DUBLIN, April 25, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/3p5zhz/global_wafer) has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018" report to their offering.
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The short replacement cycle of portable electronic devices is a major trend witnessed in the Global Wafer-level Packaging Inspection Systems market. In the current scenario, portable electronic devices such as smartphones and tablets are becoming obsolete within a short period of time.
The main reason for this is the quick succession of next-version models, which results in consumers replacing older versions of their devices with newer ones. At the present time, the duration of the replacement cycle period is 8-12 months, but it used to be much longer. Therefore, this reduction in the product replacement cycle is fostering the demand for semiconductor wafers for their use in newly launched devices.
According to the report, the growth of the Global Wafer-level Packaging Inspection Systems market is driven by several factors, the most important of which is the rising demand for smartphones and tablets. One of the major reasons for the growing demand for these devices is their increasing adoption in emerging markets. This subsequently creates more demand for semiconductor wafers, thus driving the growth of the Global Wafer-level Packaging Inspection Systems market.
Further, the report states that one of the key challenges in the market is the cyclical nature of the Semiconductor industry. As a result of this, many wafer-level packaging inspection system manufacturers often experience fluctuating revenues, which in turn adversely affects their profitability.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Key Topics Covered:
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
04. Market Research Methodology
06. Market Landscape
07. Geographical Segmentation
08. Key Leading Countries
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and their Impact
16. Vendor Landscape
17. Key Vendor Analysis
18. Other Reports in this Series
- Camtek Ltd.
- KLA-Tencor Corp.
- Rudolph Technologies Inc.
- Topcon Technohouse Corp.
For more information visit http://www.researchandmarkets.com/research/3p5zhz/global_wafer
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
SOURCE Research and Markets