Global Wafer Level Packaging Inspection Systems Market 2014-2018

DUBLIN, April 25, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/3p5zhz/global_wafer) has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018" report to their offering. 

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The short replacement cycle of portable electronic devices is a major trend witnessed in the Global Wafer-level Packaging Inspection Systems market. In the current scenario, portable electronic devices such as smartphones and tablets are becoming obsolete within a short period of time. 

The main reason for this is the quick succession of next-version models, which results in consumers replacing older versions of their devices with newer ones. At the present time, the duration of the replacement cycle period is 8-12 months, but it used to be much longer. Therefore, this reduction in the product replacement cycle is fostering the demand for semiconductor wafers for their use in newly launched devices.

According to the report, the growth of the Global Wafer-level Packaging Inspection Systems market is driven by several factors, the most important of which is the rising demand for smartphones and tablets. One of the major reasons for the growing demand for these devices is their increasing adoption in emerging markets. This subsequently creates more demand for semiconductor wafers, thus driving the growth of the Global Wafer-level Packaging Inspection Systems market.

Further, the report states that one of the key challenges in the market is the cyclical nature of the Semiconductor industry. As a result of this, many wafer-level packaging inspection system manufacturers often experience fluctuating revenues, which in turn adversely affects their profitability.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors. 

Key Topics Covered: 

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

04. Market Research Methodology

05. Introduction

06. Market Landscape

07. Geographical Segmentation

08. Key Leading Countries

09. Buying Criteria

10. Market Growth Drivers

11. Drivers and their Impact

12. Market Challenges

13. Impact of Drivers and Challenges

14. Market Trends

15. Trends and their Impact

16. Vendor Landscape

17. Key Vendor Analysis

18. Other Reports in this Series



Companies Mentioned:

• Camtek Ltd.
• KLA-Tencor Corp.
• Rudolph Technologies Inc.
• Topcon Technohouse Corp.

For more information visit http://www.researchandmarkets.com/research/3p5zhz/global_wafer

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

SOURCE Research and Markets