130

Matsushita Implements IC Compiler of Synopsys 130

EtherWaves Acquires Sonarics 131

Silicon Image Acquires sci-worx 131

Cortina Systems Acquires ImmenStar 131

Wipro Acquires OTCS 131

Synopsys Acquires MOSAID IP Assets 131

BroadLight Collaborates with OpenCon Systems 132

Mindspeed Partners with Terawave 132

IC Nexus Partners with HDL Design House 132

Global Unichip Allies with Vivante Graphics 132

Jazz and Fujitsu Join Forces 132

Coronis Systems Partners with Essensium N.V. 132

Global Unichip Opts Testing Solution from Synopsys 133

Core Logic to Establish Solution Center in China 133

Newark Signs Franchise Agreement with Cypress 133

Silicon Image Signs an Accord with Sunplus 133

ARC Signs Multiple Agreements 133

Global IP Sound Changes to Global IP Solutions 133

Faraday Forms an Alliance with Palmchip Corporation 134

CAST Enters into a Distribution Agreement with S2C 134

Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee®

Chipset by 2008 134

Renesas Enters into an Agreement with Key Stream Corporation 134

Renesas and Matsushita into their Fifth Stage of Collaboration 134

Renesas Employs Synopsys' VCS Verification Solution and VMM

Methodology 134

Renesas Adopts Synopsys' IC Compiler Solution 135

S2C Inc. is Tensilica® Inc.'s New Prototyping Partner in China 135

Sonics Inc.® Enters into an Agreement with Ricoh Company 135

MoSys Adopts SMIC's CMOS Process Technology 135

e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors 135

Haier Group Adopts Broadcom's Digital TV System-on-Chip Solution 136

11. FOCUS ON SELECT PLAYERS 137

Microsemi SoC Products Group (US) 137

Altera Corporation (US) 137

ARM Holdings Plc (UK) 137

Broadcom Corporation (US) 138

CoreLogic, Inc (South Korea) 138

Freescale Semiconductor, Inc. (US) 138

GCT Semiconductor Inc. (US) 139

Infineon Technologies AG (Germany) 139

Intel Corporation (US) 139

LSI Corporation (US) 140

Marvell Technology Group Ltd. (US) 140

Panasonic Corporation (Japan) 141

Mentor Graphics Corporation (US) 141

Renesas Electronics Corporation (Japan) 142

NVIDIA Corporation (US) 142

Palmchip Corporation (US) 142

Provigent Inc. (US) 143

Samsung Electronics Co., Ltd. (South Korea) 143

STMicroelectronics N.V. (Switzerland) 144

Synopsys, Inc. (US) 144

Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) 145

Texas Instruments Inc (US) 145

Toshiba America Electronics Components, Inc (US) 145

Xilinx Inc. (US) 146

Zilog Inc. (US) 146

ON Semiconductors Corporation (US) 146

Ziptronix, Inc. (US) 147

12. GLOBAL MARKET PERSPECTIVE 148

Global Market for System-on-a-Chip (SoC) by Geographic Region 148

Table 5: World Recent Past, Current & Future Analysis for

System-on-a-Chip (SoC) by Geographic Region/Country - US,

Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and

Rest of World Markets Independently Analyzed with Annual

Sales Figures in US$ Million for Years 2007 through 2015

(includes corresponding Graph/Chart) 148

Table 6: World Historic Review for System-on-a-Chip (SoC) by

Geographic Region/Country - US, Canada, Japan, Europe,

Asia-Pacific (Excluding Japan) and Rest of World Markets

Independently Analyzed with Annual Sales Figures in US$

Million for Years 2001 through 2006 (includes corresponding

Graph/Chart) 149

Table 7: World 11-Year Perspective for System-on-a-Chip (SoC)

by Geographic Region/ Country - Percentage Breakdown of

Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific

(Excluding Japan) and Rest of World Markets for 2005, 2010

and 2015 (includes corresponding Graph/Chart) 150

Global Market for System-on-a-Chip (SoC) by Product Type 151

Table 8: World Recent Past, Current & Future Analysis for

System-on-a-Chip (SoC) by Product Type - SoCs Based on

Standard Cell and SoCs Based on Embedded IP Markets

Independently Analyzed with Annual Sales Figures in US$

Million for Years 2007 through 2015 (includes corresponding

Graph/Chart) 151

Table 9: World Historic Review for System-on-a-Chip (SoC) by

Product Type - SoCs Based on Standard Cell and SoCs Based on

Embedded IP Markets Independently Analyzed with Annual Sales

Figures in US$ Million for Years 2001 through 2006 (includes

corresponding Graph/Chart) 152

Table 10: World 11-Year Perspective for System-on-a-Chip

(SoC) by Product Type - Percentage Breakdown of Dollar Sales

for SoCs Based on Standard Cell and SoCs Based on Embedded IP

Markets for 2005, 2010 and 2015 152

Global Market for System-on-a-Chip (SoC) by End-Use Application 153

Table 11: World Recent Past, Current & Future Analysis for

System-on-a-Chip (SoC) by End-Use Application - Computers,

Communications Equipment, Consumer Electronics Devices,

Automotive Applications and Other Markets Independently

Analyzed with Annual Sales Figures in US$ Million for Years

2007 through 2015 (includes corresponding Graph/Chart) 153

Table 12: World Historic Review for System-on-a-Chip (SoC) by

End-Use Application - Computers, Communications Equipment,

Consumer Electronics Devices, Automotive Applications and

Other Markets Independently Analyzed with Annual Sales

Figures in US$ Million for Years 2001 through 2006 (includes

corresponding Graph/Chart) 154

Table 13: World 11-Year Perspective for System-on-a-Chip

(SoC) by End-Use Application - Percentage Breakdown of Dollar

Sales for Computers, Communications Equipment, Consumer

Electronics Devices, Automotive Applications and Other

Markets for 2005, 2010 and 2015 (includes corresponding

Graph/Chart) 155

13. THE UNITED STATES 156

A.Market Analysis 156

Rise in SoC End-Use Sectors Drives the Growth 156

Technological Innovations Add to Growth 156

The U.S. Companies Follows Outsourcing Strategy to Reduce Costs 156

Semiconductors Market in North America 156

Focus on Select Players 157

ARM-US 157

Atmel Corporation 157

AXIOM Design Automation, Inc 157

BroadLight, Inc. 157

Cadence Design Systems, Inc 158

Conexant Systems, Inc 158

CPU Technology, Inc 158

Cypress Semiconductor Corporation 158

Enpirion Inc. 159

Eureka Technology, Inc. 159

Fujitsu Semiconductor America, Inc. 159

IBM Microelectronics 159

Magma Design Automation, Inc 160

Mindspeed Technologies, Inc. 160

MIPS Technologies Inc. 160

Motorola 160

National Semiconductor Corporation 161

Renesas Electronics America Inc. 161

NeoMagic Corporation 161

Bay Microsystems Inc 162

PMC-Sierra Inc. 162

S2C Inc. 162

Sonics, Inc 163

Wipro Technologies 163

Major End-Users 163

RF Micro Devices Inc 163

SanDisk Corp. 164

B.Market Analytics 164

Table 14: US Recent Past, Current & Future Analysis for

System-on-a-Chip (SoC) Market with Annual Sales Figures in

US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 164

Table 15: US Historic Review for System-on-a-Chip (SoC)

Market with Annual Sales Figures in US$ Million for Years

2001 through 2006 (includes corresponding Graph/Chart) 165

14. CANADA 166

Market Analysis 166

Table 16: Canadian Recent Past, Current & Future Analysis

for System-on-a-Chip (SoC) Market with Annual Sales Figures

in US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 166

Table 17: Canadian Historic Review for System-on-a-Chip

(SoC) Market with Annual Sales Figures in US$ Million for

Years 2001 through 2006 (includes corresponding Graph/Chart) 166

15. JAPAN 167

A.Market Analysis 167

SoC Market Overview 167

An Overview of Japanese Semiconductor Market 167

Consumer Profile 167

Foreign Players Tie-Up with Local Fabricators and Vendors 167

Local Companies Expand Customer Base 167

Growth in IC Sector 168

Hitachi, Ltd. - A Select Player 168

B.Market Analytics 169

Table 18: Japanese Recent Past, Current & Future Analysis

for System-on-a-Chip (SoC) Market with Annual Sales Figures

in US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 169

Table 19: Japanese Historic Review for System-on-a-Chip

(SoC) Market with Annual Sales Figures in US$ Million for

Years 2001 through 2006 (includes corresponding Graph/Chart) 169

16. EUROPE 170

A.Market Analysis 170

Current & Future Analysis 170

Market Trends 170

SoC Deployment Rises for the Automotive and the

Communications Sector 170

Demand for Pre-Configured Functional IP Blocks Rising 170

Subcontracting Increases for Final SoC Products Assembly to

Low-Cost European Countries 171

Semiconductors Market Overview 171

Focus On Select Players 171

Essensium NV (Belgium) 171

Renesas Electronics Europe GmbH (Germany) 171

Nordic Semiconductor (Norway) 172

B.Market Analytics 172

Table 20: European Recent Past, Current & Future Analysis

for System-on-a-Chip (SoC) Market with Annual Sales Figures

in US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 172

Table 21: European Historic Review for System-on-a-Chip

(SoC) Market with Annual Sales Figures in US$ Million for

Years 2001 through 2006 (includes corresponding Graph/Chart) 173

17. ASIA-PACIFIC 174

A.Market Analysis 174

SoC Market Overview 174

Asia Emerges as a Major Market for SoC Deployment in

Wireless Devices 174

China 174

India 175

Overview on Semiconductor Industry 175

SoC Market 175

From Just Design to Complete Solutions 175

Challenges Faced 176

South Korea 176

Korean SoC Market on a Rise 176

Integrated Circuits (ICs) Market 177

Focus On Select Players 177

5V Technologies Taiwan, Ltd (Taiwan) 177

Dongbu HiTek Company Ltd. (South Korea) 177

EE Solutions, Inc (Taiwan) 178

Faraday Technology Corporation (Taiwan) 178

Global Unichip Corporation (Taiwan) 178

Hynix Semiconductor Inc (South Korea) 178

IC Nexus Co., Ltd (Taiwan) 179

Silicon Motion Technology Corp. (Taiwan) 179

Silterra Malaysia Sdn. Bhd. (Malaysia) 179

United Microelectronics Corp. (Taiwan) 179

B.Market Analytics 180

Table 22: Asia-Pacific Recent Past, Current & Future

Analysis for System-on-a-Chip (SoC) Market with Annual Sales

Figures in US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 180

Table 23: Asia-Pacific Historic Review for System-on-a-Chip

(SoC) Market with Annual Sales Figures in US$ Million for

Years 2001 through 2006 (includes corresponding Graph/Chart) 180

18. REST OF WORLD 181

Market Analysis 181

Table 24: Rest of World Recent Past, Current & Future

Analysis for System-on-a-Chip (SoC) Market with Annual Sales

Figures in US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 181

Table 25: Rest of World Historic Review for System-on-a-Chip

(SoC) Market with Annual Sales Figures in US$ Million for

Years 2001 through 2006 (includes corresponding Graph/Chart) 182

COMPETITIVE LANDSCAPE

Total Companies Profiled: 189 (including Divisions/Subsidiaries - 211)

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Region/Country Players

------------------------------------------

The United States 135

Canada 5

Japan 16

Europe 21

France 2

Germany 2

The United Kingdom 7

Rest of Europe 10

Asia-Pacific (Excluding Japan) 31

Middle-East 3

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: Global System-On-A-Chip Industry

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